JP2000099679A - Contact type ic card and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the over-lay film of a substrate for an IC card from being pealed when a recess is made for embedding an IC module at a substrate for an IC card, and to easily mount an IC module on an IC card. SOLUTION: In the manufacturing method, a first adhesive layer 2 is provided on the face of a center core substrate 1, and a print layer 3 for expressing characters or graphics is formed on the first adhesive layer, and an over-lay film 5 is laminated through a second adhesive layer 4 on the print layer. Then, a recess 7 for embedding an IC module is made, and the IC module 6 is embedded in the recess, and pressurized and heated from the both sides by flat finishing members.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a contact type IC card and a method for manufacturing the same.

[0002]

2. Description of the Related Art There are a contact type and a non-contact type IC card. A non-contact type IC card is formed by forming a recess in an IC card substrate, embedding and fixing an IC module therein, and then laminating the entire IC card with an overlay film. On the other hand, in the contact type IC card, since the external contact terminals of the IC module must be exposed on the surface of the IC card, the contact type IC card cannot be laminated with the overlay film after the IC module is embedded.
For this reason, in the contact type IC card, a recess for embedding the IC module is formed in the IC card substrate after being laminated with the overlay film, and then the IC module is mounted and fixed in the recess. .

[0003] In a conventional contact type IC card, a printing layer is formed on a center core base material, the printing layer is laminated with an overlay film, and the center core is formed by utilizing the adhesive force of a printing ink used for the printing layer. There is a configuration in which a base material and an overlay film are attached to each other, and then a recess for embedding the IC module is perforated, and the IC module is embedded and fixed in the recess to expose the external contact terminals.

In such an IC card, the recess for embedding the IC module is pierced by using a small-diameter drill or the like, but when the work is performed, the adhesive strength between the center core base material and the overlay film is sufficiently maintained. No, often resulting in the inconvenience of peeling of the overlay film around the perforated recess.

Further, in another example of a conventional contact type IC card, necessary characters and designs are printed on an IC card substrate in which a recess for embedding an IC module is formed in advance by using an injection molding technique. There is one in which an IC module is embedded and fixed in the recess to expose an external contact terminal.

In such an IC card, since a process of laminating with an overlay film is not performed, the printing layer is generally exposed to the top layer, and the surface strength is lower than in the case of laminating with an overlay film. Become.

[0007]

SUMMARY OF THE INVENTION An object of the present invention is to provide an IC
An object of the present invention is to provide a structure in which an overlay film of an IC card substrate is not peeled off when a recess for embedding an IC module is pierced in a card substrate, and to facilitate the process of mounting an IC module on an IC card.

[0008]

According to the present invention, a first adhesive layer is provided on a center core substrate surface, and a printed layer representing characters and figures is formed on the first adhesive layer. After laminating with an overlay film via a second adhesive layer, a recess for embedding the IC module is perforated, the IC module is embedded in the recess, and the IC module is pressed and heated with a flat finishing member from both sides. It features card manufacturing and an IC card so configured.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In FIG. 1, a first adhesive layer 2 is provided on both sides of a center core substrate 1 forming a base of an IC card.
Is provided. This adhesive layer is made of polyethylene, polypropylene, vinyl chloride, etc., and has a relatively smooth surface that can be printed before applying heat, but exhibits an adhesive function when required heat is applied. It is formed of a heat-sensitive adhesive. Although a pressure-sensitive adhesive can be used as the adhesive, a heat-sensitive adhesive is preferable because the adhesive strength is further enhanced when pressure is applied while heating in the final processing step of the IC card. On the surface of the heat-sensitive adhesive layer, a print layer 3 on which required characters and patterns are printed is formed. An overlay film 5 having a second adhesive layer 4 formed on its surface is laminated on the printing layer 3 to form a substrate.
This substrate is punched into a card shape by a conventionally known method to form an IC card substrate. The second adhesive layer is made of the same material as the first adhesive layer, and is made of a transparent material so that the printed layer can be seen through. Also,
The center core substrate 1 and the overlay film 5 are made of a material such as polyvinyl chloride, polyethylene terephthalate, polypropylene, ABS resin, biodegradable resin, etc., and the overlay film 5 is made of a transparent material.

