JP2000114149A - Glass substrate holding apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To hold a substrate with highly accuracy. SOLUTION: A load is applied to a corner of a glass substrate along the direction of a diagonal by a corner loading plate 32, while a vertical weight is applied by a loading pin 31 at a side edge plane that makes contact with the corner. The load application mechanisms utilize spring or bellows parts and levers. Sensors that detects whether the glass substrate is positioned correctly as well as a function for the temperature adjustment of the glass substrate and of the glass substrate holding apparatus are added.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass substrate holding apparatus for an electron beam lithography apparatus and a mask for manufacturing a pattern projection mask made of a material such as quartz glass used in manufacturing a semiconductor device by lithography. The present invention relates to a projection mask holding device of an exposure projector that projects the above pattern onto a silicon wafer or the like.

[0002]

2. Description of the Related Art Generally, a glass substrate serving as a mask for forming an LSI pattern is supported and aligned by using a glass substrate supporting portion having a flatness in the air and a hole provided around the glass substrate supporting portion. In addition to the initial positioning by the external force when the glass substrate is mounted, secure fixing after the positioning is completed and the setting of the position control reference at the time of drawing are performed.

When a mechanism for applying a load to a glass substrate using a spring and a lever is considered as a fixing method instead of vacuum suction,
In general, a load is applied from a direction along a diagonal line to a short side of a corner where two end faces intersect as a position where the X, Y and two directions on a plane can be simultaneously restricted. . FIG. 14 shows this conventional glass substrate holding device,
The substrate mounting portion of the glass substrate holding device 107 is provided with alignment reference points 128a to 128c and a driving portion 130,
The driving unit 130 pushes one corner of the glass substrate 108 along its diagonal direction, and the two sides of the glass substrate 108 facing the driving unit 130 are aligned with the alignment reference points 128.
a to 128c to align and hold.

In a situation where the transfer and movement of the glass substrate are performed at a gentle acceleration in the entire process and a large acceleration is not generated, a special method for fixing and holding the glass substrate after the initial positioning of the glass substrate is used. Since there is no need to apply an external force, the deformation of the glass substrate is eliminated by using only the frictional force with the glass substrate acting on the support portion that maintains the flatness, eliminating the external force such as vacuum suction for fixing the glass substrate. Has been used as much as possible.

[0005]

It is difficult to use a so-called vacuum suction method using a differential pressure for holding a glass substrate in a high vacuum atmosphere as in an electron beam lithography apparatus. In addition, when a glass substrate is carried into a vacuum container to secure a high degree of vacuum, a method of transporting the inside of a container having a plurality of degrees of vacuum that is gradually improved is usually used,
This shortens the time required to evacuate from atmospheric pressure to high vacuum, and at the same time prevents direct communication between the atmosphere and the vacuum vessel, thereby suppressing contamination due to intrusion of dust into the interior of the vessel with the final vacuum degree. Is done. However, when a glass substrate is transferred between a plurality of containers, acceleration is applied by the transfer device. Therefore, if the glass substrate is simply supported by the frictional force between the glass substrate and the support member, the exposure of the silicon wafer after drawing is completed. Since it is difficult to suppress the movement of the glass substrate within a position accuracy number of 100 μm required for the projection and to maintain the initial positioning state performed for setting the drawing reference, some kind of restriction is required. If positioning for the purpose of setting the drawing reference is to be performed in the container with the final degree of vacuum after the transfer between vacuum containers is completed, it is necessary to provide a mechanism in the high vacuum container. However, in this case, it is difficult to prevent contamination of the drawing surface of the glass substrate by dust generated by the operation of the mechanism and to secure airtightness.

Usually, in order to form a pattern on a glass substrate by lithography, only a portion chemically changed by a certain external stimulus such as an electron beam changes into a state in which it is insoluble in a subsequent chemical treatment. A compound is used, and the resist is applied to the pattern drawing surface side of the glass substrate. Ideally, the resist is applied only to the drawing surface corresponding to the upper surface side of the glass substrate, and the material of the glass substrate is exposed on the bottom surface directly contacting the support of the glass substrate.

Since the thickness of the applied resist needs to be controlled to a constant thickness in the entire writing area in accordance with the wiring width and wiring density of the pattern to be drawn, a glass substrate is used in the resist coating step. A spin coating method is generally used in which the difference in coating film thickness is adjusted by the balance between the centrifugal force of rotating the resist at a high speed and the surface tension of the resist diluted with an organic solvent and in a liquid state. However, with this coating method, it is difficult to completely prevent the resist from wrapping around the back surface of the glass substrate. Until the pattern formation on the glass substrate surface by drawing is completed, the resist is in a semi-cured state, so when the part where the resist adheres and the glass substrate support come in contact, the adhesive has sufficient adhesiveness to fix the glass substrate. In some cases, the positioning performed by sliding the glass substrate on the support may be hindered by holding and applying an external force.

When a pattern is drawn in a state where the initial positioning is insufficient, several hundreds of hundreds based on the end face of the glass substrate required for a pattern exposure step on a silicon wafer after drawing are required.
Not only is it impossible to position with dimensional accuracy within μm, but also the glass substrate does not completely adhere to the positioning reference member on the glass substrate holding device and the glass substrate is incompletely restrained, so drawing The glass substrate may move due to the movement acceleration of the middle stage, and a pattern to be drawn with a positional accuracy of several tens of nm may be distorted or a drawing defect may occur. Such a drawing failure caused by the adhesion between the glass substrate and the support member is caused by applying a load only from the side of the corner where the two outer peripheral surfaces of the glass substrate intersect as in the conventional glass substrate fixing device shown in FIG. In the case of positioning and fixing performed in such a manner, there is a tendency that the frequency frequently occurs.

Regarding the drawing accuracy on the glass substrate, a positional accuracy of 1/8 to 1/10 with respect to the wiring width is required. For example, LS with the same degree of integration as a 64 Mbit DRAM
If the wiring width used for the I element is 0.25 μm,
A drawing accuracy of 0.02 to 0.03 μm (20 nm to 30 nm) is required. When it is considered that an element pattern is formed on a glass substrate made of 100% quartz, the thermal expansion coefficient is approximately 5 × 10 in the range of room temperature to 200 ° C.
^-7 (1 / ° C). Considering a glass substrate having a size of 6 inches, if a temperature difference of about 0.4 ° C. occurs, a displacement equivalent to a threshold value of poor writing accuracy occurs.

