JP2000057850A - Copper-clad aluminum wire and insulated copper-clad aluminum wire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve high coil winding speed in addition to weight reduction and enhancement of solderability by adjusting the composition of aluminum for use in a main conductor, thus compensating for brittleness regarding mechanical characteristics. SOLUTION: A cooper-clad aluminum wire 3 is obtained by forming a copper clad 2 on a conductor 1 comprising 0.2% or less Si, 0.2% or less Fe, 2.2% or more to 5.0% or less Cu, 0.15% or less Mn, 1.0% or less Mg, 0.10% or less Cr, 0.10% or less Zn, 0.10% or less Ti, and the rest Al as chemical constituents. Further, an insulating cover 4 and a fused film 5 are formed on the outer periphery of the copper clad 2 to obtain a self-fusing insulated copper-clad aluminum wire 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire such as a coil used in electronic equipment, and more particularly to a copper-coated aluminum wire and an insulated copper-coated aluminum wire having an aluminum core as a main conductor.

[0002]

2. Description of the Related Art In recent years, as electronic devices and electronic parts have become lighter, thinner and smaller, wires such as coils used in these devices have also been reduced in diameter. An aluminum conductor that is 1/3 or less is employed. However, aluminum conductors (hereinafter abbreviated as aluminum conductors) have an electrically low potential, and the surface is instantaneously oxidized when air comes into contact with a new metal surface formed by, for example, wire drawing. Therefore, it is a material that is difficult to solder. When an aluminum conductor is used as a wire for an electronic device component, when connecting the aluminum conductor to the terminal of the electronic device component, dissolve the oxide film on the surface with a heated alkaline solution, neutralize with an acid, wash with hot water, Furthermore, after ultrasonic cleaning, it was necessary to connect with aluminum solder, and the terminal connection work was complicated. In addition, due to the lack of mechanical strength of the aluminum conductor itself, a special connection technique was required to maintain sufficient reliability at the connection points.

[0003] As described above, the aluminum conductor has a problem of terminal connection, and therefore has a slightly higher specific gravity than the aluminum conductor. However, the aluminum conductor has a copper pipe coating layer formed by welding a copper tape to the outer periphery of the aluminum conductor. Copper-clad aluminum wire (hereinafter referred to as CC)
AW (abbreviated as AW) is on the market as a lighter wire that can be soldered.

[0004]

However, when the CCAW having the above-mentioned structure is wound around a coil or the like used for electronic equipment parts, the stress is concentrated most on the copper-aluminum interface due to the properties of the composite material. And often caused disconnections. At the same time, since the mechanical properties of aluminum used for the main conductor cause brittleness due to the brittleness of the mechanical properties, it is necessary to reduce the winding speed in order to compensate for the above-mentioned disadvantages.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned various problems of the prior art, and it has been proposed to adjust the composition of an aluminum material used for a main conductor to compensate for the brittleness of mechanical properties, thereby reducing the weight of the material. It is an object of the present invention to provide a copper-coated aluminum wire and an insulated copper-coated aluminum wire that can make the coil winding speed extremely high in addition to the ease of use and solderability.

[0006]

Means for Solving the Problems In order to achieve the above object, as a first aspect, the present invention provides a method for manufacturing a semiconductor device comprising the steps of:
0.2% or less, Fe 0.2% or less, Cu 2.2% or more 5.
0% or less, Mn 0.15% or less, Mg 1.0% or less, Cr
0.10% or less, Zn 0.10% or less, Ti 0.10% or less,
This is a copper-coated aluminum wire in which a copper coating is formed on the outer periphery of a core wire made of the remainder Al.

As the shape of the copper-coated aluminum wire, there are a round wire, a deformed wire (for example, a flat wire) and the like. In addition, as a method for measuring the chemical component of the aluminum main conductor of the core wire, for example, it can be measured by an emission spectrophotometer, so that it is also possible to confirm that the components added to the aluminum billet are the same.

[0008] In the copper-coated aluminum wire according to the first aspect, the mechanical strength is significantly improved by using the above-mentioned specific chemical component as the core wire of the main conductor. Thereby, the mechanical strength of the copper-coated aluminum wire having the copper coating formed on the outer periphery of the core wire is also improved, and the winding property of the coil is improved. In particular, in order to improve the mechanical strength, the allowable amount of the Cu component is greatly affected.
If the content exceeds 5.0%, the electrical conductivity of aluminum is extremely deteriorated, so that it is not preferable as a coil wire used for electronic device parts.
% Is not preferred because the mechanical strength is not sufficiently improved. Further, since the outer periphery is made of copper, soldering can be easily performed.

