JP2000077604A - Surface mount component module and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To better manufacturing efficiency and miniaturize a module in which components and a cap covering the surface mounted components are surface mounted on a substrate and its manufacturing method. SOLUTION: In an elastic surface wave module 20, filters 22, 23, a chip component 32, and a cap 14 covering them are mounted on a substrate 11, and an opening part 30 is provided in a side face of the cap 14 so as to observe the filters 22, 23 and the chip component 32 positioned in the cap from outside the cap. Thus, even if the filters 22, 23, the chip component 32, and the cap 14 are collectively mounted on the substrate 11 in order to better manufacturing efficiency, it becomes possible to inspect a mounted state of the filters 22, 23 and the chip component 32 after this mounting process.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount component module and a method for manufacturing the same, and more particularly to a surface mount component module for mounting a surface mount component and a cap for covering the surface mount component on a substrate, and a method for manufacturing the same.
2. Description of the Related Art In recent years, miniaturization of portable electronic devices represented by, for example, cellular phones has been progressing at a rapid pace. At the same time,
These portable electronic devices are required to have high reliability.

Therefore, it is necessary to realize miniaturization and high reliability also in the surface mount component modules mounted on these portable electronic devices.

[0003]

2. Description of the Related Art An elastic surface module will be described as an example of a conventional surface mount component module. FIG.
2 shows an elastic surface module 10 which is an example of a conventional surface mount component module. FIG. 1 is a perspective view of the elastic surface module 10, and FIG. 2 is a sectional view thereof.

The elastic surface module 10 shown in each figure is a so-called duplexer in which a transmitting-side SAW filter 12 and a receiving-side SAW filter 13 are surface-mounted on one substrate 11. The elastic surface module 10 roughly includes a substrate 11, a transmitting-side SAW filter 12, and a receiving-side SAW filter.
It is composed of a filter 13, a cap 14, and the like.

The substrate 11 has, for example, a structure in which a platinum pattern (not shown) is formed on a ceramic substrate.
On this substrate 11, a transmitting SAW filter 12 and a receiving SAW filter 13 are surface-mounted. Each of the filters 12, 13 has metal filter caps 12a, 13a that cover the outer periphery and realize a shielding effect. The filter caps 12a and 13a are joined to a ground pattern formed on the substrate 11 by filter joining solder 16.

The cap 14 is made of metal and has a box-like shape with a bottom. The cap 14 is joined to the substrate 11 using cap joining solder 25 so as to cover the filters 12 and 13. In this connection, the cap 14 is connected to a ground pattern formed on the substrate 11. This allows
The active portion (comb-shaped electrode) formed in each of the filters 12, 13 is shielded by the cap 14 in addition to the filter caps 12a, 13a, so that the intrusion of disturbance can be reliably prevented. The cap 14 covers both the filters 12 and 13 so that, for example, the surface acoustic wave module 10 can be used in portable electronic devices.
When transporting and mounting, the top plate portion of the cap 14 can be suctioned and transported, and the convenience of handling at the time of mounting can be improved.

Although not shown in FIGS. 1 and 2,
On the substrate 11, in addition to the filters 12 and 13 described above,
Chip components such as capacitors and resistors are surface-mounted.
This chip component is also configured to be located inside the cap 14 when the cap 14 is bonded to the substrate 11. 3 and 4 are views for explaining a method of manufacturing the surface acoustic wave module 10 having the above-described configuration. To manufacture the surface acoustic wave module 10, first, a substrate 11 is prepared as shown in FIG.

Then, each filter 1 is placed on the substrate 11.
2 and 13 and the chip component are surface-mounted, and the filter caps 12 a and 13 a are joined to the substrate 11. Specifically, the filters 12, 1 are formed using cream solder.
3, chip parts and filter caps 12a, 13
a is mounted at a predetermined position on the substrate 11, and then is sent into a reflow furnace to perform a reflow process (first reflow process).