On the other hand, since electron beam writing on a glass substrate is performed in a high-vacuum atmosphere, heat conduction that gives a temperature change to the glass substrate is limited to only contact or radiation. Radiation does not work effectively because the temperature difference between the atmosphere in the vacuum vessel and the glass substrate holding device is small, and the heat conduction due to contact limits the contact surface for the purpose of ensuring flatness on the drawing surface, and furthermore, the coefficient of friction It is difficult to perform because parts using small resin materials are used.
For this reason, the glass substrate inside the vacuum container is in a state close to heat insulation, and a very long time is required to change the temperature.

On the other hand, drawing on a single glass substrate is performed within several hours to several tens of hours, which is necessary for equilibrating a temperature difference of 0.4 ° C., which gives an extension of the upper limit of the drawing accuracy. If the time is equal to the time, there is a possibility that the accuracy of the pattern at the start of writing and the accuracy of the pattern after the end of writing may be about the same as the upper limit of the allowable value. Although the temperature is controlled in the clean room in which the apparatus is installed and the temperature is controlled to a substantially constant room temperature, it is impossible to completely match the temperature inside the vacuum vessel in which drawing is performed. For this reason, in order to suppress the occurrence of the above-described drawing failure, it is necessary to hold the glass substrate inside the vacuum vessel for a long time and to make the temperature equilibrium. Leaving the glass substrate inside such a vacuum container for a long time causes an increase in the drawing time, which causes a reduction in the overall throughput of the drawing process.

SUMMARY OF THE INVENTION The present invention has been made in view of such problems of the prior art, and when a glass substrate is put into an apparatus, adhesion of a resist on the glass substrate is prevented,
With good reproducibility so as not to affect drawing accuracy, it is possible to fix the glass substrate with respect to the fixing device, and drawing defects due to expansion and contraction caused by the temperature difference between the vacuum chamber in the device and the atmosphere around the device. It is an object of the present invention to provide a glass substrate holding device capable of preventing the occurrence of the problem.

[0013]

According to the present invention, in holding a glass substrate, a bellows-like part sealed in the atmosphere is replaced with a spring and a lever or a bellows-like part which is effective only in an atmospheric pressure atmosphere such as vacuum suction. The glass substrate and the glass substrate holding device are positioned and held in a state before the glass substrate and the glass substrate holding device enter into a high vacuum by using a load method using. During the transportation, a load is constantly applied by a built-in spring or bellows-like component, and the glass substrate is fixed. At least one pair of fixed loads and load support points are provided for each of two orthogonal end faces of the glass substrate, and all points are added in a direction perpendicular to the end faces,
Alternatively, a load is applied along a diagonal direction to a corner (short side) formed by the two end faces being orthogonal to each other, and further, a direction perpendicular to one of the two end faces forming the corner. And a mechanism for supporting the load is provided on the side end surface opposite to the point of action.

According to the method of applying a load from two directions, the influence of the adhesive force of the resist wrapped around the lower surface of the glass substrate can be suppressed and the glass substrate can be slid and positioned. In addition, a reinforcing member and a member serving as a sliding member are attached to the glass substrate in advance, and the glass substrate in this state is mounted on a holder that can be mounted again, thereby providing a two-stage device configuration.
The position of the glass substrate can be aligned with the effect of resist contamination on the surface opposite to the drawing surface of the glass substrate completely eliminated, and the size of the glass substrate can be reduced by further dividing the function of the glass substrate holding device. It facilitates adaptation to changes and suppresses the deflection of the glass substrate, which tends to increase in size.

That is, in the glass substrate holding apparatus of the present invention, in a glass substrate holding apparatus for holding a glass substrate for manufacturing a semiconductor element having a conductive layer on the surface, the flatness of the glass substrate at a plurality of points with respect to the bottom is set. Glass substrate supporting means for securing and holding; load applying means for applying a load to two adjacent side end faces of the glass substrate from the outer peripheral direction; and two opposite side end faces on which the load applying means acts.
It is characterized by comprising load supporting means for supporting one side end face against a load, and means for ensuring electrical contact with the conductive layer on the surface of the glass substrate. It is preferable that an actuator for applying an external force is provided at one point of the load applying means, and the actuator has a function of applying an external force to the load applying means and releasing the load applied from the load applying means to the glass substrate.

The load applying means includes a bellows-like part sealed in the atmosphere, and the bellows-like part applies a load to the glass substrate by a thrust when the bellows-like part expands due to an internal and external pressure difference generated in a vacuum atmosphere. be able to. Further, the glass substrate holding device of the present invention is a glass substrate holding device that holds a glass substrate for manufacturing a semiconductor element having a conductive layer on the surface, wherein the glass substrate is secured at a plurality of points with flatness with respect to the reference of the bottom surface. A glass substrate supporting means for holding, and applying a load along one diagonal direction to one corner of the glass substrate, and applying a load in a direction perpendicular to the surface to one side end face adjacent to the corner. A load applying means, a load supporting means for supporting two side end faces of the glass substrate facing the corner portion against a load, and a means for ensuring electrical contact with the conductive layer on the surface of the glass substrate. It is characterized by the following.

It is preferable that the glass substrate holding device has means for adjusting the temperature of the glass substrate to be held. The glass substrate temperature adjusting means adjusts the temperature of the held glass substrate by bringing a member capable of adjusting the height of the glass substrate holding device in the vertical direction from the back surface of the glass substrate into contact with the member. Can be. By providing the temperature control means for the glass substrate, the time required for the temperature of the glass substrate holding device and the temperature of the glass substrate to reach equilibrium in a high-vacuum container for drawing can be reduced. The effect of the thermal expansion of the glass substrate caused by the temperature difference can be suppressed, and it is possible to cope with the drawing of the LSI element pattern with higher accuracy.

It is preferable that at least one of the load point and the load support point with respect to the glass substrate is brought into rotational contact with a ball bearing or the like. The portion of the lever that directly loads the glass substrate, which is in direct contact with the glass substrate, is used as a rotating support member such as a ball bearing to reduce the sliding resistance of the glass substrate when positioning by sliding the glass substrate. It is possible to suppress the occurrence of one-sided contact and rotational moment at the scale and the load point. Further, the adhesion of the glass substrate due to the resist material applied to the glass substrate can be prevented.