According to a second aspect, the present invention is a copper-coated aluminum wire according to the first aspect, wherein the copper-coated aluminum wire has a copper coverage of 20% or less.

[0010] In the copper-coated aluminum wire according to the second aspect, when the copper coating rate is 20% or less, the weight reduction of aluminum is sufficiently maintained, and since the outer periphery is made of copper, it can be easily soldered. Become. In addition, soldering is easy for wires having a copper coverage of more than 20%, but is not suitable for weight reduction due to the specific gravity of copper.
It is not suitable for downsizing.

According to a third aspect of the present invention, there is provided a copper-coated aluminum wire in which the copper coating of the copper-coated aluminum wire according to the first and second aspects is formed by a roll welding method, a tape welding method, or a plating method. It is in.

In the copper-coated aluminum wire according to the third aspect, a copper coating is preferably formed on the outer periphery of the core wire by a roll welding method, a tape welding method, or a plating method.

According to a fourth aspect, the present invention provides a method of manufacturing a semiconductor device according to the first, second, or third aspect, comprising:
Further, the present invention relates to an insulated copper-coated aluminum wire on which an insulating coating and / or a fusion coating is formed.

In the insulated copper-coated aluminum wire according to the fourth aspect, the outer periphery of the copper-coated aluminum wire is further coated with an insulating coating and / or a fusion coating to be suitable as a wire material for a coil or the like used in electronic equipment parts. is there. In particular, a self-supporting coil can be preferably manufactured by applying an insulating coating and a fusion coating to form a self-fusion wire.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings according to embodiments of the present invention. Note that the present invention is not limited by this. FIG. 1 is a sectional view showing one embodiment of the insulated copper-coated aluminum wire of the present invention.
In FIG. 1, 1 is a core wire (aluminum material), 2 is a copper coating, 3 is a copper-coated aluminum wire (conductor), 4 is an insulating film, 5 is a fusion film, and 6 is a self-fusing insulated copper. It is a coated aluminum wire.

First Embodiment Cu is added and melted in an aluminum billet having a purity of 99.0% so that the final chemical component becomes Cu 2.2%, extruded by a die, and then subjected to wire drawing. , Φ0.9m
m of the aluminum base material. Next, as a method for coating the outer periphery of the aluminum base material with copper, first, two copper tapes having a thickness of 40 μm, the surfaces of which were cleaned by wire brushing, were supplied and heated by heating in an inert gas atmosphere. On the other hand, the aluminum base material was cleaned by removing the surface layer with a peeling die. Subsequently, the aluminum base material was formed and pressed by a pressing roll while being sandwiched between copper tapes heated from above and below to obtain a copper-coated aluminum base material. At this time, burrs called "ears" are formed on both sides of the pressed part,
The ear was cut for post-processing. Subsequently, the aluminum base material was subjected to wire drawing by a die to form a copper-coated aluminum wire (3) having a diameter of 0.10 mm including the aluminum material (1) and the copper coating (2). The copper coverage of the copper-coated aluminum wire (3) was 15%.

Subsequently, the copper-coated aluminum wire (conductor) (3) is guided into a horizontal baking furnace, and a polyurethane paint is applied and baked to form a polyurethane insulating film (4) having a thickness of 0.006 mm.
A nylon fusion coating film (5) having a thickness of 0.006 mm is formed on the outer periphery by applying and baking a nylon fusion coating, and a self-fusing insulated copper-coated aluminum wire having an outer diameter of 0.124 mm is provided.
(6).

Second Embodiment Cu is added to an aluminum billet having a purity of 99.0% so as to have a final chemical composition of 4.0% Cu, melted, extruded by a die, and subjected to wire drawing. , Φ0.9m
m of the aluminum base material. Next, as a method of coating the outer periphery of the aluminum base material with copper, first, an 80 μm-thick copper tape whose surface has been cleaned by wire brushing is slit into a predetermined width, and the aluminum base material whose surface has been cleaned in the same manner as in the first embodiment. The aluminum base material was formed into a circular shape so as to wrap around the material, and the butt portion of the tape was continuously TIG-welded to provide a copper pipe. After that, wire drawing is performed to eliminate the gap between the aluminum base material and the welded copper pipe, and the aluminum material (1) and copper coating (2)
0.10 mm copper-coated aluminum wire (3). The copper coverage of this copper-coated aluminum wire (3) is 15
%Met.

