JP2000076612A - Magnetic head and manufacture therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable easy mounting in conformity with a design of a record reproducing device by protecting a part connected to an external connection terminal and a connecting material, and a part connected to a terminal plate and a connection material with a protecting resin applied. SOLUTION: A head base 3 is composed of a head base body 40, a head tip mounting part 41, and a terminal plate 42. The head base body 40 is equipped with the head tip mounting part 41 on a side surface on which a heat tip 2 is bonded, and to a main surface 40a of the main body the terminal plate 42 is fixed. The head tip mounting part 41 is fixed to the head base body 40 at the long edge side of nearly trapezoidal body having a prescribed thickness, and, with the head tip 2 bonded to the short edge side, has a function as a base seat for the head tip. A pair of head tip connecting terminals 44a formed on the head tip 2 is each connected with connection materials 51, and to the connection part 51a a protection resin 52 is applied for protection, and thus defective connections such as discontinuity and contact short circuit are prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a magnetic head having a magnetic path formed by a metal magnetic thin film and a method of manufacturing the same.

[0002]

2. Description of the Related Art A magnetic head is mounted on a magnetic recording / reproducing device such as a video tape recorder (VTR), and records and / or reproduces information signals on a magnetic recording medium (hereinafter referred to as recording / reproducing). Is what you do.

In a magnetic head, a metal magnetic thin film is formed on each magnetic gap forming surface of a pair of magnetic core halves made of single crystal ferrite or the like, and the pair of magnetic core halves are joined to the magnetic gap forming surfaces. A so-called metal-in-gap (MIG) type magnetic head, which is integrated by bonding together, and a so-called laminated type magnetic head in which a metal magnetic thin film is sandwiched between nonmagnetic ceramic substrates have been proposed and put into practical use.

[0004] In order to cope with higher density and digitization of a recording signal in the field of magnetic recording, a magnetic head that can exhibit good electromagnetic conversion characteristics in a higher frequency band is desired. Further, it is desired that a magnetic head for a VTR be miniaturized in order to cope with miniaturization and high performance of the apparatus by mounting a plurality of magnetic heads on a small drum.

However, the above-mentioned MIG type magnetic head has a large impedance and is not suitable for use in a high frequency band. In addition, in the stacked magnetic head, since the thickness of the metal magnetic thin film forming the magnetic path needs to be reduced as the track width is reduced due to the increase in the density of the recording signal, the reproduction efficiency is reduced. Also, there is a limit to the miniaturization of the head.

Therefore, as a magnetic head capable of exhibiting good electromagnetic conversion characteristics in a high frequency band, for example, as described in JP-A-6-259717, "Magnetic head and its manufacturing method". A so-called bulk thin-film magnetic head has been proposed in which the impedance is reduced by shortening the magnetic path of a magnetic core manufactured by a thin-film forming process.

In this bulk thin film type magnetic head, a pair of magnetic core halves each having a metal magnetic thin film formed as a magnetic core on a nonmagnetic substrate are joined and integrated via a nonmagnetic film.
A magnetic gap is formed on the joint surface. In this bulk thin-film magnetic head, a coil-forming recess is formed on a joining surface of at least one of the pair of magnetic core halves, and a thin-film coil is formed in the coil-forming recess. .

[0008]

Incidentally, the above-mentioned conventional bulk thin film magnetic head is made very small because it is manufactured by a thin film forming process. Therefore, the conventional bulk thin film magnetic head actually
When used in a magnetic recording / reproducing device such as a TR,
There has been a problem that a major renovation of a head mount device or the like for mounting on a drum is required.

Therefore, the present invention adheres to and integrates a head chip having a magnetic core formed by a thin-film forming step with a head base provided with a terminal plate, in accordance with the design of a magnetic recording / reproducing apparatus. It is an object of the present invention to provide a magnetic head that can be easily mounted and a method of manufacturing the same.

[0010]

In order to achieve the above object, a magnetic head according to the present invention has a metal magnetic thin film formed obliquely on a substrate and a concave portion formed with a thin film coil. A pair of magnetic core halves having a butted surface flattened by a non-magnetic material, butted so that end faces of the metal magnetic thin film face each other via a non-magnetic film to form a magnetic gap; A head chip in which an external connection terminal for electrically connecting the coil to the outside faces a side surface substantially parallel to the sliding direction of the magnetic recording medium; and a head base to which the head chip is adhered and a terminal plate is provided. A connection member for electrically connecting the external connection terminal and the terminal plate, wherein the portion where the external connection terminal and the connection member are connected, and the terminal plate and the connection member are connected Part and Formed by protecting a protection resin is coated.

In the magnetic head according to the present invention configured as described above, the terminal for external connection of the head chip for recording / reproducing to / from the magnetic recording medium and the terminal plate of the head base are securely connected electrically. It was done.

In order to achieve the above-mentioned object, a method of manufacturing a magnetic head according to the present invention comprises forming a metal magnetic thin film obliquely on a substrate, and having a concave portion in which a thin-film coil is formed. A pair of magnetic core halves formed by flattening abutting surfaces with a magnetic material are joined so that end faces of the metal magnetic thin film face each other via a non-magnetic film to form a magnetic gap. A bonding step of bonding a head chip having an external connection terminal for electrical connection facing a side surface substantially parallel to the sliding direction of the magnetic recording medium to a head base provided with a terminal plate; A connection step of connecting the terminal for terminal and the terminal plate with a connection material, and a protection step of applying a protective resin to a connection portion in the connection step, the head chip and the head base are integrated. That.

Therefore, according to the method of manufacturing a magnetic head according to the present invention, it is possible to prevent poor connection between the external connection terminals of the head chip and the terminal plate of the head base, thereby improving the production efficiency of the magnetic head. it can.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described in detail with reference to the drawings. Hereinafter, the magnetic head 1 as shown in FIG. 1 will be described. The magnetic head 1 is formed by bonding and integrating a head chip 2 and a head base 3.

The head chip 2 will be described first.

As shown in FIGS. 2 and 3, the head chip 2 comprises a pair of magnetic core halves 4 joined by metal diffusion bonding. The pair of magnetic core halves 4 is M
a non-magnetic substrate 5 made of an nO—NiO-based non-magnetic material;
The metal magnetic thin film 6 is formed on the inclined surface 5a of the non-magnetic substrate 5 and the low melting point glass 7 is formed on the non-magnetic substrate 5 so as to cover the metal magnetic thin film 6. In addition, at least one of the pair of magnetic core halves 4 has a thin-film coil 8 for excitation and / or detection of an induced electromotive voltage.