As a result, the solder in the cream solder is melted and the organic components contained therein are scattered, and the filters 12, 13 (the filter caps 12a,
13a) and the chip components are soldered. Subsequently, an inspection process is performed to visually inspect whether each of the filters 12 and 13 (including the filter caps 12 a and 13 a) and the chip component is properly soldered to the substrate 11.

In this inspection process, when it is determined that the filters 12, 13 and the like are properly soldered to the substrate 11, the process of joining the cap 14 to the substrate 11 is continued as shown in FIG. Done. Specifically, the cap 14 is attached to a predetermined position on the substrate 11 using cream solder, and subsequently, the cap 14 is fed into a reflow furnace to perform a reflow process (second reflow process).

As a result, the cap 14 is joined to the substrate 11 by soldering. Subsequently, an inspection process is performed to check whether the cap 14 is properly soldered to the substrate 11 or not. Then, in this inspection processing, it is determined that the cap 14 is properly soldered to the substrate 11, whereby the surface acoustic wave module 10 shown in FIG. 1 is completed.

[0012]

However, in the above-described surface acoustic wave module 10 (surface mount component module), first, the filters 12 and 13 are mounted on the substrate 11 (first reflow processing), and thereafter, Since the joining process (second reflow process) of the cap 14 is performed, there is a problem that the manufacturing process is complicated and the manufacturing efficiency is reduced.

In order to improve the manufacturing efficiency, the mounting process of the filters 12 and 13 and the joining process of the cap 14 may be collectively performed, and the mounting process may be performed by a single reflow process. In the structure 14, when the cap 14 is bonded to the substrate 11, it is not possible to perform an appearance inspection of the filters 12 and 13 disposed inside the cap. Therefore, when the filters 12 and 13 and the cap 14 are mounted by one reflow process, there is a problem that the yield of the manufactured surface acoustic wave module 10 deteriorates.

Conventionally, the cap 14 is attached to the filter 1.
2 and 13 are separately bonded to the substrate 11, so that the solder 15 for joining the caps needs to be arranged on the outer periphery of the cap 14, and the substrate 11 has an area corresponding to the area required for the soldering.
There is also a problem that the surface acoustic wave module 10 becomes large. The present invention has been made in view of the above points, and an object of the present invention is to provide a surface mount component module capable of improving manufacturing efficiency and reducing the size of the module, and a method for manufacturing the same.

[0015]

Means for Solving the Problems In order to solve the above problems, the present invention is characterized by taking the following means. The invention according to claim 1 further comprises a surface-mounting a plurality of surface-mounted components on a substrate, and a cap for covering the plurality of surface-mounted components. In a surface mount component module configured to be joined to a tall surface mount component,
An opening for observing the surface-mounted component is formed in a side surface of the cap.

According to a second aspect of the present invention, in the surface mount component module according to the first aspect, a notch portion is formed on the substrate, and a projection is formed at a position facing the notch portion forming position of the cap. And wherein the projections engage with the notches when the cap is mounted on the substrate.

According to a third aspect of the present invention, in the surface mount component module according to the second aspect, electrical connection between the substrate and the cap is established at an engagement position between the projection and the notch. It is characterized in that it is configured to carry out. According to a fourth aspect of the present invention, in the surface mount component module according to any one of the first to third aspects, the cap is formed of a conductive metal, and the cap and the tallest surface mount component are provided. Is characterized in that solder is used as a joining material for joining.

According to a fifth aspect of the present invention, in the surface mount component module according to any one of the first to fourth aspects, the cap is formed of a conductive metal, and the cap and the tallest part are formed. The present invention is characterized in that a conductive resin is used as a bonding material for bonding to a surface mount component.

According to a sixth aspect of the present invention, in the surface mount component module according to any one of the first to fifth aspects, the cap is formed of a metal having good heat conductivity, and the cap and the cap are connected to each other. It is characterized in that the tallest surface mount component is thermally connected.

According to a seventh aspect of the present invention, in the surface mount component module according to any one of the first to third aspects, an insulating material is used as a joining material for joining the cap and the tallest surface mount component. It is characterized by using a conductive resin. An eighth aspect of the present invention is the surface mount component module according to any one of the first to seventh aspects, wherein the surface mount component is a surface acoustic wave device.

