JP2000086911A - Sealing resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the subject composition having a precure viscosity at a specific level or lower, postcure glass transition temperature at a specific level or higher, and moisture absorption at a specific level or lower, with good flowability, pot-life and heat resistance and low hygroscopicity, and meeting popcorn tolerance, electrical insulation, etc. SOLUTION: This sealing resin composition is such one as to be used between semiconductor chips in flip chip mounting and wiring boards, being obtained pref. by compounding >=50 wt.% of a filler in a resin composition comprising 100 pts.wt. of a bisphenol F-type epoxy resin as the main agent, 100-110 pts.wt. of methylnadic anhydride as curing agent and 1 pt.wt. of a phenylimidazole compound as curing promoter. This composition has a precure viscosity at <=4,000 mPa.s, postcure glass transition temperature at >=140 deg.C and moisture absorption at <=0.5 wt.%.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for protecting a semiconductor device in flip-chip mounting in which a projecting electrode formed on a semiconductor device and an electric wiring formed on a substrate are connected by using a conductive adhesive or solder. The present invention relates to a sealing resin composition used for the above.

[0002]

2. Description of the Related Art In recent years, semiconductor devices having a large number of electrode terminals have been developed as electronic circuits become more sophisticated. A typical example is FCBG, a surface-mount type multi-terminal package using flip-chip mounting technology.
A (Flip Chip Ball Grid Arr
ay).

FIG. 5 is a sectional view showing a conventional FCBGA. As shown in FIG. 5, the semiconductor chip 1
Is provided with a connection electrode 3 for flip chip mounting, a pad electrode 4 for providing a solder bump 6 on the lower surface side, and a through hole 14 for connecting the connection electrode 3 and the pad electrode 4 and a wiring 15 are formed. A wiring board 18 provided with a resist 5 for protection; a resin film 12 for protecting circuit elements on the semiconductor chip 1; a protruding electrode 10 formed on the semiconductor chip 1; A connection material 13 such as a conductive adhesive or solder for connecting the semiconductor chip 1 to the wiring board 18, and a solder bump on the pad electrode 4 of the wiring board 18. 6 is provided.

The characteristics of a sealing resin composition required to obtain high reliability in a semiconductor package such as FCBGA are as follows.

(1) To quickly flow into a gap between a semiconductor chip and a wiring board. In the case of FCBGA, the gap between the semiconductor chip and the wiring board is as narrow as 40 to 100 μm.

(2) The pot life is long and the viscosity does not change for a long time at room temperature. If the viscosity changes while the sealing resin composition is used at room temperature for a long time, the application amount of the sealing resin composition varies, or the flowability decreases.

(3) It has excellent insulation properties. The low insulation resistance of the sealing resin composition for protecting the semiconductor device causes a leakage current, consumes more power than originally used, and lowers the original performance of the semiconductor chip.

(4) The sealing resin composition has low moisture absorption. When the wiring substrate is heated in a heating furnace to mount the wiring board on the motherboard substrate in a state in which the sealing resin composition has absorbed moisture, the absorbed moisture evaporates and expands to generate stress. At this time, F
In CBGA, peeling occurs at an interface between a resin film for protecting circuit elements on a semiconductor chip and a resist for protecting wiring on a wiring board and a sealing resin composition. In addition, blistering occurs, which is commonly referred to as the popcorn phenomenon of the package.

(5) Since the semiconductor chip and the wiring board are made of materials having different thermal expansion coefficients because of high heat resistance, the semiconductor chip and the wiring board are connected while repeating expansion and contraction due to a change in temperature. Stress is applied to the base of the protruding electrode and the connection material, resulting in disconnection. In order to disperse the stress over the entire surface under the semiconductor chip without concentrating the stress on the connection portion, a glass transition temperature is required at which the strength of the sealing resin composition does not decrease even at a high temperature. And the like.

[0010]

The conventional encapsulating resin compositions do not satisfy all the properties required for FCBGA, such as fluidity, pot life, insulation, hygroscopicity, and heat resistance. There was a problem that sufficient performance could not be obtained in the reliability test.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and provide a sealing resin composition having optimal properties as a sealing resin composition used for FCBGA, such as fluidity, long pot life, moisture resistance, heat resistance, and insulation. It is to provide a resin composition.

[0012]

Means for Solving the Problems In order to solve the above problems, the sealing resin composition of the present invention employs the following constitution.

