JP3505395B2 - Laser annealing equipment - Google Patents

Laser annealing equipment

Info

Publication number
JP3505395B2
JP3505395B2 JP19587598A JP19587598A JP3505395B2 JP 3505395 B2 JP3505395 B2 JP 3505395B2 JP 19587598 A JP19587598 A JP 19587598A JP 19587598 A JP19587598 A JP 19587598A JP 3505395 B2 JP3505395 B2 JP 3505395B2
Authority
JP
Japan
Prior art keywords
laser
laser annealing
chamber
annealing apparatus
inert gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP19587598A
Other languages
Japanese (ja)
Other versions
JP2000031082A (en
Inventor
和博 今尾
優志 神野
佳宏 森本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP19587598A priority Critical patent/JP3505395B2/en
Publication of JP2000031082A publication Critical patent/JP2000031082A/en
Application granted granted Critical
Publication of JP3505395B2 publication Critical patent/JP3505395B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、基板上に良好な半
導体膜を形成するためのレーザーアニール装置に関す
る。
TECHNICAL FIELD The present invention relates to a laser annealing apparatus for forming a good semiconductor film on a substrate.

【0002】[0002]

【従来の技術】近年、半導体装置の製造プロセスにおい
て、基板上の半導体膜にレーザーアニールを施すことに
より、活性化を促したり、非晶質膜を結晶化したりとい
ったことが行われている。中でも、耐熱限界温度の低い
基板を用いて液晶表示装置(LCD)を作製する場合、
基板上のアモルファスシリコン(a−Si)をレーザー
アニールにより結晶化して得られるポリシリコン(p−
Si)を用いれば、表示画素部におけるスイッチング素
子としてのみならず、表示画素部を駆動するための周辺
ドライバー部をも同一の基板上に一体的に形成すること
ができる。レーザーアニール技術は、このようなドライ
バー内蔵型LCDの量産には、欠くことのできない要素
となっている。
2. Description of the Related Art In recent years, in a semiconductor device manufacturing process, a semiconductor film on a substrate is subjected to laser annealing to promote activation or to crystallize an amorphous film. Above all, when a liquid crystal display (LCD) is manufactured using a substrate having a low heat resistance limit temperature,
Polysilicon (p-) obtained by crystallizing amorphous silicon (a-Si) on the substrate by laser annealing.
If Si) is used, not only as a switching element in the display pixel section but also a peripheral driver section for driving the display pixel section can be integrally formed on the same substrate. The laser annealing technology is an essential element for mass production of such driver-incorporated LCDs.

【0003】図2に、このようなレーザーアニール装置
の構成を示す。(51)はレーザー媒質、共振系等から
なるレーザー発振源、(52)は、ライトシールド(5
7)内にレンズ(55)、ミラー(56)等が設置され
た光学系、(53)はレーザービームの最終照射部、
(54)はレーザーアニール処理が行われるチャンバ、
(58)はレーザーアニールすべきa−Siが形成され
た被処理基板(59)を支持するための載置台である。
FIG. 2 shows the structure of such a laser annealing apparatus. (51) is a laser oscillation source including a laser medium and a resonance system, and (52) is a light shield (5
An optical system in which a lens (55), a mirror (56) and the like are installed in 7), and (53) is a final irradiation part of a laser beam,
(54) is a chamber in which laser annealing is performed,
Reference numeral (58) is a mounting table for supporting the target substrate (59) on which a-Si to be laser annealed is formed.

【0004】レーザー発振源(51)にて生成されたレ
ーザー光は、光学系(52)にて所定の被照射領域の形
状に整形され、照射部(53)よりチャンバ(54)内
に照射される。チャンバ(54)はレーザーアニール処
理に最適な所定の圧力、温度に保たれる。チャンバ(5
4)内では、被処理基板(59)を載せた支持台(5
8)が一定方向に移動してレーザー照射領域を通過する
形でスキャンが行われ、全面にわたってレーザーアニー
ルが施される。
The laser light generated by the laser oscillation source (51) is shaped by the optical system (52) into the shape of a predetermined irradiation area, and is irradiated from the irradiation unit (53) into the chamber (54). It The chamber (54) is maintained at a predetermined pressure and temperature that are optimal for the laser annealing process. Chamber (5
In the inside of 4), the support base (5) on which the substrate (59) to be processed is placed
8) is scanned in such a manner that it moves in a certain direction and passes through the laser irradiation region, and laser annealing is performed on the entire surface.