According to a ninth aspect of the present invention, in the surface-mounted component module according to the eighth aspect, the surface acoustic wave device includes a filter cab that covers an outer periphery thereof. It is. According to a tenth aspect of the present invention, in the method of manufacturing a surface mount component module for surface mounting a plurality of surface mount components and a cap covering the plurality of surface mount components on a substrate, the cap is provided with the plurality of surface mount components. A first temporary joining step of temporarily joining a tallest surface-mounted component among the components via a first joining material, and a temporary joining of the surface-mounted component on the substrate via a second joining material; After the completion of the second temporary bonding step and the first and second temporary bonding steps, the first and second bonding materials are both subjected to heat treatment, and the bonding processing between the surface mount component and the substrate is performed. A mounting step of simultaneously performing a bonding process of the surface mount component and the cap, and an inspection step of inspecting a bonding state of the surface mount component and the cap to the substrate after the bonding step. Features

According to an eleventh aspect of the present invention, in the method of manufacturing a surface mount component module according to the tenth aspect, an opening is formed in a side surface of the cap, and the surface mount component is formed in the inspection step. The surface mounting state on the substrate is performed through the opening.

According to a twelfth aspect of the present invention, in the method of manufacturing a surface mount component module according to the tenth or eleventh aspect, solder is used as the first and second bonding materials, and reflow is performed as the heat treatment. Processing is performed. Claim 13
According to a preferred embodiment of the present invention, in the method of manufacturing a surface-mounted component module according to any one of claims 10 to 12, the surface-mounted component is a surface acoustic wave device.

Further, according to a fourteenth aspect of the present invention, in the surface mount component module according to the thirteenth aspect, the surface acoustic wave device includes a filter cab that covers an outer periphery thereof. It is. Each of the means described above operates as follows.

According to the first aspect of the present invention, the opening through which the surface-mounted component can be observed is formed in the side surface of the cap. The mounting state of the surface mount component mounted in the cap can be inspected. In addition, since the cap is joined to the tallest surface-mounted component among the plurality of surface-mounted components, no gap is formed between the cap and the tall surface-mounted component. The height can be reduced.

According to the second aspect of the present invention, when the cap is mounted on the substrate, the projection formed on the cap is engaged with the notch formed on the substrate. The engagement between the projection and the notch allows the positioning of the substrate and the cap, thereby preventing the occurrence of a displacement between the substrate and the cap.

According to the third aspect of the present invention, electrical connection between the substrate and the cap is made at the engagement position between the projection and the notch, so that the positioning of the substrate and the cap and the electrical connection are achieved. Connections can be made simultaneously.
Further, the configuration can be simplified as compared with a configuration in which an electrical connection portion is provided in another portion of the cap.

According to the fourth and fifth aspects of the present invention, the cap is formed of a conductive metal,
By using solder or conductive resin as a joining material for joining the cap and the surface mount component, the cap and the surface mount component can be electrically connected. Therefore, by grounding the portion of the surface mounting component that connects to the cap, the cap can be used as an electromagnetic shield.

According to the sixth aspect of the present invention, the cap is formed of a metal having good thermal conductivity, and the cap is thermally connected to the surface mount component. It can be used as a heat dissipating member, and can efficiently dissipate the heat generated by the surface mount components.

According to the seventh aspect of the present invention, since the insulating resin is used as a joining material for joining the cap and the surface mount component, the cap and the surface mount component can be electrically insulated from each other. Can be joined. Further, as in the eighth, ninth, twelfth, and thirteenth aspects, a surface acoustic wave device can be used as the surface mount component.

According to the tenth aspect of the present invention, in the mounting step, after the first and second temporary joining steps are completed,
By heat-treating the first and second bonding materials together,
By simultaneously performing the bonding process between the surface-mounted component and the substrate and the bonding process between the surface-mounted component and the cap, the bonding process (mounting process) of the surface-mounted component and the cap is performed in a single heating process. It becomes possible. Therefore,
The manufacturing process can be simplified and the efficiency can be improved as compared with the conventional method of separately performing the bonding process of the surface mount component and the bonding process of the cap.

