JP2000133924A - Method and device for loading conductive ball onto substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To precisely load plural conductive balls on the conducted member supply part of a substrate in short time by loading the conductive balls on the preceding substrate in a second station while a first station sets the substrate and takes out the substrate loading the conductive balls. SOLUTION: A substrate chucking means 7 chucks a substrate on a first conveyor 9 and a substrate on a turn table 1, moves rightward and sets them on the turn table 1 on the first conveyor 9, and transfers the substrate on the turn table to a second conveyor 10. In the meantime, one transportation mechanism 11 is a conductive ball loading means 3, which adsorbs the conductive balls B and B by corresponding to the conducted member supply part of the substrate on the number and the positions of the conductive balls and which stands by, loads the balls in the prescribed positions of the preceding substrate on the turn table 1 in a second station. The necessary number of conductive balls can securely be loaded on the prescribed positions of the substrate in short time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus suitable for mounting a plurality of conductive balls such as solder balls on a conductive member supply portion of a substrate.

[0002]

2. Description of the Related Art Conventionally, as one type of such an apparatus, as disclosed in Japanese Patent Application Laid-Open No. 9-298356, a plurality of substrates are linearly and intermittently transported by a carrier, and at the same time, a turntable is used. While transporting the solder ball by a plurality of suction means intermittently turning, during that time,
There is a configuration in which solder balls are mounted on a substrate to increase the production capacity of solder ball mounting.

[0003]

However, even with the conventional mounting apparatus constructed as described above, the productivity is slightly lowered, and a method capable of further increasing the productivity and the appearance of the apparatus have emerged from this type of industry. Had been requested.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for mounting a plurality of conductive balls on a conductive member supply portion of a substrate in a short time and accurately. And to provide the device.

[0005]

According to a first aspect of the present invention, there is provided a method of mounting a conductive ball on a substrate, the method comprising: rotating a plurality of substrates by a rotary table that rotates intermittently in a horizontal plane. While mounting a plurality of conductive balls on the conductive member supply portion of these substrates, wherein the substrate is set on the rotary table at a first station, and a substrate having a preceding conductive ball is mounted. From the turntable, and further,
While the substrate is set in the station and the substrate on which the conductive balls are mounted is taken out, the conductive balls are mounted on the preceding substrate in the second station.

According to a fourth aspect of the present invention, there is provided an apparatus for mounting a conductive ball on a substrate, wherein the plurality of substrates are swiveled by a rotary table which rotates intermittently in a horizontal plane. A rotary table for mounting a plurality of conductive balls on a member supply unit, the rotary table being arranged to be rotatable intermittently in a horizontal plane and rotatingly moving a plurality of substrates set at equal intervals. And the first
A substrate loading / unloading means for setting a substrate on the rotary table at a station and taking out a substrate with a preceding conductive ball mounted thereon, and a conductive ball mounting for mounting a conductive ball on the preceding substrate on the rotary table at a second station; Means.

[0007]

In the apparatus for mounting conductive balls on a substrate according to the fourth aspect, the substrate is set on the rotary table by the substrate loading / unloading means in the first station, and the preceding substrate on which the conductive balls are mounted is rotated. Removing the substrate from the table, setting the substrate on the rotary table in the first station, and mounting the conductive balls on the preceding substrate in the second station while removing the substrate with the conductive balls from the rotary table. Becomes

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described in detail with reference to FIG. The apparatus for mounting conductive balls on a substrate according to the present invention comprises a rotary table 1, a substrate set on the rotary table 1 in a first station, and a substrate on which a preceding conductive ball mounted substrate is removed from the rotary table 1. Loading / unloading means 2; conductive ball mounting means 3 for mounting conductive balls on a substrate on the rotary table 1 at a second station; and between the substrate loading / unloading means 2 and the conductive ball mounting means 3. First and second CCD cameras 4 that are provided to check the position of the substrate
4, 5, and 5.

The rotary table 1 is mounted on the base 6 so as to be intermittently rotatable clockwise by 90 degrees in a horizontal plane by a conventional means (direct drive motor). Further, four sets of fixing mechanisms (not shown) for temporarily fixing the substrate are mounted on the periphery of the upper surface of the turntable 1 at equal intervals.

In the substrate loading / unloading means 2,
A first conveyor 9 in which the substrate suction means 7 is disposed on the left side of the turntable 1 via a guide mechanism 8 to feed the substrate, and a second conveyor 10 which is disposed on the right side of the turntable 1 and feeds the substrate. The substrate suction means 7 simultaneously suctions the substrate on the first conveyor 9 and the preceding substrate with the conductive balls BB on the rotary table 1. Thereafter, the substrate is moved to the right so that the former substrate can be placed on the rotary table 1 and the latter substrate can be placed on the second conveyor 10 at the same time.