The sealing resin composition used between the semiconductor chip and the wiring board of the present invention has a viscosity of 4000 mPa · s or less,
The cured product has a glass transition temperature of 140 ° C. or higher and a moisture absorption of 0.1%.
It is not more than 5% by weight.

The encapsulating resin composition used in the flip-chip mounting of the present invention comprises 100 parts by weight of a bisphenol F type epoxy resin as a main component, 100 to 110 parts by weight of a methylnadic anhydride as a curing agent, and phenylimidazole as a curing accelerator. For the resin composition containing 1 part by weight of
It is characterized by containing 50% by weight or more of a filler.

The sealing resin composition of the present invention is characterized by using 100 parts by weight of a bisphenol AD epoxy resin as a main ingredient instead of the bisphenol F epoxy resin described above.

In the sealing resin composition of the present invention, the particle size of the curing accelerator is 10 μm or less on average, and at most the flip chip B
It is characterized by being smaller than the gap between the GA semiconductor chip and the wiring board.

The encapsulating resin composition of the present invention comprises 100 parts by weight of a bisphenol F type or bisphenol AD type epoxy resin as a main component, 100 to 110 parts by weight of a methylnadic anhydride as a curing agent, and phenyl as a curing accelerator. For those containing 1 part by weight of imidazoles,
Contains 50% by weight or more of spherical SiO2 as a filler, has excellent fluidity, pot life, moisture resistance, insulation, and heat resistance, and has excellent workability and reliability when used for flip chip mounting, especially for FCBGA. It has become.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION The sealing resin composition of the present invention will be described below.

In order to determine the main agent suitable for the sealing resin composition for FCBGA, a liquid epoxy resin, bisphenol AD type, bisphenol F type, a mixture of 50% by weight of bisphenol F type and 50% by weight of bisphenol A type, Bisphenol A type and novolak type epoxy are used, methylnadic anhydride (hereinafter referred to as MNA) is used as a curing agent, and 2-phenyl-4-methyl-5-hydroxymethylimidazole (hereinafter 2P4) is used as a curing accelerator.
Using MHZ), the viscosity, fluidity, and glass transition temperature of the encapsulating resin composition containing 50% by weight of an SiO2 filler were measured with respect to the mixture of the components. The results are shown in Table 1.

[0020]

[Table 1]

The molecular weight of the epoxy resin (base) used at this time is 325 for bisphenol AD type, 312 for bisphenol F type, 338 for bisphenol A type and 481 for novolak type.

The amount of MNA as a curing agent is determined by using the value of molecular weight of acid anhydride / epoxy equivalent as bisphenol A
105 parts by weight for D type, 1 for bisphenol F type
05 parts by weight, 100 parts by weight for a mixture of bisphenol F type and bisphenol A type, 94 parts by weight for bisphenol A type, and 102 parts by weight for novolak type. The amount of 2P4MHZ, which is a curing accelerator, is
It was blended so as to be 1 part by weight with respect to 0 parts by weight.

The glass transition temperature was evaluated by the TMA method and DSC.
It was measured by the method. The measurement conditions of the TMA method are as follows. The cured sealing resin composition is heated at a rate of 10 ° C./min.
Expansion of the sealing resin composition when heated to 5 to 300 ° C.,
The change in shrinkage was read, and the DSC method was used to cure the cured sealing resin composition in a nitrogen atmosphere at a rate of 10 ° C./min.
The change in heat generation and heat absorption of the sealing resin composition when heated to 300 ° C. was read. The viscosity was measured with an E-type viscometer at 25 ° C. at a rotation speed of 10 rpm.
A semiconductor chip on which a bump electrode of cm cm was formed was flip-chip mounted on a wiring board, the sealing resin composition was poured into a gap between the semiconductor chip and the wiring board, and the time required to flow over the entire surface under the semiconductor chip was measured. At this time, the wiring board was heated to 80 ° C., and the gap between the semiconductor chip and the wiring board was set to 60 μm.

As shown in Table 1, novolak type, bisphenol A type, bisphenol F type and bisphenol A
The mixture of the molds has a good glass transition temperature, but has a high viscosity and has a problem in fluidity as a sealing resin composition. Bisphenol AD type and bisphenol F type have both good fluidity and good glass transition temperature. It turned out that the characteristic was shown. The glass transition temperature in this experiment was measured by the TMA method and the DSC method.
Although the glass transition temperature is shown to be high, there is no difference in other characteristics and tendencies. Therefore, it was found that the glass transition temperature should be obtained by either the TMA method or the DSC method.