According to the eleventh aspect of the present invention, an opening is formed in the side surface of the cap, and the surface mounting state of the surface-mounted component on the substrate is inspected through the opening in the inspection step. Thereby, the inspection step can be performed after the mounting step is completed. Therefore, even when the bonding process between the surface mount component and the substrate and the bonding process between the surface mount component and the cap are performed at the same time, an accurate inspection process can be performed, and the reliability of the manufactured surface mount component module can be improved. Performance can be improved.

Further, according to the twelfth aspect of the present invention, a surface mount component module is manufactured at low cost and mass productivity by using solder as the first and second bonding materials and performing reflow processing as heat treatment. can do.

[0034]

Next, embodiments of the present invention will be described with reference to the drawings. FIGS. 5 to 7 show a conventional surface mount component module according to an embodiment of the present invention. In this embodiment, a surface acoustic wave module will be described as an example of the surface mount component module. However, the application of the present invention is not limited to the elastic surface module.

FIG. 5 is a perspective view of the elastic surface module 20, and FIG. 6 is a side view of the elastic surface module 20,
FIG. 7 is a sectional view of the elastic surface module 20. The elastic surface module 20 shown in each figure is a so-called duplexer in which a transmitting-side SAW filter 22 and a receiving-side SAW filter 23 are surface-mounted on one substrate 21. The elastic surface module 20 generally includes a substrate 21, a transmitting-side SAW filter 22, a receiving-side SAW filter 23, a cap 24, and the like.

The substrate 21 has, for example, a configuration in which a wiring pattern (not shown) is formed on a ceramic substrate.
A notch 31 is formed at a predetermined position of the substrate 21. The notch 31 is a groove formed by notching the substrate 21 in a substantially semicircular shape. In this embodiment, the notch 31 is formed at the center of a pair of opposing sides of the substrate 21. This substrate 2
1, a transmission-side SAW filter 22 and a reception-side SAW
The filter 23 is surface-mounted. Each filter 22,
23 has metal filter caps 22a and 23a which cover the outer periphery and realize a shielding effect. The filter caps 22a and 23a are joined to a ground pattern formed on the substrate 21 by filter joining solder 26.

On the substrate 21, each filter 22,
Along with 23, a chip component 32 is surface-mounted. The chip component 32 is, for example, a capacitor element or a resistance element, and is mounted on a wiring pattern formed on the substrate 21 using a component bonding solder 33. Although only one chip component 32 is shown in FIG. 5 for convenience of illustration, a plurality of the chip components 32 are provided on the substrate 21. 6 and 7, illustration of the chip component 32 is omitted.

On the other hand, the cap 24 is formed of a conductive metal having high thermal conductivity, and has a substantially box-like shape with a bottom. Specifically, FIGS. 5 to 7
In addition to the above, as shown in FIG.
7, the side wall portions 28a and 28b, the protruding portion 29A, and the opening portion 30 are provided. Side walls 28a, 28b
Is bent so as to extend vertically downward from the outer peripheral edge of the top plate 27. The height H2 of the side wall 28b is
It is configured to be smaller than the height H1 of the side wall portion 28a. Therefore, when the cap 24 is mounted on the substrate 21, the height H3 is set between the substrate 21 and the lower edge of the side wall 28b.
An opening 30 of (H3 = H1-H2) is formed.

By forming the opening 30 on the side surface of the cap 24, the inside of the cap 24 can be observed through the opening 30. Therefore, even after the cap 24 is bonded to the substrate 21 and mounted, the mounting state of each of the components 22, 23, and 32 mounted in the cap 24 via the opening 24 can be inspected. This point will be described later in detail.