In the head chip 2, in a state where the pair of magnetic core halves 4 are joined via the nonmagnetic film 9, the metal magnetic thin film 6 is connected to the thin film coil 8 in FIG. (Not shown)), a magnetic core 10 is formed. In the head chip 2, when the magnetic recording medium slides in the direction indicated by the arrow A in FIG. 3, the magnetic core 10 reproduces the signal magnetic field recorded on the magnetic recording medium, or the magnetic core 10 applies the signal magnetic field to the magnetic core. It operates by recording on a recording medium.

In order to adjust the contact state of the head chip 2 with the magnetic recording medium, the sliding surface 11 of the magnetic recording medium is moved in the sliding direction of the magnetic recording medium indicated by an arrow A in FIG. It is formed in an arc shape in parallel. The head chip 2 is provided with a contact width regulating groove 12 for adjusting the contact area with the magnetic recording medium. The contact width regulating groove 12 is parallel to the sliding direction A of the magnetic recording medium,
It is formed on both side surfaces of the head chip 2.

Further, the head chip 2 has a notch 1 cut out at a predetermined depth from the sliding surface 11 at both ends in the sliding direction of the magnetic recording medium indicated by an arrow A in FIG.
Three. The sliding surface 11 is formed such that the length of the sliding direction of the magnetic recording medium in the sliding direction is shorter than that of the base of the head chip 2 by the notch 13.

Thus, when the diameter of the drum of the magnetic recording / reproducing apparatus to be mounted is small,
The sliding surface 11 of the head chip 2 can protrude from the narrow drum window.

In the head chip 2, the metal magnetic thin film 6 is formed of a soft magnetic material such as an Fe-Al-Si alloy (Sendust). The metal magnetic thin film 6 is formed on an inclined surface 5 a formed obliquely at a predetermined angle on the non-magnetic substrate 5. For this reason, the magnetic core 10
Are a pair of magnetic core halves 4 on which a metal magnetic thin film 6 is formed.
Are bonded obliquely to the sliding direction A of the magnetic recording medium as shown in FIG.

The metal magnetic thin film 6 is configured such that its cross-sectional shape is substantially U-shaped. That is, the metal magnetic thin film 6 has a concave portion 6a at a substantially central portion of the end surface of the magnetic core half 4 on the joining surface 4a side.

For this reason, the metal magnetic thin film 6 is divided at the joining surface 4 a of the magnetic core half 4 in the front-rear direction and is exposed from the low melting point glass 7, and the front butting surface 14 and the rear butting surface 15 are exposed.
And has the following. And one magnetic core half 3
The front butting surface 14 and the front butting surface 14 of the other magnetic core half 4 are butted via the non-magnetic film 9 to form a front gap 16. The rear butting surface 15 of one magnetic core half 3 and the rear butting surface 15 of the other magnetic core half 4 are butted with the non-magnetic film 9 therebetween to form a back gap 17.

The metal magnetic thin film 6 has a bonding surface 4a
In addition, there is provided a coil forming concave portion 18 in which the thin film coil 8 having the rear butting surface 15 substantially at the center is formed. A coil connection terminal 19 is formed in the coil forming recess 18 near the rear butting surface 15. Thin film coil 8
Is formed in the coil forming recess 18, and the end on the center side is connected to the coil connecting terminal 19.

The coil connection terminals 19 are formed with their heights adjusted so as to form the same surface as the joint surface 4a of the pair of magnetic core halves 4. Then, in the head chip 2, when the pair of magnetic cores 4 are joined, the pair of coil connection terminals 19 are also joined. Thus, in the head chip 2, when the pair of magnetic core halves 4 are joined, the pair of thin film coils 8 are electrically connected.

The outer peripheral end of the thin film coil 8 is led out to the side opposite to the sliding surface 11 of the recording medium. External connection terminals 20 are formed on the pair of magnetic core halves 4 on the side opposite to the sliding surface 11 of the recording medium.
The outer peripheral end of the thin-film coil 8 is connected to the external connection terminal 20.

By exposing these external connection terminals 20 to one side surface 2a of the head chip 2, it is possible to electrically connect the outside and the thin film coil 8. The pair of external connection terminals 20 are formed at positions where the heights of the pair of magnetic core halves 4 are different so as not to cause a short circuit when the pair of magnetic core halves 4 are joined.

The external connection terminal 20 is preferably formed such that the width and length of the end face 20a facing one side face 2a of the head chip 2 are 50 μm or more, and more preferably 100 μm or more. Is more desirable. As a result, in the external connection terminal 20, it is possible to prevent the connection material 51 from having a connection failure in a state where the head chip 2 and the head base 3 are bonded as described later. In the present embodiment, the external connection terminals 20 are formed so that the width and the length of the end face 20a of the head chip 2 are 100 μm.

The external connection terminal 20 is connected to its end surface 2.
0a is preferably formed at a position separated from the upper end surface of the head base 3 by 0.5 mm or more.
It is more desirable to form it at a position separated by 1.0 mm or more. As a result, the head chip 2 and the head base 3 are connected to the external connection terminals 20 as described later.
In this state, the adhesive sticks out to the external connection terminal 20 by protruding, so that it is possible to prevent the connection material 51 from having a poor connection. In the present embodiment, since the head chip 2 is mounted on the head base 3, the end face 20a is formed 1.0 mm away from the side edge of the bonding surface 2b of the head chip 2.

Although the non-magnetic substrate 5 of the head chip 2 is made of a MnO-NiO-based non-magnetic material, the present invention is not limited to such a configuration. The non-magnetic substrate 5 may be made of calcium titanate, barium titanate, zirconium oxide (zirconia), alumina, alumina titanium carbide, SiO ₂ , Zn ferrite, crystallized glass, high hardness glass, or the like.

In the head chip 2, the non-magnetic substrate 5 is formed such that the inclined surface 5a is formed obliquely at a predetermined angle. However, the inclined surface 5a is formed, for example, in a circular or polygonal shape. You may. However, the slope 5a is 4
It is desirable to form at an angle of about 5 degrees. Thereby, the track width accuracy of the head chip 2 is improved.

