JP2000031082A - Laser annealer - Google Patents

Laser annealer

Info

Publication number
JP2000031082A
JP2000031082A JP19587598A JP19587598A JP2000031082A JP 2000031082 A JP2000031082 A JP 2000031082A JP 19587598 A JP19587598 A JP 19587598A JP 19587598 A JP19587598 A JP 19587598A JP 2000031082 A JP2000031082 A JP 2000031082A
Authority
JP
Japan
Prior art keywords
laser
chamber
laser annealing
substrate
gas supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19587598A
Other languages
Japanese (ja)
Other versions
JP3505395B2 (en
Inventor
Kazuhiro Imao
和博 今尾
Masashi Jinno
優志 神野
Yoshihiro Morimoto
佳宏 森本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP19587598A priority Critical patent/JP3505395B2/en
Publication of JP2000031082A publication Critical patent/JP2000031082A/en
Application granted granted Critical
Publication of JP3505395B2 publication Critical patent/JP3505395B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)

Abstract

PROBLEM TO BE SOLVED: To ensure good annealing by improving a laser annealer. SOLUTION: A gas supply valve 1 for supplying nitrogen gas into a chamber 14 foe performing laser anneal and a gas supply pipe 3 conducting with a gas supply pump 2 are introduced and a diffusion filter 5 is disposed in the vicinity of an air outlet 4. Since nitrogen gas flow introduced into the chamber 14 is diffused and nitrogen density is made uniform in the chamber 14, reactive substance removing effect is made constant in the chamber 14 and an element on a substrate 19 to be processed employing a film formed by laser anneal has uniform characteristics.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、基板上に良好な半
導体膜を形成するためのレーザーアニール装置に関す
る。
The present invention relates to a laser annealing apparatus for forming a good semiconductor film on a substrate.

【0002】[0002]

【従来の技術】近年、半導体装置の製造プロセスにおい
て、基板上の半導体膜にレーザーアニールを施すことに
より、活性化を促したり、非晶質膜を結晶化したりとい
ったことが行われている。中でも、耐熱限界温度の低い
基板を用いて液晶表示装置(LCD)を作製する場合、
基板上のアモルファスシリコン(a−Si)をレーザー
アニールにより結晶化して得られるポリシリコン(p−
Si)を用いれば、表示画素部におけるスイッチング素
子としてのみならず、表示画素部を駆動するための周辺
ドライバー部をも同一の基板上に一体的に形成すること
ができる。レーザーアニール技術は、このようなドライ
バー内蔵型LCDの量産には、欠くことのできない要素
となっている。
2. Description of the Related Art In recent years, in a semiconductor device manufacturing process, laser annealing has been performed on a semiconductor film on a substrate to promote activation or to crystallize an amorphous film. In particular, when manufacturing a liquid crystal display (LCD) using a substrate having a low heat-resistant limit temperature,
Polysilicon (p-) obtained by crystallizing amorphous silicon (a-Si) on a substrate by laser annealing
When Si) is used, not only a switching element in the display pixel portion but also a peripheral driver portion for driving the display pixel portion can be integrally formed on the same substrate. Laser annealing technology has become an indispensable element in mass production of such a driver built-in LCD.

【0003】図2に、このようなレーザーアニール装置
の構成を示す。(51)はレーザー媒質、共振系等から
なるレーザー発振源、(52)は、ライトシールド(5
7)内にレンズ(55)、ミラー(56)等が設置され
た光学系、(53)はレーザービームの最終照射部、
(54)はレーザーアニール処理が行われるチャンバ、
(58)はレーザーアニールすべきa−Siが形成され
た被処理基板(59)を支持するための載置台である。
FIG. 2 shows the structure of such a laser annealing apparatus. (51) is a laser oscillation source composed of a laser medium, a resonance system, etc., and (52) is a light shield (5).
7) an optical system in which a lens (55), a mirror (56) and the like are installed, (53) a final irradiation part of a laser beam,
(54) a chamber in which laser annealing is performed;
(58) is a mounting table for supporting the substrate (59) on which a-Si to be laser-annealed is formed.