Next, in order to find out the most suitable curing agent as a sealing resin composition for FCBGA, a bisphenol F type epoxy was used as a main component, and a curing agent which was liquid and had a large amount added in consideration of lowering the viscosity. Is preferably a liquid acid anhydride, methylhexahydrophthalic anhydride (hereinafter referred to as M
HHPA), methyl tetrahydrophthalic anhydride (hereinafter referred to as MTHPA), MNA, and tetrapropenyl succinic anhydride (hereinafter referred to as TPSA) were used.

The pot life, glass transition temperature, and fluidity of a resin composition containing 50% by weight of an SiO 2 filler were measured for an adhesive prepared using 2P4MHZ as a curing accelerator. The results are shown in Table 2. It became.

[0027]

[Table 2]

The amount of the acid anhydride as a curing agent is determined by using the value of the molecular weight of the acid anhydride / epoxy equivalent as 99 parts by weight for MHHPA, 98 parts by weight for MTHPA, 105 parts by weight for MNA, and TPSA. In this case, it was 158 parts by weight.

The addition amount of 2P4MHZ as a curing accelerator was 1 part by weight with respect to 100 parts by weight of the main agent.

The glass transition temperature and fluidity were evaluated by the methods described above, and the pot life was evaluated at 25 ° C.
The time when the viscosity after kneading doubled at that time was measured with an E-type viscometer.

As shown in Table 2, MHHPA, MTHP
A has good fluidity but has problems in glass transition temperature and pot life, and TPSA has good fluidity and pot life but has problems in glass transition temperature. On the other hand, it was found that MNA exhibited good properties in glass transition temperature, pot life, and fluidity.

In order to examine the optimum amount of MNA to be added, the relationship between the glass transition temperature and the moisture absorption at each added amount was measured.
The result is shown in FIG. As the glass transition temperature, a value measured by the TMA method was used.

As a main component, bisphenol F type epoxy is used, and MNA is used as a curing agent at a ratio of 1 to 100 parts by weight of the main component.
A resin composition containing 80 to 150 parts by weight at intervals of 0 parts by weight and containing 50 parts by weight of a SiO2 filler to an adhesive containing 1 part by weight of 2P4MHZ as a curing accelerator based on 100 parts by weight of a main component. It was used.

The glass transition temperature was measured by the method described above, and the moisture absorption was calculated by heating and curing the resin composition having the above composition, placing it in an atmosphere of 85 ° C. and 85% for 168 hours, and calculating the weight change before and after the loading.

As shown in FIG. 1, the glass transition temperature is MN
As the amount of A added increased, it tended to increase, and the moisture absorption showed the lowest value between 100 and 110 parts by weight. MN
From the balance between the glass transition temperature and the moisture absorption, it was found that it is preferable to add 100 to 110 parts by weight of A based on 100 parts by weight of the main agent.

In order to find out the most suitable curing accelerator as a curing accelerator when MNA is used as a curing agent for a sealing resin composition for FCBGA, the flowability when using an imidazole having an excellent glass transition temperature and a pot were investigated. When the life and the glass transition temperature were measured, the results shown in Table 3 were obtained. (Addition amount) in the table indicates parts by weight.

[0037]

[Table 3]

100 parts by weight of bisphenol F type epoxy as a main ingredient, 100 parts by weight of MNA as a curing agent, 2-methylimidazole (2MZ) as a curing accelerator,
-Ethyl-4-methylimidazole (2E4MZ), 1
-Cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN), 1-benzyl-2-methylimidazole (1B2MZ), trimellitic acid salt of 1-cyanoethyl-2-ethyl-4-methylimidazole (2E
4MZ-CNS), 2-phenyl-4-methyl-5-hydroxymethylimidazole (2P4MHZ), 2-phenyl-4,5-dihydroxymethylimidazole (2
PHZ), 2-phenylimidazole (2PZ), 2-
A resin composition containing 50% by weight of an SiO2 filler, based on an addition amount of phenyl-4-methylimidazole (2P4MZ) showing the best properties of fluidity, pot life and glass transition temperature. did.

The glass transition temperature, the pot life, and the evaluation of fluidity were measured by the methods described above.

As shown in Table 3, 2P4MHZ, 2PH
Z, 2P4MZ, and 2PZ showed good properties in all of fluidity, pot life, and glass transition temperature. From this, 2P4MH is used as a curing accelerator for MNA acid.
Z, 2PHZ, 2P4MZ or 2PZ as main agent 1
It was found that when the content was 1 part by weight with respect to 00 parts by weight, good properties were obtained in terms of fluidity, pot life, and glass transition temperature.