Further, in the head chip 2, the metal magnetic thin film 6 is made of an Fe-Al-Si alloy (Sendust).
Although the film is formed of a material exhibiting soft magnetism such as the above, the present invention is not limited to such a configuration. The metal magnetic thin film 6 is made of, for example, Fe-Ta-N alloy, Fe-Al alloy, Fe-S
i-Co alloy, Fe-Ga-Si alloy, Fe-Ga-S
i-Ru alloy, Fe-Al-Ge alloy, Fe-Ga-G
e alloy, Fe-Si-Ge alloy, Fe-Co-Si-A
Any material may be used as long as it is made of a crystalline alloy such as a 1 alloy or an Fe-Ni alloy. Alternatively, the metal magnetic thin film 6 is made of Fe, C
alloy consisting of one or more elements of o and Ni and one or more elements of P, C, B and Si, or Al, Ge, Be, Sn, In, Mo, W, Ti, M
metal-metalloid amorphous alloys typified by alloys containing n, Cr, Zr, Hf, Nb, etc .;
It may be made of an amorphous alloy such as a metal-metal amorphous alloy containing a transition metal such as Hf or Zr and a rare earth element as main components. Further, the metal magnetic thin film 6
May be a nitrided soft magnetic alloy or a carbonized soft magnetic alloy.

Further, the metal magnetic thin film 6 may be constituted by a single-layer metal magnetic thin film, but it is preferable that the non-magnetic thin film layer and the magnetic thin film layer are alternately laminated. Thus, the magnetic head 1 can have high sensitivity in a higher frequency range.

The head chip 2 configured as described above
Means that when reproducing a magnetic signal recorded on a magnetic recording medium, a signal magnetic field from the magnetic recording medium causes a front gap 1
6 is applied. When the direction of the applied signal magnetic field changes, the direction of the magnetic flux flowing through the magnetic core 10 changes. As a result, in the head chip 2,
Electromagnetic induction occurs, and a predetermined current flows through the thin-film coil 8.

When a magnetic signal is recorded on a magnetic recording medium using the head chip 2, a predetermined current is supplied to the thin-film coil 8. In the head chip 2, a predetermined magnetic flux flows through the magnetic core 10 by the magnetic field generated from the thin film coil 8. As a result, in the head chip 2, a leakage magnetic field is generated across the front gap 16. The head chip 2 records a magnetic signal by applying the leakage magnetic field to a magnetic recording medium.

Next, a method of manufacturing the above-described head chip 2 will be described.

The head chip 2 is formed on the same substrate by arranging the magnetic core halves 4 in a plurality of rows as described above.
Then, this substrate is cut off for each row in which the plurality of magnetic core halves 4 are formed to form a magnetic core half block. The magnetic core half blocks are joined and integrated by metal diffusion bonding to form a magnetic head block. The head chip 2 is completed by separating the magnetic head block into individual head chips 2.

First, in order to manufacture the head chip 2, a substantially flat substrate 21 is prepared as shown in FIG. The substrate 21 is to be the non-magnetic substrate 5 of the head chip 2 and is made of, for example, a non-magnetic material such as MnO-NiO. The substrate 21 has, for example, a thickness of about 2 mm.
And the length and width are about 30 mm.

Next, as shown in FIG.
For example, a plurality of magnetic core forming grooves 24 are formed with a grindstone or the like so as to have an angle of about 45 degrees with respect to one main surface 21a.
Are formed in parallel. Then, a plurality of inclined surfaces 21b are formed in the substrate 21 by the magnetic core forming grooves 24 formed in the first groove processing. Inclined surface 21b
Is an inclined surface 5a in the head chip 2.

The slope 21b formed here is
It may be circular or polygonal. Also, the inclined surface 21b
Is preferably about 25 to 60 degrees with respect to the plane of the substrate 21, but is more preferably about 35 to 50 degrees in consideration of prevention of pseudo gap and track width accuracy.
The magnetic core forming groove 24 formed by the first groove processing had a depth of 130 μm and a width of 150 μm.

Next, as shown in FIG. 6, a metal magnetic thin film 27 is formed on the entire surface of the substrate 21 on which the inclined surface 21b is formed. In this film forming step, the metal magnetic thin film 27
Is formed so that three metallic magnetic materials are laminated via a nonmagnetic layer. This metal magnetic thin film 27 is formed, for example, by a PVD method such as a magnetron sputtering method or the like.
The film is formed by a VD method or the like.

Further, the metal magnetic thin film 27 is not limited to the one having a plurality of metal magnetic layers, and may be configured to have a single metal magnetic layer. In order to obtain, it is desirable that the metal magnetic layer has a laminated structure in which the metal magnetic layer is divided into a plurality. Thereby, the metal magnetic thin film 27 can reduce the eddy current loss and obtain high sensitivity in a higher frequency band.

In this embodiment, the metal magnetic thin film 27
Is, for example, 5 μm of an Fe—Al—Si alloy (Sendust).
m and alumina of 0.15 μm are alternately laminated and three layers of Fe—Al—Si alloy layer are provided. When the metal magnetic thin film 27 is formed in a plurality of layers, alumina, SiO ₂ and Si
Materials such as O are used alone or in combination. The thickness of the non-magnetic layer is set to such an extent that insulation between adjacent metal magnetic layers can be obtained.

Next, as shown in FIG.
A second groove is formed on the surface on which the groove 7 is formed in a direction substantially orthogonal to the magnetic core forming groove 24. In the second groove processing, a separation groove 28 formed for separating the magnetic core 10 into a predetermined size, and a winding for forming a magnetic gap in each magnetic core 10 separated by the separation groove 28 are formed. A line groove 29 is formed.

At this time, portions other than the metal magnetic thin film 27 formed on the inclined surface 21b, that is, the metal magnetic thin film 27 formed at the bottom of the magnetic core forming groove 24 are removed by grinding.

Here, the separation groove 28 is formed by magnetically separating the magnetic core 10 on the substrate 21 in the front-rear direction.
And a groove for forming a closed magnetic path in each magnetic core 10. Although two separation grooves 28 are formed in the example of FIG. 7, the separation grooves 28 need to be provided by the number of rows of the magnetic core halves 4 to be formed. In addition, the separation groove 28 must be formed so as to have a depth to completely cut the metal magnetic thin film 27 in order to magnetically separate the magnetic cores 10 arranged in the front-rear direction. is there. Specifically, the separation groove 28 is 150 μm from the bottom of the magnetic core formation groove 24.
280 μm from the main surface 21 a of the substrate 21.
m depth.