A concave portion may be provided in a part of the main body of the glass substrate holding device depending on the type of the glass substrate to be held, or a concave portion may be provided in a part of the main body of the glass substrate holding device depending on the type of the glass substrate held. May be provided. By detecting the position or shape of the concave portion of the main body, the type of the glass substrate held by the glass substrate holding device can be determined. Further, it is preferable that a means for determining whether or not the glass substrate is in contact with the load supporting point is provided. For example, by providing a sensor that determines whether initial positioning and fixing by a spring and a lever have been reliably performed, the glass substrate is drawn in a state where the positioning and fixing of the glass substrate to the glass substrate fixing device are insufficient. Can be prevented.

The glass substrate supporting means for holding the glass substrate with flatness with respect to the reference of the bottom surface can be movable in a direction along the surface of the glass substrate. Further, the glass substrate supporting means for securing and holding the glass substrate with respect to the reference of the bottom surface can be rotatable at a fixed position. Further, of the load applying means for applying a load to the glass substrate, only the members directly contacting the glass substrate are exposed on the upper surface of the main body through a hole penetrating the main body in the height direction,
It is desirable to arrange the members other than the member on the bottom side of the main body.

Further, the glass substrate holding device according to the present invention is a glass substrate holding device for holding a glass substrate for manufacturing a semiconductor element having a conductive layer on the surface. A plurality of sliding portions provided in the glass substrate holding device to secure the glass substrate with respect to the reference of the bottom surface while maintaining flatness, and a glass substrate fixing means on which the glass substrate holding device is mounted and fixed The glass substrate fixing means comprises at least two pairs of load applying means for applying a load from the outer peripheral direction of the glass substrate holder,
Load supporting means for supporting the load.

Further, the glass substrate holding apparatus according to the present invention is a glass substrate holding apparatus for holding a glass substrate for manufacturing a semiconductor element having a conductive layer on the surface, the apparatus having an electrode in contact with the surface conductive layer of the glass substrate, A plurality of sliding portions provided in the glass substrate holding device to secure the glass substrate with respect to the reference of the bottom surface while maintaining flatness, and a glass substrate fixing means on which the glass substrate holding device is mounted and fixed Wherein the glass substrate fixing means comprises at least two pairs of load applying means for applying a load from the outer peripheral direction of the glass substrate, and load supporting means for supporting the load by contacting the side end surface of the glass substrate. I do.

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION
A drawing process of an LSI element in a semiconductor device pattern drawing apparatus using an electron beam (hereinafter, referred to as an electron beam drawing apparatus) will be described as an example. FIG. 1 shows a schematic view of an electron beam drawing apparatus. The glass substrate 8 on which the drawing pattern is formed is made of SiO ₂
Is a raw material, a chromium film is deposited on the surface thereof, and a resist is applied on the upper surface of the deposited film. The glass substrate 8 is positioned and fixed / mounted on a glass substrate holding device 7 formed using a ceramic material such as alumina, and the sample stage 5 in the vacuum sample chamber 6 evacuated by the evacuation device 12. Is placed on top. The electron beam emitted from the electron gun 1 is applied to an aperture 2 provided with an opening in a predetermined shape such as a rectangle or a circle.
a and 2b are moved and shifted within a certain range,
First formed into a predetermined shape obtained by this arrangement,
Further, the light is deflected by the action of the deflecting plates 3 a and 3 b, converged by the objective lens 4, and irradiated on the glass substrate 8. The resist on the glass substrate 8 undergoes a chemical change due to electron beam irradiation, so that the subsequent chemical treatment can differentiate between dissolution and non-dissolution. The apparatus control system 14 controls the voltage applied to the deflecting plates 3a and 3b to control the irradiation position of the electron beam on the glass substrate 8 under the instruction from the CPU 20, and furthermore, the sample stage on which the glass substrate fixing device is mounted. By controlling the movement of 5, a drawing pattern is formed on the resist on the glass substrate 8.

The glass substrate 8 to be drawn is a glass substrate cassette 2 in a state where a plurality of glass substrates 8 are united vertically.
2 and is set in a predetermined position on the apparatus. FIG. 2 schematically shows the glass substrate cassette 22, and FIG.
(B) is a front view. The glass substrate holding device 7 is mounted in advance in a preliminary exhaust chamber called a sub-chamber 9 and a glass substrate waiting room called a load chamber 11. A separate valve 10 is provided between the sub-chamber 9 and the load chamber 11. A plurality of glass substrate holding devices 7 are housed and held in the load chamber 11 regardless of the presence or absence of a glass substrate, and the glass substrate 8 and the glass substrate 8 brought in from the atmosphere with respect to the temperature in a vacuum state in the device. Accordance with and equalization with the temperature of the holding device 7 are performed. However, inside the vacuum vessel, heat transfer is performed only by heat conduction and radiation due to direct contact between members, and the temperature difference is also approximately 0.1 to 0.5 ° C.
It took several hours to reach the thermal equilibrium state due to the range and the minuteness. From the load chamber 11, the glass substrate holding devices 7 are unloaded one by one into the sub-chamber 9 by the transfer mechanism 23a, and the inside of the glass substrate after the unloading of the glass substrate and the fixing with the glass substrate holding device are completed. It is in a standby state for loading into the vacuum vessel.

FIG. 3 is a schematic view showing a transfer path between the glass substrate cassette and the vacuum sample chamber 6 of the electron beam lithography apparatus.
Is a schematic explanatory view of a glass substrate transfer mechanism arm, and FIG. 5 is an explanatory view showing an example of a glass substrate holding device according to the present invention. As shown in FIG. 3, a glass substrate 8 is supplied from a glass substrate cassette 22 outside the apparatus to the glass substrate holding apparatus 7 in the sub-chamber 9 by a robot mechanism. At this time, as shown in FIG. 4A, holes 26c, 26d, and 26e are provided in the robot arm 26b of the robot mechanism at positions corresponding to the dimensions of the glass substrate, and vacuum suction is performed through these holes. As a result, the glass substrate 8 is prevented from dropping and moving during transportation, and at the same time, the dimensions of the glass substrate 8 are confirmed by determining the suction position.