From the results shown above, it was found that phenylimidazoles were suitable as a curing accelerator when using methylnadic anhydride as a curing agent for the sealing resin composition for FCBGA. Since it is a solid, it needs to be powdered and mixed with the base material and the curing agent.

Although a small amount of the curing accelerator has a reaction promoting effect, if the small amount of the curing accelerator is not dispersed as uniformly as possible in the encapsulating resin composition, the curing reaction becomes uneven, and the crosslinking reaction becomes difficult. It is not performed sufficiently, and the physical properties of the cured product change.

The smaller the particle size of the curing accelerator, the finer the particles can be dispersed. Therefore, when the particle size of the curing accelerator used in the sealing resin composition was changed, the difference in glass transition temperature was examined. The results were as shown.

[0044]

[Table 4]

The sealing resin composition used at this time was 100 parts by weight of bisphenol F type epoxy as a main ingredient, 100 parts by weight of MNA as a curing agent, and 2 parts by weight of a curing accelerator.
One containing 1 part by weight of P4MHZ was used.

The average particle size of the curing accelerator is 5, 10, 1
The glass transition temperature of the cured product was measured by the method described above using a sample having a particle size of 5, 20 μm.

As shown in Table 4, the glass transition temperature tends to decrease as the average particle size of the curing accelerator becomes 10 μm or more. This is presumably because as the particle size of the curing accelerator increases, it becomes difficult to uniformly and finely disperse it in the resin composition, and the crosslinking reaction is not sufficiently performed.

Naturally, the particle size of the effect accelerator is FCBGA
Although a particle size smaller than the gap between the semiconductor chip and the wiring board is required, when a small amount of a solid curing accelerator is added, by using a particle having a particle size of 10 μm or less, the particles can be uniformly and finely dispersed in the resin composition. It can be seen that the composition can be dispersed and the effect of the curing accelerator can be sufficiently exhibited.

From the above results, the adhesive composition of the sealing resin composition for FCBGA contained 100 parts by weight of bisphenol F type or bisphenol AD type epoxy as the main component and 100 to 110 parts by weight of MNA as a curing agent. And 2P4MHZ, 2PHZ, 2P
It was found that those containing 1 part by weight of phenylimidazoles such as P4MZ and 2PZ exhibited good properties such as fluidity, pot life, heat resistance, and moisture absorption. Further, it is desirable that the particle size of the curing accelerator be at most equal to or less than the gap between the FCBGA semiconductor chip and the wiring board, and at most 10 μm or less.

The characteristics required for the reliability of FCBGA were examined. First, items to evaluate FCBGA include popcorn resistance, insulation property, and temperature cycle resistance.
There is the C standard, which has the contents shown in Table 5.

[0051]

[Table 5]

In the JEDEC standard, there are three levels. At the level 3, the FCFC is 192 hours at 30 ° C. and 60% atmosphere.
If the sealing resin composition is not peeled or swelled when the BGA is loaded and then the FCBGA is loaded three times under the temperature conditions for mounting on the motherboard, the FCBGA is heated at 30 ° C. 60 ° C.
It is guaranteed that it can be mounted on a motherboard without pre-drying even if it is left in an atmosphere for one week.

For level 2, when the FCBGA is charged in an atmosphere of 85 ° C. and 60% for 168 hours, and then the FCBGA is charged three times under the temperature conditions for mounting on the motherboard, peeling and swelling of the sealing resin composition must occur. For example, FCBG
Even if A is left at 30 ° C. and 60% atmosphere for one year, it is guaranteed that it can be mounted on the motherboard without pre-drying.

As for Level 1, when the FCBGA is charged in an atmosphere of 85 ° C. and 85% for 168 hours, and then the FCBGA is charged three times under the temperature conditions for mounting the motherboard, peeling and swelling of the sealing resin composition must occur. For example, FCBG
Even if A is left unrestricted in an atmosphere of 30 ° C. and 90%, it is guaranteed that it can be mounted on the motherboard without pre-drying.

The sealing resin was introduced under the conditions of each level, and the moisture absorption was determined from the change in weight and the volume. Then, the relationship between the moisture absorption rate and the popcorn resistance was examined using the sealing resin compositions having different moisture absorption rates, and the result was as shown in FIG.