【0004】レーザー発振源(51)にて生成されたレ
ーザー光は、光学系(52)にて所定の被照射領域の形
状に整形され、照射部(53)よりチャンバ(54)内
に照射される。チャンバ(54)はレーザーアニール処
理に最適な所定の圧力、温度に保たれる。チャンバ(5
4)内では、被処理基板(59)を載せた支持台(5
8)が一定方向に移動してレーザー照射領域を通過する
形でスキャンが行われ、全面にわたってレーザーアニー
ルが施される。
The laser light generated by the laser oscillation source (51) is shaped into a predetermined irradiated area by an optical system (52), and is irradiated from an irradiation section (53) into a chamber (54). You. The chamber (54) is maintained at a predetermined pressure and temperature optimum for laser annealing. Chamber (5
In 4), the support table (5) on which the substrate to be processed (59) is mounted is placed.
8) is moved in a fixed direction and scans while passing through the laser irradiation area, and laser annealing is performed on the entire surface.

【0005】[0005]

【発明が解決しようとする課題】レーザーアニール処理
においてa−Si(59)の結晶化が行われる際、これ
に付随して、他の様々な物理化学反応を招き、このよう
にして形成されたp−Si膜を用いた素子の特性が変動
してしまう。従って、チャンバ(54)内を真空雰囲気
として、物理化学反応を起こしやすい元素を取り除くこ
とが好ましい。しかしながら、このような真空状態に耐
えられるだけのチャンバ(54)、及び、排気・給気設
備を備えるとなると、装置が高価となる。また、被処理
基板(59)を出し入れする際の、真空引きに長時間を
要する。
When crystallization of a-Si (59) is performed in the laser annealing process, various other physicochemical reactions are accompanied by the crystallization, and thus, the crystallization of a-Si (59) is performed. The characteristics of the device using the p-Si film fluctuate. Therefore, it is preferable that the inside of the chamber (54) be set in a vacuum atmosphere to remove elements that easily cause a physicochemical reaction. However, if a chamber (54) capable of withstanding such a vacuum state and an exhaust / air supply facility are provided, the apparatus becomes expensive. In addition, it takes a long time to evacuate the substrate (59) in and out.

【0006】本発明の目的は、レーザーアニール時に、
余計な物理化学反応を招くことを防ぎ、かつ、製造コス
トを抑えたレーザーアニールを可能とする装置を提供す
ることにある。
An object of the present invention is to provide a laser
It is an object of the present invention to provide an apparatus capable of preventing unnecessary physicochemical reactions from occurring and performing laser annealing at a low manufacturing cost.

【0007】[0007]

【課題を解決するための手段】本発明は、この目的を達
成するもので、レーザー光を生成するレーザー発振源
と、複数の光学部品からなり前記レーザー発振源から射
出されたレーザー光を整形する光学系と、前記光学系か
ら送出されたレーザービームの被照射位置にてレーザー
アニールの対象物を支持する載置台を備えた処理室とを
有するレーザーアニール装置において、前記処理室は、
内部に不活性気体を導入するための導入管と、前記不活
性気体を拡散するための気体拡散手段とを具備する構成
である。
SUMMARY OF THE INVENTION The present invention achieves this object and comprises a laser oscillation source for generating a laser beam and a plurality of optical components for shaping the laser beam emitted from the laser oscillation source. In a laser annealing apparatus having an optical system and a processing chamber having a mounting table that supports an object to be laser-annealed at a position irradiated with the laser beam sent from the optical system, the processing chamber includes:
It is configured to include an introduction pipe for introducing an inert gas into the inside, and gas diffusion means for diffusing the inert gas.