【0005】[0005]

【発明が解決しようとする課題】レーザーアニール処理
においてa−Si(59)の結晶化が行われる際、これ
に付随して、他の様々な物理化学反応を招き、このよう
にして形成されたp−Si膜を用いた素子の特性が変動
してしまう。従って、チャンバ(54)内を真空雰囲気
として、物理化学反応を起こしやすい元素を取り除くこ
とが好ましい。しかしながら、このような真空状態に耐
えられるだけのチャンバ(54)、及び、排気・給気設
備を備えるとなると、装置が高価となる。また、被処理
基板(59)を出し入れする際の、真空引きに長時間を
要する。
When a-Si (59) is crystallized in the laser annealing process, various other physicochemical reactions are accompanied with the crystallization of a-Si (59). The characteristics of the element using the p-Si film change. Therefore, it is preferable to remove the element that easily causes the physicochemical reaction by setting the vacuum atmosphere in the chamber (54). However, if the chamber (54) that can withstand such a vacuum state and the exhaust / air supply equipment are provided, the apparatus becomes expensive. Further, it takes a long time to evacuate the substrate (59) to be processed.

【0006】本発明の目的は、レーザーアニール時に、
余計な物理化学反応を招くことを防ぎ、かつ、製造コス
トを抑えたレーザーアニールを可能とする装置を提供す
ることにある。
An object of the present invention is to perform laser annealing at
An object of the present invention is to provide an apparatus capable of preventing an unnecessary physicochemical reaction and enabling laser annealing while suppressing the manufacturing cost.

【0007】[0007]

【課題を解決するための手段】本発明は、この目的を達
成するもので、レーザー光を生成するレーザー発振源
と、複数の光学部品からなり前記レーザー発振源から射
出されたレーザー光を整形する光学系と、前記光学系か
ら送出されたレーザービームの被照射位置にてレーザー
アニールの対象物を支持する載置台を備えた処理室とを
有するレーザーアニール装置において、前記処理室は、
内部に不活性気体を導入するための導入管と、前記不活
性気体を拡散するための気体拡散手段とを具備する構成
である。
The present invention achieves this object, and comprises a laser oscillation source for generating a laser beam and a laser beam emitted from the laser oscillation source, which is composed of a plurality of optical components. In a laser annealing apparatus having an optical system and a processing chamber provided with a mounting table for supporting an object to be laser-annealed at a position to be irradiated with a laser beam sent from the optical system, the processing chamber comprises:
This is a configuration including an introduction pipe for introducing an inert gas into the interior, and a gas diffusion means for diffusing the inert gas.

【0008】これにより、処理室内が不活性ガスにより
置換されるので、レーザーアニール処理以外の物理化学
反応を招くことが防がれる。また、処理室内を真空引き
する必要が無いので、製造コストの増大が避けられる。
As a result, the inside of the processing chamber is replaced with the inert gas, so that it is possible to prevent physicochemical reactions other than laser annealing. Further, since it is not necessary to evacuate the processing chamber, increase in manufacturing cost can be avoided.

【0009】[0009]

【発明の実施の形態】図1は、本発明の実施の形態に係
るレーザーアニール装置の構成図である。(11)はレ
ーザー媒質、共振系等からなるレーザー発振源、(1
2)は、ライトシールド(17)内にレンズ(15)、
ミラー(16)等が設置された光学系、(13)はレー
ザービームの最終照射部、(14)はレーザーアニール
処理が行われるチャンバ、(18)はレーザーアニール
すべきa−Siが形成された被処理基板(19)を支持
するための載置台である。
1 is a block diagram of a laser annealing apparatus according to an embodiment of the present invention. (11) is a laser oscillation source including a laser medium and a resonance system,
2) is a lens (15) in the light shield (17),
An optical system provided with a mirror (16) and the like, (13) a final irradiation part of a laser beam, (14) a chamber where laser annealing is performed, and (18) formed a-Si to be laser annealed. This is a mounting table for supporting the substrate (19) to be processed.