In the glass substrate holding device 7 which waits for the glass substrate inside the sub-chamber 9, a notch (recess) 50 provided at a different position corresponding to the size of the glass substrate 8 which can be accommodated, as shown in FIG. The suitable size of the glass substrate 8 is recognized by the combination of the sensors a, b, and c in the device attached corresponding to the position of the notch. If it is determined that the size of the glass substrate on the robot arm 26b does not match the size of the glass substrate holding device 7, the glass substrate is reversely transported by the robot mechanism 26 to the cassette 22 outside the device. In order to determine the type of glass substrate that the glass substrate holding device 7 can support, besides changing the position of the notch provided in the glass substrate holding device,
For example, as shown in FIG. 18, the depth of a notch (recess) 51 provided in the glass substrate holding device is changed, and the depth of the notch 5 is changed.
It is also possible to determine the type of the glass substrate held by the amount of protrusion of the axis of the sensor 52 that detects 1.

The fixing of the glass substrate 8 to the glass substrate holding device 7 is performed as follows. The glass substrate 8 transported by the robot mechanism is transported by the robot mechanism 26 to the glass substrate preliminary holding mechanism 24 for performing preliminary positioning first. On the glass substrate holding mechanism 24, as shown in FIG. 4B, an external force is applied to the glass substrate 8 by the coarse positioning mechanism 27,
Preliminary positioning is performed by pressing against the reference point 24a and the reference surface 24b on the glass substrate preliminary holding mechanism 24.

The pre-positioned glass substrate is
The glass substrate pre-holding mechanism 24 as shown in FIG. 4 (c) is conveyed to a position immediately above the glass substrate holding device 8 in the sub-chamber 9 by the straight advance of the glass substrate pre-holding mechanism 24. The glass substrate 8 is pushed up from the preliminary holding mechanism 24 by the rise of the glass substrate 8 and is held in a state where the glass substrate 8 is separated from the preliminary holding mechanism 24. The glass substrate lifting mechanism 30 passes through the openings 7a to 7c of the glass substrate holding device shown in FIG.
4 holds the glass substrate 8 conveyed by the
, And hold it up.
Retreats from the sub-chamber 9 and then descends, and places the pushed glass substrate 8 on three point-like glass substrate support portions 36a to 36c provided at the bottom of the glass substrate holding device 7.

The glass substrate holding device 7 shown in FIG. 5 includes a side end load pin 31 for pressing one side end of a mounted glass substrate in the Y direction, and a corner for pressing a corner of the glass substrate in a diagonal direction. Load supporting pins 28a, 28 for supporting two side ends of the glass substrate pressed by the partial load plate 32, the side load pins 31, and the corner load plates 32 against the pressing load.
b, 28c. The load support pins 28a to 28c
Also serves as a reference point for positioning the glass substrate. Further, a ground electrode 48 for grounding a conductive layer such as a chromium layer provided on the surface of the glass substrate is provided. When the glass substrate is mounted on the glass substrate holding device 7, the ground electrode 48
As shown in (2), by being lifted obliquely upward about the axis on the ground electrode, the glass substrate is retracted to a position where it does not hinder the mounting of the glass substrate. The ground electrode 48 is formed of a material having sufficient mechanical hardness, for example, diamond, and is pressed against the glass substrate by a predetermined load to form a resist on the surface of the glass substrate having no conductivity. To form a ground circuit by contacting a conductive layer such as a chrome film below the resist.

Here, referring to FIGS. 5A and 5B, the side end load pins 31 and the corner load plates 3 of the glass substrate will be described.
2 will be described. FIG. 5B is a view of the glass substrate holding device 7 as viewed from the back side. The side end load pin 31 is fixed to a lever 31a that rotates around a shaft 31b, and the corner load plate 32 is fixed to a lever 32a that rotates around a shaft 32b. The lever 32a is provided with a push portion 34 partially provided with a ball bearing, and the push portion 34 pushes the lever 31a. The lever 31a is provided with a pressing spring 3 so that the side load pin 31 always presses the glass substrate.
Similarly, the lever 32a is rotationally urged by the tension spring 32c so that the corner load plate 32 always presses the corner of the glass substrate. Therefore, in a state where the glass substrate 8 is mounted and held at a predetermined position of the glass substrate holding device 7, the glass substrate is always kept at the side end load pins 3
The two side end faces are pressed against the load support pins 28a to 28c by the pressing force of the first and corner load plates 32, and are fixed in a positioned state.

The load mechanism includes a rotary actuator 35 for releasing a load for fixing the glass substrate. The lever 32a is provided with an external force receiving portion 32d for receiving an external force from the rotary actuator 35.
The rotary actuator 35 is driven from outside the glass substrate holding device 7. Before the glass substrate 8 is mounted on the glass substrate holding device 7 by the lowering of the glass substrate lifting mechanism 30 in the sub-chamber 9, the load mechanism for the glass substrate is opened in the following manner, for example.
As shown in FIGS. 5A and 5B, the rotary actuator rotates in the direction of the arrow and the external force receiving portion 3 of the lever 32a is rotated.
Pressing 2d causes the lever 32a to move to the open position against the force of the tension spring 32c. Thereafter, the load point 34 of the lever 32a with respect to the lever 31a is changed to the lever 3
1a, the lever 31a rotates to the open position against the force of the pressing spring 31c. After each of the levers 31a and 32a has been moved to the open position as described above, the glass substrate lifting mechanism 30 is lowered and the glass substrate 8 is moved.
Set to the holding position.

The positioning and fixing of the glass substrate 8 are performed by repeating the operation of the rotary actuator 35 a plurality of times, so that the glass substrate 8 is slid on the glass substrate holding device 7 and securely positioned at the reference point 28 on the glass substrate holding device 7. To perform positioning and fixing. Most of the above lever mechanisms are provided on the side opposite to the glass substrate mounting surface of the glass substrate holding device 7, and the side end load pins 31 and the corner load plates 32 for directly applying a load to the glass substrate 8 and the periphery thereof Only the portion is exposed to the glass substrate mounting surface side through a hole penetrating the glass substrate holding device 7. This makes it possible to suppress contamination due to dust generation from the movable portion of the load mechanism.

The load mechanism shown in FIGS. 5A and 5B
The two levers 31a and 32a have a structure in which they contact each other. By driving one rotary actuator 35, the load on the glass substrate by the side end load pins 31 and the corner load plates 32 can be released. Was. However, FIG.
As shown in (c), the side end load pins 31 and the corner load plates 32 can be provided independently. In this case, it is necessary to separately provide actuators 35a and 35b for releasing the load applied to the glass substrate.