On the other hand, the winding groove 29 is formed in the recess 6 a formed in the metal magnetic thin film 27 in the head chip 2 described above.
Is formed. Therefore, the winding groove 29 forms a magnetic core 10 having the front butting surface 14 and the rear butting surface 15, and has such a depth that the metal magnetic thin film 27 is not cut in order to form the coil forming recess 18. It is necessary to form with. Therefore, the cross section of the metal magnetic thin film 27 is exposed on the surface of the winding groove 29.

The shape of the winding groove 29 is determined in accordance with the lengths of the front butting surface 14 and the rear butting surface 15. Becomes 300 μm, and the rear butting surface 15
Was formed to have a length of 85 μm. The winding groove 29 may have such a depth that the metal magnetic thin film 27 is not cut. However, if the winding groove 29 is too deep, the magnetic path length becomes longer and the efficiency of magnetic flux transmission may be reduced. The winding groove 29 is
Although the depth depends on the thickness of the thin film coil 8 formed in a step described later, it is set to 20 μm here.

Further, the shape of the winding groove 29 is not limited, but here, the front abutting surface 14 is used.
The side surface was a 45-degree inclined surface 29a. This allows
The magnetic core 10 has a structure in which the magnetic flux is concentrated on the sliding surface 11, thereby improving the sensitivity.

Next, as shown in FIG. 8, a low-melting glass melted on one main surface 21a of the substrate 21 on which the magnetic core forming groove 24, the separation groove 28 and the winding groove 29 are formed as described above. 30 is filled. Thereafter, the low-melting glass 30 is cooled and solidified, and the surface of the solidified low-melting glass 30 is subjected to a flattening process.

Next, as shown in FIG. 9, a terminal groove 31 is formed by subjecting the solidified low-melting glass 30 to grinding using a grindstone or the like. The terminal groove 31 was formed so as to be located immediately above the above-described separation groove 28. Then, a good conductor such as Cu is filled in the terminal groove 31 by plating or the like. After that, the flattening process is performed again.

The terminal groove 31 is filled with a good conductor such as Cu and serves as the external connection terminal 20 of the head chip 2 described above. Therefore, the terminal groove 31 is
Although the shape is not limited, at least the width and the depth are desirably 50 μm or more, and more desirably 100 μm or more. Accordingly, when the pair of magnetic core halves 4 are joined to form the external connection terminal 20, the terminal groove 31 is formed in a state where the head chip 2 and the head base 3 are bonded as described later. It is possible to prevent the connection material 51 from having a poor connection. In the present embodiment, the terminal grooves 31
Was formed to have a width and depth of 100 μm.

Next, as shown in FIG. 10, the low-melting glass 30 is subjected to an etching process to form a coil-forming concave portion 18, and a thin-film coil 8 is formed in the coil-forming concave portion 18. I do.

The coil forming concave portion 18 is formed in a substantially rectangular shape with the rear abutting surface 15 being substantially at the center, and the rear abutting surface 1 is formed.
It is formed by performing an etching process on a portion excluding 5 and the coil connection terminal 19. The coil forming recess 18 has a groove 18a reaching the terminal groove 31 from one end thereof.

Thereafter, a thin film coil 8 is formed in the coil forming recess 18. The thin-film coil 8 has one end 8a disposed on the coil connection terminal 19 and the rear abutting surface 1.
It has a shape wound many times so as to draw a circle centered at 5. The thin-film coil 8 is drawn out into a groove 18 a formed at one end of the coil forming recess 18, and the other end 8 b is electrically connected to an external connection terminal 20 made of a good conductor filled in a terminal groove 31. Connecting.

When the thin film coil 8 is formed, first, the above-described coil shape is patterned by a photoresist. Next, Cu is formed in the coil forming recess 18.
Is formed into a thin film to a thickness of about 3 μm by a technique such as electrolytic plating. Then, the thin film coil 8 having a patterned coil shape can be formed by removing the photoresist. In forming the thin film coil 8, not only the above-described electrolytic plating method but also a sputtering method, a vapor deposition method, or the like can be used.

Next, a protective layer (not shown) for protecting the thin-film coil 8 from contact with the outside air is formed. This protective layer is formed so as to fill the coil-forming recess 18 in which the above-described thin-film coil 8 is formed. The protective layer is preferably formed of a non-magnetic insulating material that is not removed by the oxygen ashing.

Specifically, as the non-magnetic insulating material, Al
Examples thereof include oxides such as ₂ O ₃ , Ta ₂ O ₅ , SiO ₂ , ZrO ₂ , and TiO ₂ and inorganic substances such as glass. Here, as the protective film, Al ₂ O ₃ was sputtered to a thickness of 0.4 μm.
m was formed over the entire surface of the substrate 21. At this time, the protective film also covers the front butting surface 14 and the rear butting surface 15 exposed on one main surface of the substrate 21, but portions covering these portions will be removed in a step described later. Note that this protective film can be formed only in a predetermined region by using a so-called mask sputtering method or a lift-off method. Examples of the method for forming the protective film include, besides the sputtering method, an evaporation method and spin coating of coating type SiO ₂ .

Next, as shown in FIG. 11, side grooves 32, which are angular grooves, are formed so as to cross the front abutting surface 14 facing the one main surface in parallel. Thereafter, the substrate 21 on which the magnetic core halves 4 are formed in a plurality of parallel rows is cut so that the magnetic core halves 3 and the other magnetic core halves 4 are arranged in each row, and the magnetic core half blocks are formed. 33 are formed.

When the side groove 32 is formed, one end of the front butting surface 14 is exposed on the side surface of the side groove 32. The side grooves 32 are formed so as to expose the upper end of the front butting surface 14 as a positioning index when the pair of magnetic core half blocks 33 are butted, as described later.

After the side grooves 32 are formed, the main surface 33a of the magnetic core half block 33 is polished to be mirror-finished. At this time, the front butting surface 1 covered with the protective film
4 and the rear butting surface 15 are exposed to the outside.

When the substrate 21 is cut to form the magnetic core half block 33, when the head chip 2 and the head base 3 are integrated, the external connection terminals 2
0 is at least 0.5 from the upper end surface of the head base 3.
It is desirable to cut at a size determined from the position separated by at least 1.0 mm, and more preferable to cut at the size determined from the position separated by at least 1.0 mm.