【0010】チャンバ(14)は気密室で、給気バルブ
(1)、給気ポンプ(2)及びこれらに通ずる給気管
(3)からなる給気系、及び、排気バルブ(5)、排気
ポンプ(6)及び排気管(7)からなる排気系を装備し
ている。(5)はシャワーヘッド状に作られた本発明に
かかる拡散フィルターであり、チャンバ(14)内に導
入された給気管(3)の吹き出し口(4)に取り付けら
れている。
The chamber (14) is an airtight chamber, and has an air supply system including an air supply valve (1), an air supply pump (2) and an air supply pipe (3) communicating therewith, and an exhaust valve (5) and an exhaust pump. It is equipped with an exhaust system consisting of (6) and an exhaust pipe (7). (5) is a shower head-shaped diffusion filter according to the present invention, which is attached to the outlet (4) of the air supply pipe (3) introduced into the chamber (14).

【0011】この構成で、レーザーアニール処理中は、
給気バルブ(1)と排気バルブ(5)とが開けられ、不
活性ガスとして、例えば、窒素がチャンバ(14)内に
導入され、排気系より排出される。この時、チャンバ
(14)内は大気圧とほぼ同じ気圧にされている。即
ち、レーザーアニール処理中は、チャンバ(14)が常
に窒素流により置換され続けている。このため、レーザ
ーアニール処理は、常時、不活性な窒素雰囲気中で行わ
れるので、レーザーエネルギーによって物理化学反応が
起こることが無くなる。また、レーザーアニール処理に
より活性化された反応性物質が生じても、窒素流により
取り除かれる。
With this configuration, during the laser annealing process,
The air supply valve (1) and the exhaust valve (5) are opened, and, for example, nitrogen as an inert gas is introduced into the chamber (14) and discharged from the exhaust system. At this time, the inside of the chamber (14) is kept at an atmospheric pressure almost equal to the atmospheric pressure. That is, during the laser annealing process, the chamber (14) is constantly replaced by the nitrogen flow. For this reason, the laser annealing process is always performed in an inert nitrogen atmosphere, so that a physicochemical reaction does not occur due to laser energy. Further, even if a reactive substance activated by the laser annealing process is generated, it is removed by the nitrogen flow.

【0012】特に、本発明では、吹き出し口(4)に設
けられた拡散フィルター(5)のために、供給される窒
素気体流が拡散されてチャンバ(14)内に導入される
構成としている。これは、以下の理由による。もしも、
チャンバ(14)内に窒素流が勢いよく導入された場
合、チャンバ(14)内に窒素密度のばらつきが生じ、
窒素流による反応性物質の除去効果が被処理基板(1
9)上の位置によって異なってしまう。このため、レー
ザーアニールにより得られたp−Si膜を用いた素子の
特性が基板上でばらつくので、このような素子からなる
装置全体の動作に悪影響を及ぼしてしまう。従って、本
発明では、吹き出し口(4)に拡散フィルター(5)を
設けることにより、チャンバ(14)内に導入される窒
素流を拡散して、窒素の流れを均一にすることで、反応
性物質の除去効果を被処理基板(19)上で均一にし、
得られる素子の特性の安定化を達成している。
Particularly, in the present invention, due to the diffusion filter (5) provided at the outlet (4), the supplied nitrogen gas flow is diffused and introduced into the chamber (14). This is for the following reason. If,
When the flow of nitrogen is vigorously introduced into the chamber (14), variations in nitrogen density occur in the chamber (14),
The effect of removing the reactive substance by the nitrogen flow is
9) It depends on the position above. For this reason, the characteristics of the element using the p-Si film obtained by laser annealing vary on the substrate, which adversely affects the operation of the entire device including such an element. Therefore, in the present invention, by providing the diffusion filter (5) at the outlet (4), the nitrogen flow introduced into the chamber (14) is diffused and the nitrogen flow is made uniform, so that the reactivity is improved. To make the substance removal effect uniform on the substrate (19) to be processed,
Stabilization of the characteristics of the obtained device is achieved.

【0013】[0013]

【発明の効果】以上の説明から明らかな如く、本発明の
レーザーアニール装置により、装置コストを増大させる
ことなく、レーザーアニール雰囲気が改善され、均一な
特性を得るレーザーアニールが実現された。
As is apparent from the above description, the laser annealing apparatus of the present invention realizes laser annealing in which the laser annealing atmosphere is improved and uniform characteristics are obtained without increasing the apparatus cost.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施の形態にかかるレーザーアニール
装置の構成図である。
FIG. 1 is a configuration diagram of a laser annealing apparatus according to an embodiment of the present invention.