The projecting portion 29A has a pair of side wall portions 28.
a are formed at the lower edge center position so as to protrude downward. The formation position of the protrusion 29A is set so as to correspond to the formation position of the notch 31 formed on the substrate 21 described above. Therefore, the cap 2 is
In the state in which 4 is mounted, the protrusion 29 </ b> A engages with the notch 31. In this manner, the engagement between the projection 29A and the notch 31 allows the positioning of the substrate 21 and the cap 24. Thereby, the substrate 2
1 can be prevented from moving on the
It is possible to prevent the occurrence of a displacement between the cap 1 and the cap 24.

The cap 24 having the above-described structure is mounted on the substrate 21 so as to cover each of the filters 22 and 23 and the chip component 32.
Joined on top. In this connection, in this embodiment, the cap 24 is not directly bonded to the substrate 21, but is bonded to the substrate 21 via the filters 22 and 23. That is, in the present embodiment, the cap 24 is connected to each filter 2 by the solder 25 for cap bonding (not shown in FIG. 5).
2, 23 are joined to the filter caps 22a, 23a. Then, the filter caps 22a, 2
The cap 24 is joined to the substrate 21 via the filters 22 and 23 by joining the 3a to the ground pattern of the substrate 21 with the filter joining solder 26.

The cap 24 is formed of a conductive metal, and the cap 24 and each of the filters 22 and 2 are formed.
Numeral 3 is mechanically and electrically joined by a cap joining solder 25. Further, the filter caps 22a and 23a of the filters 22 and 23 are also formed of a conductive metal, and the filter caps 22a and 23a and the substrate 21 are mechanically and electrically joined by the filter joining solder 24. . Therefore, the cap 24 is
The cap 24 can be electrically connected to the ground pattern formed on the first and the second cap 1, and the cap 24 can be used as an electromagnetic shield.

As a result, the active portions (comb-shaped electrodes) formed in each of the filters 22 and 23 are shielded by the cap 24 in addition to the filter caps 22a and 23a. Can be prevented. The cap 24 is configured to cover both the filters 22 and 23 so that, for example, when the surface acoustic wave module 20 is transported and mounted on a portable electronic device, the top plate 27 of the cap 24 is suctioned and adsorbed and transported. It is possible to improve convenience of handling at the time of mounting.

Further, the cap 24 is mounted on a surface mount component (filters 22, 23, chip component 32) formed on the substrate 21.
In this embodiment, the cap 24 is joined to the surface mounting component which is the tallest with respect to the substrate 21. In the case of the present embodiment, the filters 22 and 2
3 (the filters 22 and 23 have the same height) is the tallest component with respect to other surface mount components.

For this reason, in this embodiment, the cap 24 is joined to the filters 22 and 23. Thus, the filters 22 and 23, which are the tallest surface mount components,
By joining the cap 24 to the
Since the filters 22 and 23 are in close contact with each other, no gap is formed between them. On the other hand, as shown in FIG. 2, in the conventional surface acoustic wave module 10, the cap 14 is bonded to the substrate 11 and is not bonded to the filters 22 and 23 (tall components).
A gap ΔH is formed between the filter 22 and the filters 22 and 23. Therefore, this gap ΔH becomes an unnecessary space (so-called dead space), and the surface acoustic wave module 10 becomes thick and large.

However, in the surface acoustic wave module 20 of this embodiment, as shown in FIGS. 6 and 7, the cap 24 and the filters 22 and 23 are in close contact with each other and no gap is formed. The height can be reduced. Also, since the cap joining solder 25 is located inside the cap 24, FIGS.
The size of the substrate 21 can be reduced as compared with the conventional surface acoustic wave module 10 (the solder 15 for cap bonding is located outside the cap 14), and the size of the surface acoustic wave module 20 can be reduced. be able to.

Further, as described above, since the cap 24 is formed of a metal having good heat conductivity, the cap 24 and the filters 22 and 23 are in close contact with each other, so that the cap 24 and the filters 22 and 23 are thermally connected. Is also connected. Therefore, the cap 24 can be used as a heat radiating member, and the heat generated in each of the filters 22 and 23 is radiated through the cap 24. Thereby, the heat generated in each of the filters 22 and 23 can be efficiently radiated.