Thus, when the terminal groove 31 becomes the external connection terminal 20 in the head chip 2 and the head chip 2 and the head base 3 are bonded together, the adhesive protrudes and the external connection is formed. It is possible to prevent the connection material 51 from adhering to the connection terminal 20 and causing a connection failure. In this embodiment, the substrate 21 is cut at a position 1.0 mm away from the terminal groove 31 so that the head chip 2 is placed on the head base 3 and adhered thereto.

Next, as shown in FIG. 12, the pair of magnetic core half blocks 33 is accurately positioned and metal diffusion bonding is performed. At this time, first, a non-magnetic film 9 serving as a gap material of the magnetic core 10 and serving as an adhesive at the time of metal diffusion bonding is formed on one main surface 33a of each of the pair of magnetic core half blocks 33. I do.

The nonmagnetic film 9 is formed by depositing a metal such as Au by, for example, a sputtering method and covering at least the front butting surface 14 and the coil connection terminal 19. Further, the nonmagnetic film 9 is not limited to Au, but may be formed of a metal having a large diffusion coefficient and having a surface on which an oxide layer is unlikely to be formed so as to be suitable for metal diffusion bonding at a low temperature. . Specifically, for example, A
It may be formed of at least one selected from noble metals such as g, Pd, and Pt. Further, the method of forming the nonmagnetic film 9 is not limited to the sputtering method, and may be formed by, for example, an electrolytic plating method, a vapor deposition method, or the like.

Then, after the non-magnetic film 9 is formed as described above, the pair of magnetic core half blocks 33 is accurately positioned to perform metal diffusion bonding.

At this time, the upper ends of the front abutting surfaces 14 facing the side grooves 32 are opposed to each other, whereby accurate positioning is achieved. In this manner, by correctly opposing the upper end of the front butting surface 14 facing the side groove 32, the rear butting surface 15 and the coil connection terminal 19 can be accurately faced.

Then, by applying a predetermined temperature and pressure to the pair of magnetic core half-blocks 33 butted, the non-magnetic films 9 are diffused, and the pair of magnetic core half-blocks 33 are joined and integrated. The manufactured magnetic head block 38 is manufactured.

Next, as shown in FIG. 13, the magnetic head block 38 is ground to form a sliding surface length regulating groove 39.

The sliding surface length regulating groove 39 serves as the notch 13 of the head chip 2 when the magnetic head block 38 is separated into individual head chips 2. Therefore, the sliding surface length regulating groove 39 is
In this case, the groove is formed substantially parallel to the side groove 32 along the side edge on the side of the front butting surface 14.

Next, the magnetic head block 38 is cut in the longitudinal direction along the end of the side groove 32 in order to expose the surface serving as the sliding surface 11 on which the magnetic recording medium slides. Then, the exposed surface of the magnetic head block 38 is subjected to cylindrical cutting so as to have a cylindrical shape. Thereby, this surface becomes the sliding surface 11 of the head chip 2.

Thereafter, the contact width regulating groove 12 is ground on the magnetic head block 38. The contact width regulating grooves 12 are formed at portions corresponding to both side surfaces of the sliding surface 11 of each head chip 2 separated from the magnetic head block 38.

The magnetic head block 38 corresponds to FIG.
The head chips 2 are separated into individual head chips 2 by cutting at the portion indicated by the line BB in FIG.

In this embodiment, the head chip 2
The sliding surface length regulating groove 39 is ground so that the front gap 16 of the sliding surface 1 has an azimuth angle of 20 degrees.
1 was polished, the contact width regulating groove 12 was ground, and the cut surface of the magnetic head block 38 was inclined and separated. The magnetic head block 38 performs the above-described grinding of the sliding surface length regulating groove 39, polishing of the sliding surface 11, grinding of the contact width regulating groove 12, and cutting of the individual head chips 2. , Front gap 16
Has a predetermined azimuth angle, and is not limited to the azimuth angle of 20 degrees.

In the present embodiment, a pair of magnetic core half blocks 33 are joined and integrated to form a magnetic head block 38 and then separated into individual head chips 2. After separating the block 33 into individual magnetic core halves, the head chip 2 may be formed by joining and integrating a pair of magnetic core halves.

The head chip 2 is manufactured as described above, and is adhered to the head base 3 to constitute the magnetic head 1 as a whole. Therefore, next, the head base 3 will be described.

As shown in FIG. 1, the head base 3 includes a head base body 40, a head chip attaching portion 41,
And a terminal plate 42.

The head base body 40 is formed in a substantially rectangular shape having a predetermined thickness. The head base body 40 is provided with a head chip mounting portion 41 on a side surface on a side to which the head chip 2 is bonded. Head base body 4
0, a terminal plate 42 is attached to its one main surface 40a. The head base body 40 has a screw hole 43 near the center thereof for fixing to the magnetic recording / reproducing apparatus.
Are perforated.

The head chip mounting portion 41 is formed in a substantially trapezoidal shape having a predetermined thickness. The head chip attachment portion 41 is attached to the head base body 40 on the longer side of the substantially trapezoidal shape, and the head chip 2 is bonded to the shorter side. Thus, the head chip mounting portion 41 has a function as a pedestal for the head chip 2 in the head base 3.

The terminal plate 42 is formed of an insulating material into a substantially flat plate shape.
0a. The terminal plate 42 is provided with a pair of terminals 44 on the main surface toward the outside.
Each of the pair of terminals 44 has a head chip connection terminal 44a and an external connection terminal 44b at both ends. The pair of terminals 44 are formed by electrically connecting the respective head chip connection terminal portions 44a and the external connection terminal portions 44b.

The head base 3 is configured as described above, and the above-described head chip 2 is adhered to the head chip mounting portion to form the magnetic head 1.

The magnetic head 1 has a head chip 2 bonded to a head chip mounting portion 41 of a head base 3 with an adhesive 50. Further, in the magnetic head 1, a pair of external connection terminals 20 formed on the head chip 2 and a pair of head chip connection terminal portions 44 a formed on the terminal plate 42 of the head base 3 are connected by a connection material 51. Be done. Further, in the magnetic head 1, as shown in FIG. 14, the connection portion 51a of the connection material 51 is protected by applying a protective resin 52 thereto.