When the apparatus of the present invention is applied to hold an exposure mask of an exposure projection apparatus, an opening 140 is formed by cutting out the bottom of the substrate holding apparatus 7 as shown in FIG. Is set so that the external shape of the substrate holding device does not interfere with the projection. FIG. 13 is an explanatory view showing another example of the glass substrate holding device according to the present invention. FIG. 13A is a top view, and FIG. 13B is a partial rear view of a portion having a load applying mechanism.

Although the load applying mechanism of the example shown in FIG. 5 uses a spring and a lever, the example shown in FIG. 13 uses bellows-like parts 37a and 37b sealed at atmospheric pressure instead of the spring. In this method, a bellows made of a material having a spring constant in a contraction direction small enough to generate a required thrust for a required stroke is used at a position of a spring that applies a load to a lever. Alternatively, the bellows-shaped component may directly apply a load to the glass substrate without using the lever. In the example of FIG. 5, one bellows-like part 37a directly presses the glass substrate in the X direction, and the other bellows-like part 37b rotates the lever 31g around an axis to rotate the lever 31g around the axis, and the side end attached to the tip of the lever 31g. The glass substrate is pressed in the Y direction by the load pins 31.

When the glass substrate holding apparatus is carried into the vacuum sample chamber 6 of the electron beam lithography apparatus, a thrust corresponding to the pressure difference from the atmospheric pressure is generated in the bellows-like parts 37a and 37b and expanded. Therefore, if the mounted glass substrate is properly aligned with respect to the glass substrate holding device 7, the bellows contracts at atmospheric pressure and the load is automatically released, and in a vacuum, the bellows cover is reversed. Is extended to be in a load state, so that there is no need to provide a mechanism or the like for releasing the lever on the drawing apparatus side. However, when using bellows-like parts, it is necessary to optimize the bellows-like parts for airtight reliability and fatigue resistance against expansion and contraction, and to optimize the inner diameter and the number of ridges of bellows and equipment dimensions to obtain the required thrust. Therefore, constraints on dimensional design increase.

In order to reduce the sliding resistance of the glass substrate supporting portions 36a to 36c, for example, the following method can be used. As shown in FIG. 6, when the supporting portion in the height direction of the glass substrate is held on the basis of the bottom of the glass substrate holding device 7 so that the drawing surface of the glass substrate can secure a flatness of about several μm, as shown in FIG. The flatness of the part to be the sliding surface is adjusted to about 3 μm by cutting the attached metal part 38, and the height variation between the sliding face and the apex is also about 3 μm in this part. With a flatness of around 6 μm and a diameter of 0.2 mm
It is possible to configure a support portion that can move in a plane within a minute range.

This is replaced with a sphere 40 whose diameter variation in each direction is adjusted from about several μm to about 5 μm as shown in FIG. 7, and for example, a conical groove is provided on the glass substrate holding device and put on this. By suppressing the variation in the range of the height of the apex of the ball 40 to several μm, the inclination of the drawing surface of the supported glass substrate is suppressed to 5 to 6 μm, and when the glass substrate is aligned by rotating the ball 40. Can be reduced. Although the flatness of the drawing surface in the state of supporting the glass substrate can be further improved by the improvement of the processing accuracy, the molding by machining currently performed normally,
As described above, the highest accuracy is achieved when the accumulated flatness is around 5 μm. At present, correction can be performed without reducing the drawing accuracy up to about 10 μm by the focus adjustment function of the electron beam on the electron beam drawing apparatus.

As a method of determining whether the positioning of the glass substrate 8 on the glass substrate holding device 7 has been completed, for example, the following method can be considered. As shown in FIG. 8, the glass substrate holding device 7 is provided with a spring 41 having a load sufficiently smaller than a spring load for fixing the glass substrate, and a rod-shaped electrode 42 which is electrically connected when contacted. Is provided. The rod-shaped electrode 42 is provided in the vicinity of the load supporting portions 28a to 28c corresponding to the facing surface side of the load mechanism. The rod-shaped electrode 42 is electrically insulated from the glass substrate holding device 7 so that only when the glass substrate 8 is slid and positioned at a predetermined position, the contact portions are in contact with each other so that conduction on the predetermined circuit 43 is obtained. . By applying Au plating to the electrode portion, the resistance during contact conduction can be reduced. However, the mechanism for supporting the movable shaft part is manufactured with a small backlash, and the positioning accuracy of the end face is increased to about 0.1 mm.
If it is detected that the pressing by the positioning load is completed to 0.1 mm or less, the reference points 28a to 2 can be detected by opening and closing the lever for applying the positioning load a plurality of times from that position.
8c can be easily completed.

If such positioning detection axes are mounted one by one on each of the reference points 28a to 28c, and the circuit 43 is closed only when positioning is completed at all positions, For example, using this circuit as a switch, the determination result can be monitored in combination with a current or voltage sensor provided on the electron beam lithography apparatus. For example, FIG. 8A shows a state in which the positioning of the glass substrate has been completed. In this case, three rod-shaped electrodes 42 provided near the reference points 28a to 28c
Are all turned on, and indicate completion of positioning. On the other hand, FIG.
(B) shows a state where the positioning of the glass substrate has not been completed. In this case, the rod-shaped electrode 42 provided at the reference point 28a does not conduct, indicating that the positioning is not completed.

As another method, as shown in FIG. 9, through-holes 44a to 44c are formed on the glass substrate holding device 7.
Are provided around the through holes 44a to 44c as a reference position for judging the completion of the alignment of the glass substrate on the holding device, and the laser light 45 transmitted through this portion and the glass substrate is provided.
By reading the change in the light-shielding width, the end face position of the glass substrate 8 can be detected, whereby the end of the positioning of the glass substrate 8 can be detected.

As a function of adjusting the temperatures of the glass substrate holding device 7 and the glass substrate 8 itself, the following method can be used. Holes 7a to 7c are formed by using a leaf spring mechanism as shown in FIG. 10 around the support portion on the bottom surface side opposite to the glass substrate drawing surface of the glass substrate holding device 7.
A member 46 that contacts the bottom surface of the glass substrate with a position and shape that avoids interference with the glass substrate transport mechanism that moves up and down is provided as large as possible. A non-magnetic metal material is used for a portion in contact with the glass substrate. For example, a coating having a thickness of about several μm, which becomes a resin material, may be applied so as not to damage the rear surface of the glass substrate. If a material having a large heat capacity is selected for the material of this portion, the time for adjusting the temperature after the glass substrate is fixed can be further shortened.