【0008】これにより、処理室内が不活性ガスにより
置換されるので、レーザーアニール処理以外の物理化学
反応を招くことが防がれる。また、処理室内を真空引き
する必要が無いので、製造コストの増大が避けられる。
[0008] Thus, since the processing chamber is replaced with the inert gas, it is possible to prevent a physicochemical reaction other than the laser annealing. Further, since there is no need to evacuate the processing chamber, an increase in manufacturing cost can be avoided.

【0009】[0009]

【発明の実施の形態】図1は、本発明の実施の形態に係
るレーザーアニール装置の構成図である。(11)はレ
ーザー媒質、共振系等からなるレーザー発振源、(1
2)は、ライトシールド(17)内にレンズ(15)、
ミラー(16)等が設置された光学系、(13)はレー
ザービームの最終照射部、(14)はレーザーアニール
処理が行われるチャンバ、(18)はレーザーアニール
すべきa−Siが形成された被処理基板(19)を支持
するための載置台である。
FIG. 1 is a configuration diagram of a laser annealing apparatus according to an embodiment of the present invention. (11) is a laser oscillation source composed of a laser medium, a resonance system, etc., (1)
2) a lens (15) in a light shield (17),
An optical system provided with a mirror (16) and the like; (13) a final irradiation part of a laser beam; (14) a chamber in which laser annealing is performed; and (18) an a-Si to be laser-annealed. A mounting table for supporting the substrate to be processed (19).

【0010】チャンバ(14)は気密室で、給気バルブ
(1)、給気ポンプ(2)及びこれらに通ずる給気管
(3)からなる給気系、及び、排気バルブ(5)、排気
ポンプ(6)及び排気管(7)からなる排気系を装備し
ている。(5)はシャワーヘッド状に作られた本発明に
かかる拡散フィルターであり、チャンバ(14)内に導
入された給気管(3)の吹き出し口(4)に取り付けら
れている。
The chamber (14) is an airtight chamber, which is an air supply system comprising an air supply valve (1), an air supply pump (2) and an air supply pipe (3) communicating therewith, and an exhaust valve (5), an exhaust pump An exhaust system including (6) and an exhaust pipe (7) is provided. (5) is a diffusion filter according to the present invention formed in a shower head shape, and is attached to the outlet (4) of the air supply pipe (3) introduced into the chamber (14).

【0011】この構成で、レーザーアニール処理中は、
給気バルブ(1)と排気バルブ(5)とが開けられ、不
活性ガスとして、例えば、窒素がチャンバ(14)内に
導入され、排気系より排出される。この時、チャンバ
(14)内は大気圧とほぼ同じ気圧にされている。即
ち、レーザーアニール処理中は、チャンバ(14)が常
に窒素流により置換され続けている。このため、レーザ
ーアニール処理は、常時、不活性な窒素雰囲気中で行わ
れるので、レーザーエネルギーによって物理化学反応が
起こることが無くなる。また、レーザーアニール処理に
より活性化された反応性物質が生じても、窒素流により
取り除かれる。
With this configuration, during the laser annealing process,
The air supply valve (1) and the exhaust valve (5) are opened, and, for example, nitrogen as an inert gas is introduced into the chamber (14) and discharged from the exhaust system. At this time, the inside of the chamber (14) is kept at substantially the same pressure as the atmospheric pressure. That is, during the laser annealing process, the chamber (14) is constantly being replaced by the nitrogen flow. For this reason, since the laser annealing is always performed in an inert nitrogen atmosphere, a physicochemical reaction does not occur due to the laser energy. Further, even if a reactive substance activated by the laser annealing treatment is generated, it is removed by the nitrogen flow.

