JP2000073170A5 - - Google Patents
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- Publication number
- JP2000073170A5 JP2000073170A5 JP1999111121A JP11112199A JP2000073170A5 JP 2000073170 A5 JP2000073170 A5 JP 2000073170A5 JP 1999111121 A JP1999111121 A JP 1999111121A JP 11112199 A JP11112199 A JP 11112199A JP 2000073170 A5 JP2000073170 A5 JP 2000073170A5
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- fluoropolymer
- glow discharge
- fluoropolymer surface
- depositing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 16
- 238000000034 method Methods 0.000 description 16
- 229920002313 fluoropolymer Polymers 0.000 description 11
- 239000004811 fluoropolymer Substances 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 3
- 150000002816 nickel compounds Chemical class 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19817388A DE19817388A1 (de) | 1998-04-20 | 1998-04-20 | Verfahren zum Herstellen von metallisierten Substratmaterialien |
| DE19817388:1 | 1998-04-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000073170A JP2000073170A (ja) | 2000-03-07 |
| JP2000073170A5 true JP2000073170A5 (cg-RX-API-DMAC7.html) | 2006-04-20 |
Family
ID=7865060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11111121A Pending JP2000073170A (ja) | 1998-04-20 | 1999-04-19 | 金属化されたサブストレ―ト材料の製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6706201B1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP1080247B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2000073170A (cg-RX-API-DMAC7.html) |
| KR (1) | KR100575424B1 (cg-RX-API-DMAC7.html) |
| AT (1) | ATE242820T1 (cg-RX-API-DMAC7.html) |
| DE (2) | DE19817388A1 (cg-RX-API-DMAC7.html) |
| TW (1) | TW427105B (cg-RX-API-DMAC7.html) |
| WO (1) | WO1999054525A2 (cg-RX-API-DMAC7.html) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002368168A (ja) * | 2001-06-13 | 2002-12-20 | Hitachi Ltd | 半導体装置用複合部材、それを用いた絶縁型半導体装置、又は非絶縁型半導体装置 |
| DE102004011567A1 (de) * | 2004-03-02 | 2005-09-22 | Ist - Ionen Strahl Technologie Gmbh | Haftfester Verbund und Verfahren zur Herstellung |
| US20070237977A1 (en) * | 2006-04-07 | 2007-10-11 | United States Of America As Represented By The Administrator Of The National Aeronautics And Spac | Thin Metal Film System To Include Flexible Substrate And Method Of Making Same |
| US8178120B2 (en) * | 2008-06-20 | 2012-05-15 | Baxter International Inc. | Methods for processing substrates having an antimicrobial coating |
| US8753561B2 (en) * | 2008-06-20 | 2014-06-17 | Baxter International Inc. | Methods for processing substrates comprising metallic nanoparticles |
| US8277826B2 (en) * | 2008-06-25 | 2012-10-02 | Baxter International Inc. | Methods for making antimicrobial resins |
| US20090324738A1 (en) * | 2008-06-30 | 2009-12-31 | Baxter International Inc. | Methods for making antimicrobial coatings |
| US20100227052A1 (en) * | 2009-03-09 | 2010-09-09 | Baxter International Inc. | Methods for processing substrates having an antimicrobial coating |
| JP6466110B2 (ja) * | 2014-09-09 | 2019-02-06 | 住友電気工業株式会社 | プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法 |
| DE102017115407B3 (de) * | 2017-07-10 | 2018-12-20 | Epcos Ag | Herstellungsverfahren für ein MEMS-Bauteil mit Partikelfilter |
| WO2024026176A1 (en) * | 2022-07-26 | 2024-02-01 | The Regents Of The University Of California | Highly selective catalyst composition for the oxidation of alkenes to epoxides |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3294059A (en) | 1963-04-15 | 1966-12-27 | Charles R Barnes | Deposition of nickel films on the interior surface of polytetrafluoroethylene tubing |
| DE3510982A1 (de) | 1985-03-22 | 1986-09-25 | Schering AG, Berlin und Bergkamen, 1000 Berlin | Herstellung metallischer strukturen auf nichtleitern |
| DE3512196A1 (de) * | 1985-04-03 | 1986-10-16 | Hartmann & Braun Ag, 6000 Frankfurt | Verfahren zum aufbringen duenner schichten auf einem substrat |
| DE3744062A1 (de) * | 1987-12-22 | 1989-07-13 | Schering Ag | Verfahren zur herstellung fest haftender metallischer strukturen auf fluor-polymeren und thermoplastischen kunststoffen |
| DE3806587A1 (de) * | 1988-02-26 | 1989-09-07 | Schering Ag | Verfahren zur herstellung fest haftender metallischer strukturen auf polyimid |
| GB9405518D0 (en) * | 1994-03-21 | 1994-05-04 | Mupor Ltd | Porous metal composite body |
| DE4438791C2 (de) * | 1994-10-18 | 1996-09-05 | Atotech Deutschland Gmbh | Mit metallisierten Polyimidoberflächen versehenes Substrat |
| CA2203024A1 (en) * | 1994-10-18 | 1996-04-25 | Heinrich Meyer | Process for plating metal coatings |
-
1998
- 1998-04-20 DE DE19817388A patent/DE19817388A1/de not_active Withdrawn
-
1999
- 1999-04-12 TW TW088105767A patent/TW427105B/zh not_active IP Right Cessation
- 1999-04-15 AT AT99926265T patent/ATE242820T1/de not_active IP Right Cessation
- 1999-04-15 WO PCT/DE1999/001159 patent/WO1999054525A2/de not_active Ceased
- 1999-04-15 EP EP99926265A patent/EP1080247B1/de not_active Expired - Lifetime
- 1999-04-15 US US09/673,760 patent/US6706201B1/en not_active Expired - Fee Related
- 1999-04-15 DE DE59905933T patent/DE59905933D1/de not_active Expired - Lifetime
- 1999-04-15 KR KR1020007011488A patent/KR100575424B1/ko not_active Expired - Fee Related
- 1999-04-19 JP JP11111121A patent/JP2000073170A/ja active Pending
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