As described above, the magnetic head 1 is formed such that the end face 20a of the external connection terminal 20 of the head chip 2 is separated from the upper end face of the head base 3 by 0.5 mm or more. Therefore, in the magnetic head 1, even if the adhesive 50 for bonding the head chip 2 and the head base 3 protrudes, the adhesive 50 may stain the end surface 20 a of the external connection terminal 20. There is no.

Therefore, in the magnetic head 1, in the external connection terminal 20, the connection failure of the connection material 51 due to the protruding adhesive 50 can be prevented. That is, the magnetic head 1 is connected to the external connection terminal 20 with the connection material 5.
1 is securely connected.

Further, in the magnetic head 1, as described above, the external connection terminals 20 of the head chip 2 are formed such that the width and length of the end face 20a are 50 μm or more.
Therefore, in the magnetic head 1, the external connection terminal 20 has a sufficient area for connecting the connection material 51. Therefore, in the magnetic head 1, the connection material 51 is securely and easily connected.

Further, as described above, the connection portion 51a of the connection material 51 of the magnetic head 1 is protected by applying the protective resin 52 thereto. Therefore, the magnetic head 1 can prevent a connection failure such as the connection material 51 being disconnected at the connection portion 51a or being short-circuited due to contact with other components of the magnetic recording / reproducing apparatus.
Therefore, in the magnetic head 1, the connection material 51 is also securely connected by the protective resin 52.

The magnetic head 1 is configured as described above, and is mounted on a magnetic recording / reproducing apparatus and includes a head base 3
And is fixed by fixing means such as screws.
In the magnetic head 1, a connection material of the magnetic recording / reproducing device is connected to a pair of external connection terminals 44 b formed on the head base 3. Thereby, the magnetic head 1
Records a recording signal received from a magnetic recording / reproducing apparatus on a magnetic recording medium, or transfers a recording signal read from the magnetic recording medium to the magnetic recording / reproducing apparatus for reproduction.

As described above, the magnetic head 1 according to the present invention is formed by bonding the head chip 2 formed very small by the thin film forming step to the head base 3. As a result, the magnetic head 1 can easily mount the small and high-precision head chip 2 on the magnetic recording / reproducing apparatus by using general fixing means such as screws. Therefore, the magnetic head 1 can be easily mounted according to the design of the magnetic recording / reproducing apparatus.

Next, a method for manufacturing a magnetic head according to the present invention will be described. In the following, a method of manufacturing the above-described magnetic head 1 will be described.

First, in order to manufacture the magnetic head 1, the head chip 2 and the head base 3 described above are prepared.

Next, an adhesive 50 is applied to the bonding surface 2b of the head chip 2, and the head chip 2 and the head base 3 are coated.
And glue. In this bonding step, it is desirable to use an adhesive having a viscosity of 1.0 × 10 ^{−3 to} 20 Pa · s as the adhesive 50, specifically, 1.0 × 10 ⁻³ to
It is desirable to use a cyanoacrylate adhesive of about 3.0 × 10 ⁻³ Pa · s, an epoxy adhesive or an acrylic adhesive of about 1 to 20 Pa · s.

In this bonding step, when the viscosity of the adhesive 50 is smaller than 1.0 × 10 ⁻³ Pa · s, when the head chip 2 and the head base 3 are bonded, There is a possibility that the excess adhesive 50 which has overflowed may flow to the head chip mounting portion 41 of the head base 3. In this bonding step, the adhesive 50
If the viscosity is more than 20 Pa · s, there is a possibility that it may be difficult to adhere the head chip 2 and the head base 3 in parallel with high accuracy. Therefore, in this bonding step, the viscosity of the adhesive 50 is 1.0 ×
By using an adhesive of 10 ^{−3 to} 20 Pa · s, the head chip 2 and the head base 3 can be reliably and accurately bonded.

In this embodiment, the adhesive 5
As 0, an epoxy adhesive having a viscosity of about 7 Pa · s was used.

Next, the terminal 2 for external connection of the head chip 2
0, the head chip connection terminal portion 44a of the head base 3
And. In this connection step, since there are a pair of external connection terminals 20 and a pair of head chip connection terminal portions 44a, the external connection terminals 20 and the head chip connection terminal portions 44a are respectively connected by a pair of connection members 51. . In this connection step, it is desirable to connect the connection material 51 by soldering or point welding.

In this connection step, the connection material 51 is connected by soldering or point welding,
For example, it can be performed at a lower cost than a connection method such as wire bonding, which requires that the material of the connection portion be Au of 99.99% or more.

The working temperature at the time of connection is 350 ° C.
Or less, and more preferably 300 ° C. or less.

In this connection step, when soldering or point welding is performed at a working temperature higher than 350 ° C., there occurs a defect that the pair of magnetic core halves 4 of the head chip 2 are broken at the joint surface 4a. There is a fear. However, when the working temperature is set to 300 ° C. to 350 ° C. in this connection step, the rate of this defect is 1
When the temperature is reduced to about 0% and the working temperature is set to 300 ° C. or lower, the rate of this defect can be almost eliminated.

In this embodiment, the temperature is 290 ° C.
The connection material 51 was connected by soldering at the operation temperature of.
As a result, in this connection step, as described above, it is possible to prevent the occurrence of a defect that the pair of magnetic core halves 4 of the head chip 2 are broken.

Next, the connection material 5 connected in the connection step
The protective resin 52 is applied to the first connection portion 51a. The magnetic head 1 is protected by applying the protective resin 52 to the connection portion 51a in this protection step, as described above, the connection material 51 is disconnected at the connection portion 51a, or the magnetic recording / reproducing is performed. It is possible to prevent a connection failure such as a short circuit caused by contact with other parts of the device.

The protective resin 52 has a viscosity before curing of 1
The viscosity is preferably 20 Pa · s to 20 Pa · s, and more preferably the viscosity before curing is 5 to 17 Pa · s.

In this protection step, if the viscosity of the protective resin 52 before curing is smaller than 1 Pa · s, the protective resin 52 flows down from the connection portion 51a before the protection resin 52 is cured, and is used to protect the connection portion 51a. There is a possibility that it is not suitable and the control of the liquid amount becomes difficult. In this protection step, when the viscosity of the protection resin 52 before curing is higher than 20 Pa · s, there is a possibility that it is difficult to apply the optimum amount of the protection resin 52 to the connection portion 51a. Therefore, the protective resin 52 has a viscosity before curing of 1 to 1.
When the pressure is 20 Pa · s, it is possible to prevent a short circuit due to contact between the connection members 51.