In order to adjust the temperature at the time of drawing, the glass substrate holding device 7 is previously held in the load chamber 11 in the electron beam drawing device shown in FIG.
Thereafter, the glass substrate holding device 7 is carried out into the sub-chamber 9 and the glass substrate 8 is held in the order described above. The contact load of the contact member 46 for adjusting the temperature is set to a magnitude that does not contribute to holding the load of the glass substrate. As a result, the contact heat conduction can be more efficiently performed even in a vacuum atmosphere as compared with the case where only the point contacts of the support portions 36a to 36c that secure the flatness are provided.
1 It is possible to finish the equilibrium temperature of the vacuum atmosphere inside and the temperature of the glass substrate 8 in a short time, and to suppress a decrease in drawing accuracy due to thermal expansion and contraction due to a temperature change of the glass substrate during drawing. Since the time required for the temperature equilibration in the sub-chamber can be shortened, it is possible to shorten the overall throughput of the writing process.

When a load is applied to the glass substrate side end face from the X and Y directions or the 45 ° diagonal direction and the X direction from the X and Y directions, the load lever is not necessarily placed at a fixed position due to the difference in vertical and horizontal dimensions of the glass substrate. The upper load point does not always contact the glass substrate. For this reason, when the load point and the load support point are fixed, a rotational moment may be applied to the glass substrate in a state of sliding contact. In order to be able to hold the glass substrate in a state in which no rotational moment remains in the state of holding the glass substrate, it is effective to use a method in which each contact point with the glass substrate is rotationally supported by a ball bearing or the like.

For example, as shown in FIGS.
This structure can be realized by holding the radial ball bearing 47 made of a nonmagnetic material such as ceramics or BeCu at a certain height by interposing a spacer or the like. The play on the load plane of the bearing 47 is always pressed in one direction when a load is applied, so that it is possible to suppress the influence on the reproducibility of the alignment. The load applying mechanism of the glass substrate holding device 7 shown in FIG. 11 includes a side end load pin 31 pressing the side end surface of the glass substrate 8 in the Y direction and a side end load pin 132 pressing the side end surface in the X direction. . FIG. 11 (c)
FIG. 4 is a rear view of the glass substrate holding device 7 showing details of a load applying mechanism.

The contact position of the load applying lever for holding the glass substrate, the position of the reference point on the glass substrate holding device, and the position of applying the load in each direction are determined by the contact points of the X and Y levers. A position where the rotational moments in the clockwise and counterclockwise directions on the X and Y planes on which the glass substrate is held are balanced with respect to the state where the pressing is completed for all the reference points. Is set as a reference. In suppressing the remaining rotational moment, a load is applied to a short side perpendicular to the corner formed by the two side end faces of the glass substrate 8 from a direction along the diagonal line of the substrate, and two corners forming the corner are additionally applied. The combination of applying a load from a direction perpendicular to either one of the side end surfaces is required to be provided on the outer peripheral portion that does not affect pattern drawing on the glass substrate, and the conductive layer on the glass substrate Ground electrode 48, mechanisms 41 and 42 for determining the end of alignment, contact portion 46 to the glass substrate bottom surface for shortening the temperature equilibration time, and pushing up the glass substrate to receive the glass substrate from preliminary holding mechanism 24. The degree of freedom in position design when arranging at a position where mechanical interference with the mechanism 30 or the like is prevented is increased. A load point for applying a load to a corner portion of the glass substrate from a direction along a diagonal line is, for example, a component in which a resin coating 31h is applied to a portion of the L-shaped member 31 in contact with the glass substrate 8 as shown in FIG. By using the method described above, it is possible to reduce the sliding resistance at the time of positioning and to suppress the sliding and the backlash of the glass substrate after the holding is completed.

FIGS. 15 and 16 are explanatory views showing another example of the glass substrate holding device according to the present invention. The glass substrate holding apparatus of this example holds and fixes a glass substrate using a two-stage pallet of a first pallet (glass substrate holder) and a second pallet (glass substrate fixing means). According to this method, it is possible to prevent the influence of the increase in the sliding resistance due to the contamination of the resist on the bottom surface of the glass substrate, and it is possible to prevent deformation of the glass substrate, which has been reduced in size and thickness, such as deflection.

First, the glass substrate holding device shown in FIG. 15 will be described. The first pallet for directly fixing the glass substrate has a structure as simple as possible, and a plurality of pallets 71a and 71b corresponding to the types (sizes) of the glass substrates 8a and 8b are prepared. First pallet 7
Although 1a and 71b have the same outer shape, the glass substrate mounting portion is adapted to the glass substrates 8a and 8b of each size.

The glass substrate 8a is first placed on the first pallet 7
FIG. 15 (a) shows a procedure for fixing to 1a. First
The pallet 71a has a structure in which a glass substrate 8a inserted from the end face side is vertically sandwiched between leaf spring members 72a, and a sliding member 74 made of metal or resin is provided on the side directly in contact with the bottom surface of the glass substrate 8a. Is provided. When the glass substrate 8a is mounted on the first pallet 71a, the leaf spring member 72a is kept pressed down by the jig 79. The ground electrode 73a for grounding the conductive layer on the surface of the glass substrate 8a has a linear contact portion instead of the needle-like contact point, and the glass substrate 8a is grounded to the sliding member 74 of the leaf spring material 72a. It is held and fixed between the electrodes 73a. First
The work of mounting the glass substrate 8a on the pallet 71a is manually performed offline using a jig 79, and the glass substrate alone is held in a state where the first pallets 71a and 71b are attached to a plurality of glass substrates. In the same manner as in the case of the above-mentioned case, it is mounted and held on the cassette 22.

The first pallets 71a, 71b are provided with a portion which can be sucked at a position corresponding to the transfer by the robot mechanism 26, whereby the first pallets 71a, 71b are provided.
The fixing and transfer of b to the second pallet 78 are performed in the same manner as for the glass substrate alone. The time required for drawing by the electron beam drawing apparatus varies depending on the wiring density and scale of the pattern to be drawn, but is several hours to several tens of hours.
The glass substrates 8a, 8
The manual work time when mounting the 8b does not reduce the drawing throughput of the entire apparatus.