In the above description, the method of forming the print layer 3 on the adhesive layer 2 on the center core substrate 1 has been described. However, as a different method, the adhesive layer 4 provided on the overlay film 5 is used. After the printed layer 3 is formed on the center core substrate 1, the printed layer 3 may be laminated to the adhesive layer 2 of the center core substrate 1 to form a laminated structure. In the case of this method, since the printing layer can be formed on the flexible sheet-like overlay film 5, the printing process is easier than printing on a hard center core substrate. In addition,
In this method, characters and images are printed upside down.

At a predetermined location on the IC card substrate formed as described above, using a processing device such as a small-diameter drill,
A recess 7 for embedding the IC module 6 through the overlay film 5, the second adhesive layer 4, the printing layer 3, the first adhesive layer 2, and the center core substrate 1 is formed. Since the adhesive layer is provided on both sides of the printing layer 3 and the adhesive strength is firmly maintained, the overlay film 5 can be prevented from peeling off when the recess 7 is formed. Next, the IC module 6 having the bottom surface and the peripheral surface coated with a heat-sensitive adhesive is mounted in the recess 7. The IC card thus configured is sandwiched between two mirror members on both sides of the IC card, and is pressed at an appropriate pressure while being heated at a required temperature. As a result, the first, second, and third adhesive layers are softened or melted by heating and then cured and bonded again, so that the bonding force between the center core substrate 1, the overlay film 5, and the IC module 6 is increased. Is further strengthened.
Then, the IC module 6 is exposed to the surface with the IC
An IC card firmly mounted on the card substrate and finished on a smooth surface is completed.

[0012]

As described above, first, a substrate comprising a center core base material, an adhesive layer, a printing layer, and an overlay film is formed, and then punched into a card shape to form an IC card substrate. To manufacture a durable IC card with a smooth surface that is less likely to peel by simply forming a recess at a predetermined location on the card, mounting the IC module in it, and then applying heat and pressure. Can be. As described above, according to the present invention, the external appearance of the IC card is improved, and the productivity of the IC card is also improved.

[Brief description of the drawings]

FIG. 1 is a diagram showing a cross-sectional structure of an IC card according to the present invention.

[Explanation of symbols]

 Reference Signs List 1 center core base material 2 first adhesive layer 3 printing layer 4 second adhesive layer 5 overlay film 6 IC module 7 recess

Claims (4)

[Claims] 1. A center core substrate provided with a first adhesive layer on at least one surface, a print layer formed on the first adhesive layer, and a second adhesive layer formed on the print layer. An overlay film laminated through an agent layer, a recess formed through the overlay film, the first and second adhesive layers, and the center core substrate, and an IC module fixed to the recess. Contact type IC card. 2. A first adhesive layer is provided on at least one surface of a center core substrate, a printing layer is formed on the first adhesive layer, and a second adhesive layer is formed on the printing layer. And a concave portion is formed through the overlay film, the first and second adhesive layers and the center core substrate, and a third adhesive layer made of a heat-sensitive material is formed in the concave portion. A card including the center core base material, the first, second and third adhesive layers, the overlay film and the IC module is heated and pressed by a flat member from both sides thereof. And manufacturing the contact type IC card. 3. A first adhesive layer is provided on at least one surface of the center core substrate, and a second adhesive layer is provided on an overlay film to be laminated on the center core substrate, and the second adhesive layer is provided on the overlay film. Forming a printing layer on the adhesive layer,
The printed layer formed on the overlay film is laminated to the adhesive layer of the center core substrate in opposition, and a recess is formed through the overlay film, the first and second adhesive layers, and the center core substrate, An IC module is mounted in the recess through a third adhesive layer made of a heat-sensitive material, and the center core substrate, the first, second, and third adhesive layers, the overlay film, and the IC A method for manufacturing a contact-type IC card, wherein a card including a module is heated and pressed by a flat member from both sides thereof to finish the card. 4. The method according to claim 2, wherein the first and second adhesive layers are made of a heat-sensitive material.