【0012】特に、本発明では、吹き出し口(4)に設
けられた拡散フィルター(5)のために、供給される窒
素気体流が拡散されてチャンバ(14)内に導入される
構成としている。これは、以下の理由による。もしも、
チャンバ(14)内に窒素流が勢いよく導入された場
合、チャンバ(14)内に窒素密度のばらつきが生じ、
窒素流による反応性物質の除去効果が被処理基板(1
9)上の位置によって異なってしまう。このため、レー
ザーアニールにより得られたp−Si膜を用いた素子の
特性が基板上でばらつくので、このような素子からなる
装置全体の動作に悪影響を及ぼしてしまう。従って、本
発明では、吹き出し口(4)に拡散フィルター(5)を
設けることにより、チャンバ(14)内に導入される窒
素流を拡散して、窒素の流れを均一にすることで、反応
性物質の除去効果を被処理基板(19)上で均一にし、
得られる素子の特性の安定化を達成している。
In particular, in the present invention, the supplied nitrogen gas stream is diffused and introduced into the chamber (14) for the diffusion filter (5) provided at the outlet (4). This is for the following reason. If,
When the nitrogen flow is vigorously introduced into the chamber (14), a variation in the nitrogen density occurs in the chamber (14),
The removal effect of the reactive substance by the nitrogen flow is high for the substrate (1
9) It depends on the position above. Therefore, the characteristics of the device using the p-Si film obtained by the laser annealing vary on the substrate, which adversely affects the operation of the entire device including such a device. Therefore, in the present invention, by providing the diffusion filter (5) at the outlet (4), the nitrogen flow introduced into the chamber (14) is diffused, and the flow of nitrogen is made uniform, whereby the reactivity is increased. The effect of removing substances is made uniform on the substrate to be processed (19),
The characteristics of the obtained device are stabilized.

【0013】[0013]

【発明の効果】以上の説明から明らかな如く、本発明の
レーザーアニール装置により、装置コストを増大させる
ことなく、レーザーアニール雰囲気が改善され、均一な
特性を得るレーザーアニールが実現された。
As is apparent from the above description, the laser annealing apparatus of the present invention has improved the laser annealing atmosphere without increasing the apparatus cost, and has realized laser annealing for obtaining uniform characteristics.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態にかかるレーザーアニール
装置の構成図である。
FIG. 1 is a configuration diagram of a laser annealing apparatus according to an embodiment of the present invention.

【図2】従来のレーザーアニール装置の構成図である。FIG. 2 is a configuration diagram of a conventional laser annealing apparatus.

【符号の説明】[Explanation of symbols]

1 給気バルブ 2 給気ポンプ 3 給気管 4 吹き出し口 5 拡散フィルター 11 レーザー発振源 12 光学系 13 照射部 14 チャンバ 15 レンズ 16 ミラー 17 ライトシールド 18 載置台 19 被処理基板 20 窓 DESCRIPTION OF SYMBOLS 1 Air supply valve 2 Air supply pump 3 Air supply pipe 4 Outlet 5 Diffusion filter 11 Laser oscillation source 12 Optical system 13 Irradiation unit 14 Chamber 15 Lens 16 Mirror 17 Light shield 18 Mounting table 19 Substrate to be processed 20 Window

フロントページの続き (72)発明者 森本 佳宏 大阪府守口市京阪本通2丁目5番5号 三 洋電機株式会社内 Fターム(参考) 2H092 JA28 KA04 KA05 MA30 MA35 NA24 NA27 Continued on the front page (72) Inventor Yoshihiro Morimoto 2-5-5 Keihanhondori, Moriguchi-shi, Osaka F-term (reference) in Sanyo Electric Co., Ltd. 2H092 JA28 KA04 KA05 MA30 MA35 NA24 NA27

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 レーザー光を生成するレーザー発振源
と、複数の光学部品からなり前記レーザー発振源から射
出されたレーザー光を整形する光学系と、前記光学系か
ら送出されたレーザービームの被照射位置にてレーザー
アニールの対象物を支持する載置台を備えた処理室とを
有するレーザーアニール装置において、 前記処理室は、内部に不活性気体を導入するための給気
手段と、導入された前記不活性気体を拡散するための拡
散手段とを具備することを特徴とするレーザーアニール
装置。
1. A laser oscillation source for generating a laser beam, an optical system comprising a plurality of optical components, and shaping a laser beam emitted from the laser oscillation source, and a laser beam emitted from the optical system being irradiated with the laser beam. In a laser annealing apparatus having a processing chamber provided with a mounting table that supports an object to be laser-annealed at a position, the processing chamber has an air supply means for introducing an inert gas into the inside thereof, and A laser annealing apparatus comprising: a diffusion unit for diffusing an inert gas.
JP19587598A 1998-07-10 1998-07-10 Laser annealing equipment Expired - Lifetime JP3505395B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19587598A JP3505395B2 (en) 1998-07-10 1998-07-10 Laser annealing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19587598A JP3505395B2 (en) 1998-07-10 1998-07-10 Laser annealing equipment