In this embodiment, the connection portion 5
It is assumed that the protective resin 52 is applied to the connection portion 51a.
In addition, for example, the protective resin 52 may be applied to the connection portion 51a and the connection material 51. Thereby, the magnetic head 1
Can prevent the pair of connection members 51 from contacting each other and causing a short circuit.

In the method of manufacturing a magnetic head according to the present invention, the head chip 2 and the head base 3 are integrated through the above steps.

In the following, another embodiment of the magnetic head and the method of manufacturing the same according to the present invention will be described with reference to the drawings. In the following description, the same or equivalent parts as those described above will not be described in detail, and will be described with the same reference numerals. In the following description, the adhesive 50, the wire 51, and the protective resin 52
Are not shown.

FIG. 15 shows a second embodiment of the magnetic head according to the present invention. In the second embodiment, a concave portion (not shown) is provided inside the head chip mounting portion 41 of the head base 3. Further, the head chip mounting portion 41 is provided with a cutout portion 41a on the side surface where the terminal plate 42 is provided from the upper end surface side.

In the second embodiment, the head chip 2
And the end face 20a of the external connection terminal 20 of the head chip 2 is exposed from the notch 41a.

The magnetic head 1 configured as described above
Since the head chip 2 is inserted into and adhered to the head chip mounting portion 41, the head chip 2 and the head base 3 can be more firmly integrated as compared with the above-described first embodiment. it can.

The magnetic head 1 has an end face 20 a having the end face 20 a of the external connection terminal 20 facing the notch 41 a of the head chip mounting part 41.
0a is provided at a position closer to the head chip connection terminal portion 44a of the terminal plate 42 as compared with the above-described first embodiment. Thereby, this magnetic head 1
Are the external connection terminal 20 and the head chip connection terminal 44
In addition to shortening the length of the connecting material 51 for connecting the wiring members a, it is possible to prevent a defect such as a short circuit between the connecting materials 51.

In this magnetic head 1, the upper end surface of the head base 3 with respect to the head chip 2 is the lower end of the notch 41 a in the head chip mounting portion 41. Therefore, the external connection terminal 20 of the head chip 2 is formed at a position separated from the lower end of the notch 41a by at least 0.5 mm. Thus, in the magnetic head 1, even when the adhesive 50 protrudes, the external connection terminals 20 are not stained, and the connection members 51 can be securely connected.

Next, a third embodiment of the magnetic head according to the present invention is shown in FIG. In the third embodiment, a head chip insertion hole (not shown) is provided inside the head chip attachment portion 41 of the head base 3 and the head chip attachment portion 41 of the head base body 40 is provided.
A concave portion (not shown) having substantially the same shape as the head chip insertion hole is also provided on the side. Further, the head chip mounting portion 41 and the head base body 40 are provided with a hole portion 60 penetrating through the side surface on which the terminal plate 42 is provided.

In the third embodiment, the head chip 2 is passed through the head chip insertion hole of the head chip mounting portion 41, inserted into the recess of the head base body 40 and adhered. The end face 20a of the second external connection terminal 20 is exposed.

The magnetic head 1 configured as described above
As compared with the above-described second embodiment, the head chip 2 and the head base 3 can be more firmly integrated, and the distance between the end surface 20a and the head chip connection terminal portion 44a can be further reduced.

Therefore, in the third embodiment, the connection failure of the connection member 51 can be further reduced.

Next, a fourth embodiment of the magnetic head according to the present invention is shown in FIG. In the fourth embodiment, a pair of external connection terminals 20 is provided on one magnetic core half of the head chip 2. And head base 3
Is formed in substantially half the size of the above-described embodiment, and a pair of terminals 44 is formed on the side opposite to the external connection terminals 20. In the head base 3, a notch 61 that cuts out the head chip mounting portion 41 and the head base body 40 is formed near the gear connection terminal 20. In the magnetic head 1, a head chip mounting portion 41 and a head base main body 40 are provided with a not-shown head chip insertion hole and a concave portion, respectively, similar to the third embodiment described above.

In the fourth embodiment, similarly to the third embodiment, the head chip 2 is inserted through the head chip insertion hole, inserted into the recess of the head base body 40, and adhered. In the magnetic head 1, a notch 61 provided in the head base 3 allows
The magnetic core half of the head chip 2 on the side where the external connection terminals 20 are formed is exposed.

The magnetic head 1 configured as described above
The volume can be reduced to almost half as compared with the other embodiments described above. Thus, this magnetic head 1
Can have a desired size and shape depending on the design of the magnetic recording / reproducing apparatus.

Next, a fifth embodiment of the magnetic head according to the present invention is shown in FIG. In the fifth embodiment, two head chips 2 are used. This magnetic head 1 is provided with a pair of external connection terminals 20 on one magnetic core half of each head chip 2 as in the above-described fourth embodiment. Further, these two head chips 2 are aligned on a straight line in parallel with the sliding direction of the magnetic recording medium and are adhered to the head base 3, and in this state, the sliding surface 11 of each head chip 2 And a cylindrical cutting process having a continuous curvature.

The magnetic head 1 has a head chip insertion portion (not shown) similar to that of the above-described fourth embodiment in the head chip mounting portion 41, and the head base body 40 has the above-mentioned head chip insertion hole. It has a recess (not shown) similar to that of the fourth embodiment. Also, this magnetic head 1
At the center of the upper surface side of the head base 3, a notch 6 for notching the head chip mounting portion 41 and the head base body 40.
2 are formed. Further, the magnetic head 1 has two pairs of terminals 44 on the terminal plate 42.

In other words, the magnetic head 1 has a configuration in which the two magnetic heads of the above-described fourth embodiment are symmetrically abutted and aligned on a straight line in parallel with the sliding direction of the magnetic recording medium. It has become.

The magnetic head 1 configured as described above
The magnetic head according to the first to third embodiments has substantially the same size as the magnetic head, and includes two head chips 2. Therefore, the magnetic recording / reproducing apparatus on which the magnetic head 1 is mounted can mount more magnetic gaps without increasing the diameter of the drum on which the magnetic head 1 is mounted.
High functionality and high performance can be achieved.

Although the description of the method of manufacturing the magnetic head is omitted in the above-described second to fifth embodiments, it is possible to manufacture the magnetic head in the same manner as in the above-described first embodiment. It is possible.

