JP2000114178A5 - - Google Patents

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Publication number
JP2000114178A5
JP2000114178A5 JP1998258868A JP25886898A JP2000114178A5 JP 2000114178 A5 JP2000114178 A5 JP 2000114178A5 JP 1998258868 A JP1998258868 A JP 1998258868A JP 25886898 A JP25886898 A JP 25886898A JP 2000114178 A5 JP2000114178 A5 JP 2000114178A5
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JP
Japan
Prior art keywords
mask
thin film
exposed portions
compound semiconductor
sides
Prior art date
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Application number
JP1998258868A
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English (en)
Japanese (ja)
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JP3826581B2 (ja
JP2000114178A (ja
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Application filed filed Critical
Priority to JP25886898A priority Critical patent/JP3826581B2/ja
Priority claimed from JP25886898A external-priority patent/JP3826581B2/ja
Priority to US09/369,148 priority patent/US6368733B1/en
Publication of JP2000114178A publication Critical patent/JP2000114178A/ja
Publication of JP2000114178A5 publication Critical patent/JP2000114178A5/ja
Application granted granted Critical
Publication of JP3826581B2 publication Critical patent/JP3826581B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP25886898A 1998-08-06 1998-09-11 半導体基板および半導体基板の製造方法 Expired - Fee Related JP3826581B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP25886898A JP3826581B2 (ja) 1998-08-06 1998-09-11 半導体基板および半導体基板の製造方法
US09/369,148 US6368733B1 (en) 1998-08-06 1999-08-05 ELO semiconductor substrate

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP22328198 1998-08-06
JP10-223281 1998-08-06
JP25886898A JP3826581B2 (ja) 1998-08-06 1998-09-11 半導体基板および半導体基板の製造方法

Publications (3)

Publication Number Publication Date
JP2000114178A JP2000114178A (ja) 2000-04-21
JP2000114178A5 true JP2000114178A5 (enrdf_load_stackoverflow) 2005-07-07
JP3826581B2 JP3826581B2 (ja) 2006-09-27

Family

ID=26525376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25886898A Expired - Fee Related JP3826581B2 (ja) 1998-08-06 1998-09-11 半導体基板および半導体基板の製造方法

Country Status (1)

Country Link
JP (1) JP3826581B2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6821805B1 (en) 1999-10-06 2004-11-23 Matsushita Electric Industrial Co., Ltd. Semiconductor device, semiconductor substrate, and manufacture method
JP4396816B2 (ja) 2003-10-17 2010-01-13 日立電線株式会社 Ｉｉｉ族窒化物半導体基板およびその製造方法

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