In the above-described embodiment, the configuration in which the projection 29A and the notch 31 are merely engaged is shown. However, an electrode film connected to the ground pattern is formed on the inner wall of the notch 31. The notch 31 and the projection 29A may be electrically connected. According to this configuration, the positioning and electrical connection of the substrate 21 and the cap 24 can be performed simultaneously.

Depending on the type of the surface mount component, there is also a case where the cap 24 does not need to have a shielding effect. In such a case, an insulating resin can be used as a joining material for joining the cap 24 and the surface mount component. Furthermore, in the present embodiment, the shape of the protrusion 29A is rectangular as shown in an enlarged manner in FIG. 10A, but the shape of the protrusion 29A is not limited to this. More specifically, as shown in FIG. 10B, the protrusion 29B may be a chamfered corner, or may be a protrusion 29C having a semicircular tip as shown in FIG. 10C. Alternatively, as shown in FIG. 10 (D), a protruding portion 29D having a sharp tip may be used. Thus, the protrusion 29
By appropriately setting the shapes of A to 29D, the protrusion 2
The engagement process between 9A to 29D and notch portion 31 can be easily performed.

Next, a method of manufacturing the surface acoustic wave module 20 shown in FIGS. 5 to 7 will be described. FIGS. 8 and 9 are views for explaining a method of manufacturing the surface acoustic wave module 20 having the above-described configuration. As shown in FIG. 8, in order to manufacture the surface acoustic wave module 20, the cap 24 must be provided with the tallest surface mount component among the plurality of surface mount components (in the case of this embodiment, each of the filters 22 and 23). ) Is temporarily joined using a cream solder 37 (see FIG. 9) (first temporary joining step). Further, the respective filters 22 and 23 and the chip component 32 are temporarily joined to the substrate 21 via the cream solder 38 (second temporary joining step).

The first temporary joining step and the second temporary connection step may be performed in any order. That is, after the cap 24 is temporarily bonded to the filters 22 and 23 as described above, the filters 22 and 23 are joined together with the chip component 32 to the substrate 2.
Alternatively, the cap 24 may be temporarily bonded to the filters 22 and 23 after the filters 22 and 23 and the chip component 32 are temporarily bonded to the substrate 21.

When the first and second temporary joining steps are completed, the filters 22 and 23 are successively connected as shown in FIG.
Then, the substrate 21 to which the cap 24 and the like are temporarily fixed by the cream solders 37 and 38 is sent to the reflow furnace 34 to perform a heating process (reflow process). The reflow furnace 34 has a heater 35 and a transport conveyor 36, and the substrate 21 is transported by the transport conveyor 36 in a direction indicated by an arrow X in FIG.

Then, in this transporting process, the solder contained in the cream solders 37 and 38 is melted by the heat of the heater 35, and the solder 25 for the cap joining, the solder 26 for the filter joining and the solder 33 for the component joining are generated. Is done. Thereby, the cap 24 and each filter 2
2, 23 are electrically and mechanically joined by a cap joining solder 25, and the substrate 21 and each of the filters 22, 2 are connected.
3 (including the filter caps 22a and 23a) is electrically and mechanically joined by the filter joining solder 26, and the substrate 21 and the chip component 32 are electrically and mechanically joined by the component joining solder 33. (Mounting process).

As described above, in this embodiment, in the mounting process, the bonding process between the cap 24 and each of the filters 22, 23, the substrate 21, the filters 22, 23, and the chip component 3 are performed.
2 are simultaneously performed. For this reason, the reflow process that was required twice in the conventional manufacturing method as described above with reference to FIGS. 3 and 4 can be performed in the manufacturing method according to the present embodiment in one reflow process. It becomes possible. Therefore, according to the manufacturing method of the present embodiment, it is possible to simplify the manufacturing process of the surface acoustic wave module 20 and reduce the manufacturing cost.

In the mounting process, the cream solder 3
Even if 7 is melted, the cap 24 is locked to the substrate 21 by the engagement of the projection 29A with the notch 31, so that the substrate 24 does not move on the substrate 21. Therefore, the cap 24 can be mounted on the substrate 21 with high positional accuracy. When the above-described bonding process is completed, the filters 22, 23, the cap 24,
Then, an inspection process for inspecting whether the chip component 32 is bonded to the substrate 21 in an appropriate state is performed (inspection step).

