JP2000049181A - 半導体装置および半導体装置の製造方法 - Google Patents

半導体装置および半導体装置の製造方法

Info

Publication number
JP2000049181A
JP2000049181A JP10214232A JP21423298A JP2000049181A JP 2000049181 A JP2000049181 A JP 2000049181A JP 10214232 A JP10214232 A JP 10214232A JP 21423298 A JP21423298 A JP 21423298A JP 2000049181 A JP2000049181 A JP 2000049181A
Authority
JP
Japan
Prior art keywords
film
electrode
plating film
electroless plating
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10214232A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000049181A5 (enExample
Inventor
Keiichiro Wakamiya
敬一郎 若宮
Kazuyuki Nakagawa
和之 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10214232A priority Critical patent/JP2000049181A/ja
Publication of JP2000049181A publication Critical patent/JP2000049181A/ja
Publication of JP2000049181A5 publication Critical patent/JP2000049181A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Chemically Coating (AREA)
  • Electrodes Of Semiconductors (AREA)
JP10214232A 1998-07-29 1998-07-29 半導体装置および半導体装置の製造方法 Pending JP2000049181A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10214232A JP2000049181A (ja) 1998-07-29 1998-07-29 半導体装置および半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10214232A JP2000049181A (ja) 1998-07-29 1998-07-29 半導体装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2000049181A true JP2000049181A (ja) 2000-02-18
JP2000049181A5 JP2000049181A5 (enExample) 2005-10-27

Family

ID=16652385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10214232A Pending JP2000049181A (ja) 1998-07-29 1998-07-29 半導体装置および半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2000049181A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358164A (ja) * 2000-06-13 2001-12-26 Ne Chemcat Corp 無電解多層めっき皮膜が形成された電極及びその製造方法
JP2003037128A (ja) * 2001-07-25 2003-02-07 Seiko Instruments Inc 半田バンプ電極の製造方法
JP2009117464A (ja) * 2007-11-02 2009-05-28 Kyocera Corp 半導体素子及び該半導体素子の実装構造体

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358164A (ja) * 2000-06-13 2001-12-26 Ne Chemcat Corp 無電解多層めっき皮膜が形成された電極及びその製造方法
JP2003037128A (ja) * 2001-07-25 2003-02-07 Seiko Instruments Inc 半田バンプ電極の製造方法
JP2009117464A (ja) * 2007-11-02 2009-05-28 Kyocera Corp 半導体素子及び該半導体素子の実装構造体

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