The procedure for fixing the glass substrate 8 fixed to the first pallet 71 having the sliding member 75 on the bottom outside to the second pallet 78 is as follows.
The first substrate mounted on the cassette 22 with the glass substrate 8 mounted thereon
The pallet 71 is mounted on the second pallet 78 in the same manner as in the step of holding the glass substrate 8 alone in the glass substrate holding device 7. For example, the first pallet 71
When positioning the second pallet 78 with reference to the outer peripheral portion of the glass substrate 8, the second pallet 78 is prepared according to the maximum size of the glass substrate 8, and the first pallet 71 The glass substrate is used as a spacer for matching the shape of the mounting portion of the second pallet. That is, as shown in FIG. 15B, the glass substrate holding device 7 uses the side end load pins 31 and the corner load plates 32 of the second pallet 78 to move the outer periphery of the first pallet 71 to the reference pins 28a. Positioning is performed by pressing it to .about.28c.

Next, an example of the glass substrate holding device shown in FIG. 16 will be described. Glass substrate holding device 7 of this example
Is a two-stage system using a first pallet and a second pallet as in the example shown in FIG. 15, but is used when the size of the glass substrate is one type. As shown in FIG. 16A, a cutout portion 92 is provided on the outer peripheral portion of the first pallet 91 at a position corresponding to the positioning reference pins 28 a to 28 c and the load applying pins 31 and 132 of the second pallet 78. Keep it. When positioning the glass substrate 8 with respect to the second pallet 78, the positioning pins 28 of the second pallet 78 are positioned at the positions of the notches 92 of the first pallet 91.
a to 28c and the load applying pins 31 and 132 directly contact the side end surfaces of the glass substrate 8 to perform load and positioning.
The first pallet 91 has glass substrate holding portions 93a to 93d each including a lower spring member and an upper ground electrode at four corners, and holds the four corners of the glass substrate 8 by sandwiching the four corners between the spring member and the ground electrode. Further, sliding members 94a to 94d having a small contact area are provided on the lower surfaces of the glass substrate holding portions 93a to 93d of the first pallet 91, and the first pallet 91 is provided on the pallet mounting surface of the second pallet 78. Sliding members 94a-
It is mounted in contact with 94d.

When the side end surface of the glass substrate 8 mounted on the first pallet 91 is used for direct positioning, the first pallet 91 suppresses the sliding resistance of the glass substrate caused by resist contamination. Since the main purpose is to secure the flatness and the flatness, not so high accuracy is required for the alignment between the first pallet 91 and the glass substrate 8. Further, the positioning with respect to the second pallet 78 can be more reliably and accurately performed by suppressing the sliding resistance and preventing the deformation by reinforcing the member attachment to the glass substrate 8. In any case, the ground electrode can be taken from the outer periphery of the first pallet, and a large contact area with the conductive film layer on the glass substrate 8 can be ensured. It is possible to more effectively prevent a charge-up phenomenon in which charges are accumulated due to electron beam irradiation from an electron beam lithography apparatus.

[0054]

According to the present invention, the glass substrate and the glass substrate holding device are placed in a high vacuum by a load method using a spring and a lever or a bellows-like part instead of a fixing method effective at atmospheric pressure such as vacuum suction. By positioning and holding the glass substrate in advance before entering, it is possible to suppress the movement of the glass substrate due to acceleration at the time of transportation, and to provide a reference position for drawing with high accuracy. Further, when forming the pattern, it is possible to set a state in which this reference does not change beyond the tolerance range.

When a temperature adjusting function is provided by the contact member, the temperature of the glass substrate and the temperature in the work chamber at the time of drawing can be balanced in a short time, and the drawing accuracy due to the thermal expansion of the substrate can be reduced. The drop can be prevented. When the glass substrate holding device is divided into a first pallet for reducing sliding resistance and securing a ground electrode and a second pallet for mounting on an electron beam lithography device, the glass with resist Incomplete initial positioning due to resist contamination of the substrate can be prevented. Further, since the contact portion of the ground electrode can be provided as a line or a surface, the effect of preventing charge-up is enhanced.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of an electron beam drawing apparatus.

FIG. 2 is a schematic view of a glass substrate cassette.

FIG. 3 is a schematic diagram of a glass substrate transport path.

FIG. 4 is a schematic explanatory view of a glass substrate transfer mechanism arm.

5A and 5B are explanatory views showing an example of a glass substrate holding device according to the present invention, wherein FIG. 5A is a perspective view, FIG. 5B is a detailed view of a lever interlocking portion (back view), and FIG. Details (back view).

FIG. 6 is an explanatory diagram of a movable glass substrate support.

FIG. 7 is a cross-sectional view of a rotary glass substrate support.

FIG. 8 is a schematic diagram of a glass substrate positioning detection mechanism;
(A) is a figure which shows a positioning state, (b) is a figure which shows a positioning incomplete state.

FIG. 9 is a schematic diagram of a laser type glass substrate positioning detection mechanism.

FIG. 10 is a schematic diagram of a glass substrate temperature control mechanism;
(A) is sectional drawing, (b) is a top view.

FIG. 11 is a schematic diagram of a glass substrate holding device employing a rotatable load point.

FIG. 12 is a partially enlarged view schematically showing a load plate at a corner portion of a glass substrate.

FIG. 13 is a schematic view of a glass substrate holding device that employs a bellows-like component for a load mechanism, where (a) is a front side top view,
(B) is a partial rear view.

FIG. 14 is a schematic view showing a conventional glass substrate holding device.

FIG. 15 is a schematic view showing an example of a two-stage glass substrate holding device.

FIG. 16 is a schematic view showing another example of a two-stage glass substrate holding device.

FIG. 17 is an explanatory diagram of a concave portion (position change) for glass substrate holding device type determination.

FIG. 18 is an explanatory diagram of a glass substrate fixing device type discriminating concave portion (shape change).

FIG. 19 is a diagram when applied to hold an exposure mask of an exposure projection apparatus.