This inspection processing is an inspection mainly based on the appearance inspection. However, in the surface acoustic wave module 20 formed by the manufacturing method according to the present embodiment, the opening 30 is formed in the side surface of the cap 24, and the opening 3 is formed.
It is possible to observe the inside of the cap 24 through 0. That is, the provision of the opening 30 enables the inspection process to be performed after the mounting process is completed. Therefore, in the mounting process, the bonding process between the cap 24 and each of the filters 22 and 23,
Even when the bonding process with the chip components 2 and 23 and the chip component 32 is performed at the same time, it is possible to perform an accurate inspection process in a subsequent inspection process. Thereby, the reliability of the manufactured surface mount component module 20 can be improved while improving the manufacturing efficiency in the mounting process.

In the above-described embodiment, the opening 30 is formed on the side surface of the cap 24. However, the formation position of the opening is not limited to the side surface of the cap, but may be formed on the top plate of the cap. Is also possible. At this time, it is necessary to form the opening at a position other than the position where the tall part and the cap are joined. Further, in the above-described embodiment, the formation positions of the protrusion 29A and the notch 31 are set to two opposing positions. However, the number and position of the formation of the protrusion and the notch are not limited to this. Any other configuration may be used as long as the configuration can securely lock the substrate to the substrate.

[0058]

According to the present invention as described above, the following various effects can be realized. According to the first aspect of the present invention, even after the cap is bonded to the substrate and mounted, it is possible to inspect the mounting state of the surface mount component through the opening, thereby reducing the reliability of the surface mount component module. Can be improved.

Further, since the cap is joined to the tallest surface-mounted component among the plurality of surface-mounted components, no gap is formed between the cap and the tall surface-mounted component. The height of the component module can be reduced. According to the second aspect of the present invention, it is possible to position the substrate and the cap by the engagement of the projection and the notch, and to prevent the displacement between the substrate and the cap.

According to the third aspect of the present invention, the positioning of the substrate and the cap and the electrical connection can be performed at the same time. Simplification can be achieved. According to the fourth and fifth aspects of the present invention, the cap and the surface mount component can be electrically connected.
Therefore, for example, by grounding a portion of the surface mount component that is connected to the cap, the cap can be used as an electromagnetic shield.

According to the sixth aspect of the present invention, the cap can be used as a heat radiating member, and the heat generated by the surface mount component can be efficiently radiated.
According to the invention of claim 7, the cap and the surface mount component can be joined in an electrically insulated state. Further, according to the tenth aspect of the present invention, it is possible to collectively perform the bonding process (mounting process) of the surface mount component and the cap by one heat treatment, and thus to bond the surface mount component as in the related art. The manufacturing process can be simplified and the efficiency can be improved as compared with a method in which the processing and the joining processing of the cap are performed separately.

According to the eleventh aspect of the present invention, the inspection step can be performed after the mounting step is completed, so that the bonding process between the surface mounted component and the board and the connection between the surface mounted component and the cap can be performed. Even if the joining process is performed at the same time, an accurate inspection process can be performed thereafter. Therefore, the reliability of the manufactured surface mount component module can be improved.

Further, according to the twelfth aspect of the present invention, a solder is used as the first and second bonding materials, and a reflow process is performed as a heat treatment, thereby manufacturing a surface mount component module at low cost and mass productivity. can do.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a surface acoustic wave module which is an example of a conventional surface mount component module.

FIG. 2 is a sectional view showing a surface acoustic wave module which is an example of a conventional surface mount component module.

FIG. 3 is a view for explaining a method of manufacturing the surface acoustic wave module shown in FIG. 1 (part 1).

FIG. 4 is a view for explaining the method of manufacturing the surface acoustic wave module shown in FIG. 1 (part 2).

FIG. 5 is a perspective view showing a surface mount component module (surface acoustic wave module) according to one embodiment of the present invention.