The conductive ball mounting means 3 is disposed corresponding to the substrate loading / unloading means 2 with the rotary table 1 therebetween. Further, in the conductive ball mounting means 3, two transfer mechanisms 11 for sucking and transferring a large number of conductive balls BB corresponding to the conductive member supply portion of the substrate in terms of position and number, These two transfer mechanisms 11 are arranged side by side on the base 6.
11 alternately enters and leaves the second station. Then, while one of the transfer mechanisms 11 mounts the conductive balls on the substrate, the other transfer mechanism 11 attracts a large number of the conductive balls BB to a predetermined position. Thus, while the substrate is set on the rotary table 1 in the first station and the substrate on which the preceding conductive balls BB are mounted is taken out from the rotary table 1, the second substrate is charged with the conductive substrate. Balls B and B can be mounted.

Next, a procedure for mounting the conductive balls B at predetermined positions on the substrate from the state shown in FIG. 1 will be described. First, the substrate suction means 7 sucks the substrate on the first conveyor 9 and the substrate on the rotary table 1 and then moves rightward to set the substrate on the first conveyor 9 on the rotary table 1 and rotate the substrate at the same time. The substrate on the table 1 is replaced on the second conveyor 10.

On the other hand, in the second station, the conductive ball mounting means 3 which has been waiting for the number and position of the conductive balls BB corresponding to the conductive member supply section of the substrate in the second station. By one of the transport mechanisms 11
It is mounted at a predetermined position on the preceding substrate on the turntable 1.

In this way, the substrate is replaced, and the conductive balls BB are mounted on the substrate. After that, the rotary table 1 is horizontally rotated 90 degrees clockwise to move the substrate of the first station to the third station. Simultaneously, the substrate at the second station is moved to the fourth station. The positions of the substrates of the second and fourth stations moved in this way are confirmed by the first and second CCD cameras 4 and 5, respectively. By performing the above operation at each station, the required number of conductive balls can be reliably mounted at a predetermined position on the substrate in a short time.

[0015]

As is apparent from the above description, the present invention provides a method for rotating a plurality of substrates by a rotating table which rotates intermittently in a horizontal plane while providing a plurality of conductive balls to conductive member supply portions of these substrates. Wherein the substrate is set on the rotary table at the first station, the preceding substrate on which the conductive balls are mounted is removed from the rotary table, and the substrate is set at the first station. In addition, the conductive ball is mounted on the preceding substrate in the second station while the substrate on which the conductive ball is mounted is being taken out, so that a plurality of conductive balls can be applied to the conductive member supply portion of the substrate in a short time. It has excellent practical effects such as being able to be securely mounted.

[Brief description of the drawings]

FIG. 1 is a front view schematically showing one embodiment of the present invention.

[Explanation of symbols]

 1 rotating table substrate loading / unloading means conductive ball mounting means 4; 5 CCD camera

Claims (6)

[Claims] 1. A method for mounting a plurality of conductive balls on a conductive member supply portion of a plurality of substrates while rotating the plurality of substrates by a rotary table that rotates intermittently in a horizontal plane. Setting the substrate on the rotary table at the first station, removing the preceding substrate with the conductive balls from the rotary table, further setting the substrate at the first station and removing the substrate with the conductive balls. Mounting a conductive ball on the preceding substrate in the second station while the conductive ball is in the second station. 2. The method according to claim 1, wherein a third station for confirming the position of the substrate after setting is provided between the first station and the second station. A method for mounting a conductive ball on a substrate, characterized in that the method comprises: 3. The method for mounting conductive balls on a substrate according to claim 1, wherein the setting of the substrate on the rotary table and the removal of the substrate on which the conductive balls are mounted in the first station are performed by two. A method for mounting conductive balls on a substrate, wherein the method is performed by a substrate carrying-in / out means having a substrate suction means. 4. An apparatus wherein a plurality of conductive balls are mounted on conductive member supply portions of a plurality of substrates while rotating the plurality of substrates by a rotary table intermittently rotating in a horizontal plane. A rotary table for intermittently rotating in a horizontal plane and rotating a plurality of substrates set at equal intervals; and a first station for setting the substrates on the rotary table and leading conductive A substrate loading / unloading means for removing a substrate with a ball mounted thereon; and a conductive ball mounting means for mounting a conductive ball on a preceding substrate on the rotary table in a second station. Equipment for mounting on a substrate. 5. The apparatus for mounting a conductive ball on a substrate according to claim 4, wherein a CCD camera for confirming the position of the substrate after setting is arranged between the first station and the second station. An apparatus for mounting a conductive ball on a substrate, the apparatus further comprising a third station. 6. An apparatus for mounting conductive balls on a substrate according to claim 4 or 5, wherein said substrate mounting means comprises two or more transfer mechanisms. Onboard equipment.