Subsequently, the copper-coated aluminum wire (conductor) (3) was guided into a horizontal baking furnace, and a self-fusing insulated copper-coated aluminum wire (6 mm) having an outer diameter of 0.124 mm was formed in the same manner as in the first embodiment. ).

Third Embodiment Cu is added to an aluminum billet having a purity of 99.0% so as to have a final chemical composition of 5.0% Cu, melted, extruded by a die, and subjected to wire drawing. , Φ0.9m
m of the aluminum base material. Next, as a method of coating the outer periphery of the aluminum base material with copper, a surface zinc layer was formed on the aluminum base material whose surface was cleaned in the same manner as in the first embodiment by a zincate method. Subsequently, copper having a thickness of 2 μm was formed by a copper cyanide plating bath, and a copper film having a thickness of 40 μm was formed around the periphery thereof by a copper sulfate plating bath. Next, wire drawing is performed with a die,
Φ0.1 consisting of aluminum material (1) and copper coating (2)
This was a 0 mm copper-coated aluminum wire (3). The copper coverage of the copper-coated aluminum wire (3) was 15%.

Subsequently, the copper-coated aluminum wire (conductor) (3) was guided to a horizontal baking furnace, and a self-fusing insulated copper-coated aluminum wire (6 mm) having an outer diameter of 0.124 mm was formed in the same manner as in the first embodiment. ).

In the first to third embodiments described above,
When the chemical composition of aluminum was measured using an emission spectrophotometer, Cu was found to be 2.20% in the first embodiment and 2.20% in the second embodiment.
4.12%, 5.00% in the third embodiment, and other chemical components in each of the first to third embodiments are 0.06% of Si and 0.1% of Fe.
14%, Mn 0.07%, Mg 0.10%, Cr 0.06%, Z
The measurement results were as follows: n 0.01%, Ti 0.01%, and the balance Al.

Various characteristics were tested on the self-fusing insulated copper-coated aluminum wires obtained in the first to third embodiments. The results are shown in Table 1 below. Comparative form 1
Is a self-fusing insulated wire using a conventional CCAW.

[0024]

[Table 1]

As is clear from Table 1 above, the self-fusing insulated copper-coated aluminum wire of the present invention has extremely excellent mechanical properties such as cutting load and tensile strength.
Although not shown in the table, the insulated copper-coated aluminum wire of the present invention was free from disconnection during coil winding, and the coil winding speed could be increased.

[0026]

According to the copper-coated aluminum wire of the present invention, the outer periphery of the core wire is coated with copper, and the copper coverage is 20% or less. Easy. As a result, it is possible to reduce the size and weight of a conductor used as a coil wire of an electronic device component or the like. In addition, by using a core wire made of aluminum having the specific chemical component as the main conductor, insufficient mechanical strength of aluminum can be compensated. Further, the insulated copper-coated aluminum wire can not only improve the winding speed at the time of coil winding, but also can suppress disconnection at the time of winding. Therefore, the efficiency of the electronic device components can be increased, and the size and weight of the electronic device components can be reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of an insulated copper-coated aluminum wire of the present invention.

[Explanation of symbols]

Reference Signs List 1 core wire (aluminum material) 2 copper-coated 3 copper-coated aluminum wire (conductor) 4 insulating film (polyurethane insulating film) 5 fusion film (nylon fusion film) 6 self-fusing insulated copper-coated aluminum wire (insulated copper-coated aluminum wire) line)

Claims (4)

[Claims] 1. The method according to claim 1, wherein the chemical components are as follows: Si 0.2% or less;
e 0.2% or less, Cu 2.2% or more and 5.0% or less, Mn
0.15% or less, Mg 1.0% or less, Cr 0.10% or less, Z
A copper-coated aluminum wire, wherein a copper coating is formed on the outer periphery of a core wire composed of n 0.10% or less, Ti 0.10% or less, and the balance being Al. 2. The copper-coated aluminum wire according to claim 1, wherein the copper-coated aluminum wire has a copper coverage of 20% or less. 3. The copper coating of the copper-coated aluminum wire according to claim 1, wherein the copper coating is formed by a roll pressure welding method, a tape welding method, or the like.
A copper-coated aluminum wire characterized by being formed by a plating method. 4. An insulated copper-coated aluminum wire, further comprising an insulating coating and / or a fusion coating formed on the outer periphery of the copper-coated aluminum wire according to claim 1, 2 or 3.