[0122]

As described above, in the magnetic head according to the present invention, the head chip in which the magnetic gap is formed and the head base are bonded, and the terminal for external connection of the head chip and the terminal plate of the head base are formed. Connected by the connection material,
The connection portion of the connection material is protected by applying a protective resin. Therefore, such a magnetic head includes an external connection terminal of a head chip that performs recording and reproduction on a magnetic recording medium,
The terminal plate of the head base is electrically connected securely. Therefore, such a magnetic head enables a high-performance, small-sized head chip having a magnetic core formed by a thin-film forming process to be installed with a general fixing tool such as a screw via a head base, and is suitable for designing a magnetic recording / reproducing apparatus. This makes it possible to easily mount it.

The method of manufacturing a magnetic head according to the present invention comprises the steps of: adhering a head chip having a magnetic gap formed to the head base; and connecting the external connection terminal of the head chip and the terminal plate of the head base. The head chip and the head base are integrated through a connection step of connecting and a protection step of applying a protective resin to the connection portion in the connection step. Therefore, according to the method for manufacturing a magnetic head, it is possible to prevent poor connection between the external connection terminal of the head chip and the terminal plate of the head base.
As a result, according to the method for manufacturing a magnetic head, a highly reliable magnetic head can be efficiently produced.

[Brief description of the drawings]

FIG. 1 is a front view of a magnetic head according to the present invention.

FIG. 2 is an exploded perspective view showing a head chip of the magnetic head.

FIG. 3 is a perspective view of a main part showing a sliding surface of a head chip of the magnetic head.

FIG. 4 is a view for explaining the method for manufacturing the magnetic head according to the present invention, and is a perspective view showing a substrate.

FIG. 5 is a view for explaining the same method, and is a perspective view showing a substrate on which first groove processing has been performed.

FIG. 6 is a diagram for explaining the same method, and is a perspective view showing a substrate on which a metal magnetic thin film is formed.

FIG. 7 is a view for explaining the same method, and is a perspective view showing a substrate on which a second groove processing has been performed.

FIG. 8 is a diagram for explaining the same method, and is a perspective view showing the substrate in a state where each groove is filled with low-melting glass.

FIG. 9 is a diagram for explaining the same method, and is a perspective view showing a substrate in which terminal grooves are formed in low-melting glass.

FIG. 10 is a view for explaining the same method, and is a perspective view of a principal part showing a substrate on which a concave portion for forming a coil is formed.

FIG. 11 is a diagram for explaining the same method, and is a perspective view showing a magnetic core half block.

FIG. 12 is a diagram for explaining the same method, and is a perspective view showing a state where a pair of magnetic core half blocks are butted.

FIG. 13 is a diagram for explaining the same method, and is a perspective view showing a magnetic head block.

FIG. 14 is a front view showing a state in which a protective resin is applied to the magnetic head according to the present invention.

FIG. 15 is a front view showing a second embodiment of the magnetic head according to the present invention.

FIG. 16 is a front view showing a third embodiment of the magnetic head according to the present invention.

FIG. 17 is a front view showing a fourth embodiment of the magnetic head according to the present invention.

FIG. 18 is a front view showing a fifth embodiment of the magnetic head according to the present invention.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 magnetic head, 2 head chip, 3 head base, 4 magnetic core halves, 5 non-magnetic substrate, 5a inclined surface, 6 metal magnetic thin film, 6a recess, 7 low melting point glass, 8 thin film coil, 9 non-magnetic film, 10 Magnetic core,
11 sliding surface, 12 width regulating grooves, 13 notch, 1
4 front butting surface, 15 rear butting surface, 16 front gap, 18 coil forming recess, 20 terminal groove,
41 head chip attachment part, 42 terminal board, 44 terminal, 44a head chip connection terminal part, 50 adhesive,
51 connection material, 51a connection part, 52 protective resin

Claims (9)

[Claims] 1. A pair of magnetic core halves having a metal magnetic thin film formed obliquely on a substrate, a concave portion in which a thin film coil is formed, and a butted surface made flat by a nonmagnetic material, End faces of the metal magnetic thin film are opposed to each other via a non-magnetic film to form a magnetic gap, and an external connection terminal for electrically connecting the thin film coil to the outside is provided on a sliding surface of the magnetic recording medium. A head chip facing a side surface substantially parallel to the moving direction, a head base to which the head chip is adhered, and a terminal plate provided, and a wiring member for electrically connecting the external connection terminal and the terminal plate. A portion where the external connection terminal and the wiring material are connected, and a portion where the terminal plate and the wiring material are connected,
A magnetic head characterized by being protected by being coated with a protective resin. 2. The magnetic head according to claim 1, wherein the width and length of the end face of the external connection terminal are 50 μm or more. 3. The magnetic head according to claim 1, wherein the external connection terminal is formed at a position separated from the end face of the head base by at least 0.5 mm. 4. A pair of magnetic core halves having a recess formed with a thin film coil formed on a substrate and a metal magnetic thin film obliquely formed on a substrate and having a butted surface flattened by a non-magnetic material. A magnetic gap is formed by abutting the end faces of the magnetic thin film so as to face each other via a non-magnetic film, and an external connection terminal for electrically connecting the thin film coil to the outside is provided in a direction in which the magnetic recording medium slides. A bonding step of bonding a head chip facing a substantially parallel side surface to a head base provided with a terminal plate, a connecting step of connecting the external connection terminal and the terminal plate with a connecting material, and a connecting step And a protection step of applying a protective resin to the connection portions in (1), wherein the head chip and the head base are integrated with each other. 5. In the bonding step, the head chip and the head base have a viscosity of 1.0 × 10 ^{−3 to} 20P.
5. The method for manufacturing a magnetic head according to claim 4, wherein the bonding is performed using an adhesive of a.s. 6. The method of manufacturing a magnetic head according to claim 4, wherein in the connecting step, the connecting material is soldered to the external connection terminal and the terminal plate at a temperature of 350 ° C. or less. . 7. The method of manufacturing a magnetic head according to claim 4, wherein in the connecting step, the connecting material is point-welded to the external connection terminal and the terminal plate at a temperature of 350 ° C. or less. . 8. The method of manufacturing a magnetic head according to claim 4, wherein in the protection step, a protective resin is applied to the connection material together with the connection portion. 9. The protective resin has a viscosity of 1-2 before curing.
5. The method according to claim 4, wherein the pressure is 0 Pa.s.