The sealing resin composition used at this time was 100 parts by weight of a bisphenol F type epoxy resin as a main component, 100 parts by weight of MNA as a curing agent, and 2P4 as a curing accelerator.
Three kinds of adhesives containing 10, 30 and 50% by weight of an SiO2 filler were used for an adhesive containing 1 part by weight of MHZ.

As shown in FIG. 2, when the FCBGA was sealed using a sealing resin composition in which the moisture absorption rate of the sealing resin composition was changed depending on the filler content, the presence or absence of the occurrence of the popcorn phenomenon was exceeded. Observation was performed using a sound wave observation device. The open sample in FIG. 2 having a moisture absorption of 0.5% by weight or less when applied to each test of the JEDEC standard did not show any popcorn phenomenon, and showed moisture absorption when applied to each test of the JEDEC standard. The popcorn phenomenon was observed in the black sample in FIG. 2 in which the ratio was 0.5% by weight or more. From this, 85 ° C 8
If the moisture absorption of the encapsulating resin composition is less than 0.5% by weight when charged in a 5% atmosphere for 168 hours, no popcorn phenomenon occurs under any test conditions, and the encapsulating resin composition suitable for FCBGA is used. It can be said that it is a thing.

Next, characteristics required for insulating properties of FCBGA were examined. Low insulation resistance in the sealing resin composition that protects the semiconductor chip causes leakage current, consumes more power than originally used, and lowers the original performance of the semiconductor chip. Generally, there is no problem if the insulation resistance of the sealing resin composition is 10 ¹⁰ Ω or more.

The evaluation of the insulation resistance tends to decrease due to moisture absorption of the sealing resin composition.
It is said that there is no problem in insulation if the insulation resistance of the encapsulating resin composition after being added for 168 hours in an environment of 0% and 2 atm is 10 ¹⁰ Ω or more.

The relationship between the moisture absorption rate and the insulation resistance was examined using sealing resin compositions having different moisture absorption rates, and the results were as shown in FIG.

The sealing resin composition used at this time was 100 parts by weight of a bisphenol F type epoxy resin as a main ingredient, 100 parts by weight of a MNA as a curing agent, and 2P4 as a curing accelerator.
An adhesive containing 1 part by weight of MHZ and a filler containing 30, 40, and 50% by weight of a SiO2 filler were used.
Type used.

As shown in FIG. 3, the sealing resin composition in which the moisture absorption was changed according to the filler content showed no difference in the cured state and showed a good insulation resistance of 10 ¹⁵ Ω. After moisture absorption, as the moisture absorption rate increases, the insulation resistance decreases more drastically. In order to maintain the insulation resistance at 10 ¹⁰ Ω or more in an environment of a temperature of 121 ° C., a humidity of 100%, a pressure of 2 atm, and a duration of 168 hours, the popcorn resistance must conform to the JEDEC standard. It is understood that the moisture absorption rate must clear level 1. 2 and 3
It was found that the most effective amount of the filler was 50% by weight.

The characteristics required for the temperature cycle resistance of FCBGA were examined. In a semiconductor package such as FCBGA, a plurality of materials having different thermal expansion coefficients are used, and a stress is generated due to a difference in thermal expansion coefficient due to a temperature change.

In the FCBGA, stress tends to concentrate particularly on the connection between the semiconductor chip and the wiring board, and the presence of the sealing resin composition around the connection causes the strength of the connection to be reinforced and the thermal expansion coefficient difference to increase. Can withstand the stress caused by the

However, when the sealing resin composition exceeds the glass transition temperature, the sealing resin composition softens into a rubber-like state, so that it is impossible to reinforce the strength of the connection part, and stress is directly applied to the connection part, and Since it is destroyed, a sealing resin composition having a high glass transition temperature is required.

FIG. 4 shows the results of examining the incidence of defective connections at the time of injection into a temperature cycle test using sealing resin compositions having different glass transition temperatures. The glass transition temperature is T
The value measured by the MA method was used.

The test conditions were one cycle when the temperature was maintained at -55 ° C. and 150 ° C. for 30 minutes each, and the defect occurrence rate when the cycle was continued up to 1000 cycles was examined.

The encapsulating resin composition used at this time used bisphenol F type epoxy as a main component and MNA as a curing agent at intervals of 10 parts by weight with respect to 100 parts by weight of the main component.
0 to 130 parts by weight, as a curing accelerator, 2P4M
A resin composition containing 50% by weight of an SiO2 filler with respect to an adhesive containing 1 part by weight of HZ based on 100 parts by weight of the main component was used.