[Explanation of symbols]

1. Electron gun, 2a, 2b ... stop, 3a, 3b ... deflection plate,
4 Objective lens 5 Sample stage 6 Vacuum sample chamber
7: Glass substrate holding device, 8: Glass substrate, 9: Subchamber, 10: Separate valve, 11: Load chamber, 12: Vacuum exhaust device, 14: Device control system, 20: C
PU, 22: glass substrate cassette, 23a, 23b: transfer arm in a vacuum vessel, 24: glass substrate preliminary holding mechanism,
25: Sub-chamber valve, 26: Substrate transfer robot,
26b: transfer robot arm, 27: glass substrate coarse movement positioning mechanism, 28a to 28c: positioning reference point (load support point), 30: glass substrate pushing up mechanism, 31: side end load pin, 32: corner load Plate, 35 ... Rotary actuator, 36a-36c ... Glass substrate support, 37
a, 37b: bellows-like component, 41: positioning end sensor spring, 42: rod-shaped electrode, 43: positioning end detection circuit, 44: through hole, 45: laser beam, 46: contact plate for temperature adjustment, 47: rotatable load Point, 48 ... ground electrode, 4
9: first fixing device cutout portion, 50: glass substrate type determining concave portion (position change), 51: glass substrate type determining concave portion (shape change), 52: glass substrate type determining sensor, 71: first Pallet, 72: leaf spring material, 73: ground electrode, 74: sliding member, 75: sliding member, 78: second
Pallet, 79 ... jig, 91 ... first pallet, 92
... Notch, 93a to 93d.
4a to 94d: sliding member, 107: glass substrate holding device, 108: glass substrate, 128a to 128c: alignment reference point, 130: drive unit, 140: opening

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masahiro Tsunoda 882-Momo, Oaza-shi, Hitachinaka-shi, Ibaraki Prefecture Inside the Measurement Instruments Division, Hitachi, Ltd. (72) Inventor Yoshimasa Fukushima 882, Oji-shi, Hitachi, Ibaraki, Japan F-term (Reference) 2H095 BA01 BB10 BB29 5F031 CA05 DA13 FA02 FA07 FA11 FA12 GA05 GA08 HA07 HA13 HA37 HA38 KA02 KA03 KA15 MA27 NA05 NA10 5F046 CC08 CC09 CD04 DA06 DA07 DA26 DB04 DC05 DC12 5F056 DA23 EA13 EA14

Claims (15)

[Claims] 1. A glass substrate holding device for holding a glass substrate for manufacturing a semiconductor element having a conductive layer on its surface, wherein the glass substrate holding means holds the glass substrate at a plurality of points while securing flatness with respect to a reference of a bottom surface. A load applying means for applying a load to two adjacent side end faces of the glass substrate from an outer peripheral direction, and two side end faces opposed to the two side end faces on which the load applying means acts with respect to the load. A glass substrate holding device, comprising: a load supporting means for supporting; and a means for ensuring electrical contact with a conductive layer on a surface of a glass substrate. 2. The glass substrate holding device according to claim 1, further comprising: an actuator for applying an external force to one point of said load applying means, wherein said actuator applies an external force to said load applying means and said load applying means applies said external force to said load applying means. A glass substrate holding device having a function of releasing a load applied to a glass substrate. 3. The glass substrate holding device according to claim 1, wherein said load applying means includes a bellows-like component sealed in the atmosphere, and said bellows-like component is extended by an internal and external pressure difference generated in a vacuum atmosphere. A glass substrate holding device, wherein a load is applied to a glass substrate by a thrust at the time. 4. A glass substrate holding device for holding a glass substrate for manufacturing a semiconductor element having a conductive layer on its surface, wherein the glass substrate holding means holds the glass substrate at a plurality of points while ensuring flatness with respect to a reference of a bottom surface. And load applying means for applying a load to one corner of the glass substrate along a diagonal direction, and applying a load in a direction perpendicular to the surface to one side end face adjacent to the corner, Load supporting means for supporting the two side end surfaces of the glass substrate facing the corner against the load, and means for ensuring electrical contact with the conductive layer on the surface of the glass substrate. Glass substrate holding device. 5. The glass substrate holding device according to claim 1, further comprising a temperature adjusting means for holding the glass substrate. 6. The glass substrate holding device according to claim 5, wherein the temperature adjusting means for the glass substrate contacts a member capable of adjusting the height of the glass substrate holding device in the vertical direction from the back surface of the glass substrate. A glass substrate holding apparatus for adjusting the temperature of a glass substrate held by the method. 7. The glass substrate holding apparatus according to claim 1, wherein at least one of a load point and a load support point with respect to the glass substrate is in rotary contact. apparatus. 8. The glass substrate holding device according to claim 1, wherein a concave portion is provided in a part of the main body at a position different depending on a type of the glass substrate to be held. Holding device. 9. The glass substrate holding device according to claim 1, wherein a concave portion having a different shape is provided in a part of the main body depending on the type of the glass substrate to be held. Holding device. 10. The glass substrate holding device according to claim 1, further comprising: means for determining whether the glass substrate is in contact with the load support point. . 11. The glass substrate holding device according to claim 1, wherein the glass substrate supporting means for holding the glass substrate while maintaining flatness with respect to a reference of a bottom surface comprises a glass substrate holding device. A glass substrate holding device movable in a direction along a surface. 12. The glass substrate holding device according to claim 1, wherein the glass substrate supporting means for holding the glass substrate while maintaining flatness with respect to a reference of a bottom surface is provided at a fixed position. A glass substrate holding device that is rotatable. 13. The glass substrate holding device according to claim 1, wherein a member of the load applying means that comes into direct contact with the glass substrate passes through a hole penetrating the main body in a height direction, and the upper surface of the main body. A glass substrate holding device that is exposed to the side and is disposed on the bottom side of the main body except for the above-mentioned members. 14. A glass substrate holding apparatus for holding a glass substrate for manufacturing a semiconductor element having a conductive layer on the surface, comprising: a plurality of sliding portions provided on the bottom surface, the electrodes having electrodes in contact with the surface conductive layer of the glass substrate. A glass substrate holder that secures and holds the glass substrate flatness with respect to the reference of the bottom surface, and a glass substrate fixing means on which the glass substrate holder is mounted and fixed, wherein the glass substrate fixing means is A glass substrate holding device, comprising: at least two pairs of load applying means for applying a load from the outer peripheral direction of the glass substrate holder; and load supporting means for supporting the load. 15. A glass substrate holding apparatus for holding a glass substrate for manufacturing a semiconductor element having a conductive layer on a surface, comprising: a plurality of sliding portions provided on a bottom surface, the electrodes having electrodes in contact with the surface conductive layer of the glass substrate. A glass substrate holder that secures and holds the glass substrate flatness with respect to the reference of the bottom surface, and a glass substrate fixing means on which the glass substrate holder is mounted and fixed, wherein the glass substrate fixing means is A glass substrate holding device, comprising: at least two pairs of load applying means for applying a load from an outer peripheral direction of a glass substrate; and load supporting means for supporting the load by contacting a side end surface of the glass substrate.