FIG. 6 is a side view of the surface acoustic wave module shown in FIG.

FIG. 7 is a sectional view of the surface acoustic wave module shown in FIG.

FIG. 8 is a view for explaining the method of manufacturing the surface acoustic wave module shown in FIG. 5 (part 1).

FIG. 9 is a drawing for explaining the method of manufacturing the surface acoustic wave module shown in FIG. 5 (part 2).

FIG. 10 is a view showing a modification of the protruding portion.

[Explanation of symbols]

 REFERENCE SIGNS LIST 20 surface acoustic wave module 21 substrate 22 transmission side SAW filter 23 reception side SAW filter 24 cap 25 cap joining solder 26 filter joining solder 27 top plate portions 28a, 28b side wall portions 29A to 29D protrusion 30 opening 31 notch 32 Chip parts 33 Solder for joining parts 34 Reflow furnace 35 Heater 37,38 Cream solder

Continuation of front page (72) Inventor St. Koriike 4-1-1, Kamidadanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Prefecture Inside Fujitsu Limited

Claims (14)

[Claims] 1. A plurality of surface-mounted components are surface-mounted on a substrate, and a cap for covering the plurality of surface-mounted components is provided, wherein the cap is the tallest of the plurality of surface-mounted components. A surface mount component module configured to be joined to a surface mount component, wherein an opening through which the surface mount component can be observed is formed in a side surface of the cap. 2. The surface mount component module according to claim 1, wherein a notch is formed on the substrate, and a protrusion is formed at a position of the cap facing the notch formation position, and the cap is formed on the substrate. Wherein the projection is engaged with the notch when the device is mounted. 3. The surface mount component module according to claim 2, wherein an electrical connection between the substrate and the cap is made at an engagement position between the projection and the notch. Surface mount component module. 4. The surface mount component module according to claim 1, wherein the cap is formed of a conductive metal, and the cap is joined to the tallest surface mount component. A surface mount component module characterized by using solder as a component. 5. The surface mount component module according to claim 1, wherein the cap is formed of a conductive metal, and the cap is joined to the tallest surface mount component. A surface mount component module, wherein a conductive resin is used as the component. 6. The surface mount component module according to claim 1, wherein the cap is formed of a metal having good thermal conductivity, and the cap and the tallest surface mount component are connected to each other. A surface mount component module having a thermally connected configuration. 7. The surface mount component module according to claim 1, wherein an insulating resin is used as a joining material for joining the cap and the tallest surface mount component. Surface mount component module. 8. The surface mount component module according to claim 1, wherein the surface mount component is a surface acoustic wave device. 9. The surface mount component module according to claim 8, wherein the surface acoustic wave device includes a filter cab that covers an outer periphery thereof. 10. A method of manufacturing a surface mount component module in which a plurality of surface mount components and a cap covering the plurality of surface mount components are surface mounted on a substrate, wherein the cap is the most of the plurality of surface mount components. A first method of temporarily joining a tall surface mount component via a first joining material
A temporary bonding step, a second temporary bonding step of temporarily bonding the surface mount component on the substrate via a second bonding material, and after the first and second temporary bonding steps, A mounting process in which the first and second bonding materials are both heat-treated to simultaneously perform a bonding process between the surface-mounted component and the substrate and a bonding process between the surface-mounted component and the cap; An inspection step of inspecting a bonding state of the surface-mounted component and the cap to the substrate. 11. The method for manufacturing a surface mount component module according to claim 10, wherein an opening is formed in a side surface of the cap, and the surface mounting state of the surface mount component on the substrate is determined in the inspection step. A method of manufacturing a surface mount component module, wherein the method is performed through the opening. 12. The method for manufacturing a surface mount component module according to claim 10, wherein solder is used as the first and second bonding materials, and a reflow process is performed as the heat treatment. Manufacturing method of mounted component module. 13. The surface mount component module according to claim 10, wherein the surface mount component is a surface acoustic wave device. 14. The surface mount component module according to claim 13, wherein the surface acoustic wave device includes a filter cab that covers an outer periphery thereof.