As shown in FIG. 4, when the glass transition temperature of the encapsulating resin composition is 140 ° C. or lower, a defect tends to occur, and the encapsulating resin composition having a glass transition temperature of 140 ° C. or higher. Good results were obtained without any defects in the product.

From the above results, the properties of the cured sealing resin composition required for FCBGA are as follows.
The flowability is improved by setting the glass transition temperature to not more than 000 mPa · s, and the moisture absorption rate when the glass transition temperature of the cured product is 140 ° C. or higher, the temperature is 85 ° C., and the humidity is 85% is 168 hours.
It was found that when the content was 5% by weight or less, the reliability of FCBGA such as popcorn resistance, insulation properties, and temperature cycle resistance was improved.

In the above evaluations, bisphenol AD type epoxy was used as the main agent, or 2PHZ or 2P4
Similar results were obtained when phenylimidazoles such as MZ and 2PZ were used as curing accelerators.

The same effect can be obtained by using calcium carbonate as the filler material for the sealing resin composition for FCBGA.
The shape includes a crushed type, a spherical shape, a cubic shape, and the like. It is preferable to use a spherical shape from the viewpoint of fluidity, but other shapes do not pose any problem. If the maximum value of the particle diameter is equal to or smaller than the gap between the semiconductor chip and the wiring board, there is no problem in operation.

Further, since α-rays generated from radioactive substances contained in the filler may rewrite the contents of the recording circuit element of the semiconductor chip, the content of the radioactive substance in the filler is 0.1 ppb or less. It is preferred that

Depending on the application, a coupling agent, a surfactant or the like may be added or colored with carbon in order to improve the adhesive strength and wettability of the sealing resin composition.

[0075]

As is apparent from the above description, the encapsulating resin composition of the present invention contains 100 parts by weight of a bisphenol F type or bisphenol AD type epoxy as a main component and 100 parts by weight of methyl nadic anhydride as a curing agent. ~ 11
0% by weight, and as a curing accelerator, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methylimidazole, 2-phenylimidazole, etc. The filler content is 50% by weight or more based on 1 part by weight of phenylimidazoles, showing good properties such as fluidity, pot life, heat resistance and moisture absorption, and is required for FCBGA. As a result, a sealing resin composition that sufficiently satisfies reliability such as popcorn resistance, insulation properties, and temperature cycle characteristics is obtained.

[Brief description of the drawings]

FIG. 1 is a graph showing the relationship between the amount of a curing agent added to a sealing resin composition, the glass transition temperature, and the moisture absorption rate in Examples of the present invention.

FIG. 2 shows JE of a sealing resin composition in an example of the present invention.
It is a graph which shows the moisture absorption rate in DEC standard.

FIG. 3 is a graph showing a relationship between a moisture absorption time and an insulation resistance of a sealing resin composition in an example of the present invention.

FIG. 4 is a graph showing the relationship between the glass transition temperature of a sealing resin composition and the incidence of defects in Examples of the present invention.

FIG. 5 is a cross-sectional view showing a structure of a conventional FCBGA.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor chip 2 Resin substrate 3 Connection electrode 4 Pad electrode 5 Resist 6 Solder bump 10 Projection electrode 11 Sealing resin composition 12 Resin film 13 Connection material 14 Through hole 15 Wiring 16 Thermal via hole 18 Wiring board

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C08K 7/00 C08K 7/00 H01L 23/29 H01L 23/30 R 23/31

Claims (4)

[Claims] 1. A sealing resin composition used between a semiconductor chip and a wiring board in flip chip mounting,
A sealing resin composition, wherein the viscosity of the sealing resin composition before curing is 4000 mPa · s or less, the glass transition temperature after curing is 140 ° C. or more, and the moisture absorption is 0.5% by weight or less. 2. A sealing resin composition used between a semiconductor chip and a wiring board in flip chip mounting,
100 parts by weight of a bisphenol F type epoxy resin as a main agent and 100 to 1 of methylnadic anhydride as a curing agent
A sealing resin composition comprising 50 parts by weight or more of a filler based on 10 parts by weight of a resin composition containing 1 part by weight of a phenylimidazole as a curing accelerator. 3. The encapsulating resin composition according to claim 2, wherein bisphenol AD epoxy resin is used as a main agent in an amount of 100 parts by weight. 4. The encapsulating resin composition according to claim 1, wherein the particle size of the curing accelerator is 10 μm or less on average, and at most a gap between the semiconductor chip and the wiring board. A sealing resin composition.