Publications (2)

Publication Number Publication Date
JP2000031082A true JP2000031082A (en) 2000-01-28
JP3505395B2 JP3505395B2 (en) 2004-03-08

Family

ID=16348449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19587598A Expired - Lifetime JP3505395B2 (en) 1998-07-10 1998-07-10 Laser annealing equipment

Country Status (1)

Country Link
JP (1) JP3505395B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190115232A1 (en) * 2017-10-13 2019-04-18 Boe Technology Group Co., Ltd. Excimer laser annealing apparatus
CN117894882A (en) * 2024-03-15 2024-04-16 河北大学 Optical annealing device and method for heterojunction of antimony selenide solar cell

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7034645B2 (en) 2017-09-22 2022-03-14 株式会社Screenホールディングス Board processing method and board processing equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190115232A1 (en) * 2017-10-13 2019-04-18 Boe Technology Group Co., Ltd. Excimer laser annealing apparatus
US10896829B2 (en) * 2017-10-13 2021-01-19 Boe Technology Group Co., Ltd. Excimer laser annealing apparatus
CN117894882A (en) * 2024-03-15 2024-04-16 河北大学 Optical annealing device and method for heterojunction of antimony selenide solar cell
CN117894882B (en) * 2024-03-15 2024-05-28 河北大学 Optical annealing device and method for heterojunction of antimony selenide solar cell

Also Published As

Publication number Publication date
JP3505395B2 (en) 2004-03-08

Similar Documents

Publication Publication Date Title
EP1067593B1 (en) Semiconductor thin film forming system
US6172322B1 (en) Annealing an amorphous film using microwave energy
KR100366010B1 (en) Crystallization method of thin semiconductor film and laser beam radiation apparatus used therefor
JPH01187814A (en) Manufacture of thin film semiconductor device
JP2000031082A (en) Laser annealer
KR100522643B1 (en) Method for manufacturing polycrystalline semiconductor layer, and laser annealing apparatus
JPH08139047A (en) Heat treatment apparatus
JP2000357798A (en) Thin-film transistor and its manufacture
JP2004006703A (en) Treatment method and its apparatus for annealing and doping semiconductor
JPH0555259A (en) Manufacturing device for liquid crystal display
JP3735394B2 (en) Method for manufacturing thin film semiconductor device
JP2006108271A (en) Method and device for converting amorphous silicon film into polysilicon film
JP3258121B2 (en) CVD equipment
JPH09199441A (en) Method for manufacturing a semiconductor device
JPH06208133A (en) Manufacture of liquid crystal display substrate
JP2008202114A (en) Thin-film-forming apparatus
JP3917934B2 (en) Laser annealing method
JPH11204433A (en) Method of manufacturing semiconductor film and liquid crystal display
JPS63207121A (en) Method and apparatus for manufacturing thin film by photo-cvd
JP3123530B2 (en) Low pressure chemical vapor deposition apparatus and film forming method thereof
JPH0598447A (en) Photo assisted cvd device
JP4137968B2 (en) Method for manufacturing thin film transistor
KR0177249B1 (en) Method for fabricating air gap of an optical projection system
JPH1140513A (en) Laser anneal equipment
JPH02260627A (en) Formation of semiconductor film and device therefor

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20031209

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20031215

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081219

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081219

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091219

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101219

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101219

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111219

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121219

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131219

Year of fee payment: 10

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term