【図2】従来のレーザーアニール装置の構成図である。FIG. 2 is a configuration diagram of a conventional laser annealing apparatus.

【符号の説明】[Explanation of symbols]

1 給気バルブ 2 給気ポンプ 3 給気管 4 吹き出し口 5 拡散フィルター 11 レーザー発振源 12 光学系 13 照射部 14 チャンバ 15 レンズ 16 ミラー 17 ライトシールド 18 載置台 19 被処理基板 20 窓 1 Air supply valve 2 Air supply pump 3 air supply pipe 4 outlet 5 Diffusion filter 11 Laser oscillation source 12 Optical system 13 Irradiation part 14 chambers 15 lenses 16 mirror 17 Light shield 18 table 19 substrate to be processed 20 windows

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平9−8316(JP,A) 特開 平10−172911(JP,A) 特開 平10−74753(JP,A) 特開 昭61−129834(JP,A) 特開 平9−102467(JP,A) 特開 平6−17120(JP,A) 特開 平10−149984(JP,A) 特開 昭55−12748(JP,A) (58)調査した分野(Int.Cl.7,DB名) H01L 21/26 - 21/268 H01L 21/322 - 21/326 H01L 21/20 ─────────────────────────────────────────────────── --- Continuation of the front page (56) References JP-A-9-8316 (JP, A) JP-A 10-172911 (JP, A) JP-A 10-74753 (JP, A) JP-A 61- 129834 (JP, A) JP 9-102467 (JP, A) JP 6-17120 (JP, A) JP 10-149984 (JP, A) JP 55-12748 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H01L 21/26-21/268 H01L 21/322-21/326 H01L 21/20

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 レーザー光を生成するレーザー発信源
と、複数の光学部品からなり前記レーザー発信源から射
出されたレーザー光を整形する光学系と、前記光学系か
ら送出されたレーザービームの被照射位置にてレーザー
アニールの対象物を指示する載置台を備えた処理室とを
有するレーザーアニール装置において、 前記処理室は、内部に不活性気体を導入するための給気
手段と、導入された前記不活性気体を前記処理室に均一
拡散し、ばらつきが生じないようにするための拡散手
段とを具備することを特徴とするレーザーアニール装
置。
1. A laser source for generating a laser beam, an optical system composed of a plurality of optical components for shaping the laser beam emitted from the laser source, and a laser beam emitted from the optical system to be irradiated. In a laser annealing apparatus having a processing chamber provided with a mounting table for indicating an object to be laser-annealed at a position, the processing chamber has an air supply means for introducing an inert gas therein, and the introduced gas. Uniform inert gas in the processing chamber
Spread, comprising a diffusion means so that variation does not occur that the laser annealing apparatus according to claim.
【請求項2】 前記不活性気体は窒素を主成分とするこ
とを特徴とする請求項1に記載のレーザーアニール装
置。
2. The laser annealing apparatus according to claim 1, wherein the inert gas contains nitrogen as a main component.
【請求項3】 前記拡散手段はシャワーヘッド状に作ら
れた拡散フィルターであることを特徴とする請求項1に
記載のレーザーアニール装置。
3. The laser annealing apparatus according to claim 1, wherein the diffusing unit is a diffusing filter formed in a shower head shape.
JP19587598A 1998-07-10 1998-07-10 Laser annealing equipment Expired - Lifetime JP3505395B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19587598A JP3505395B2 (en) 1998-07-10 1998-07-10 Laser annealing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19587598A JP3505395B2 (en) 1998-07-10 1998-07-10 Laser annealing equipment

Publications (2)

Publication Number Publication Date
JP2000031082A JP2000031082A (en) 2000-01-28
JP3505395B2 true JP3505395B2 (en) 2004-03-08

Family

ID=16348449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19587598A Expired - Lifetime JP3505395B2 (en) 1998-07-10 1998-07-10 Laser annealing equipment

Country Status (1)

Country Link
JP (1) JP3505395B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10892177B2 (en) 2017-09-22 2021-01-12 SCREEN Holdings Co., Ltd. Substrate processing method and substrate processing apparatus

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107706092B (en) * 2017-10-13 2021-01-26 京东方科技集团股份有限公司 Excimer laser annealing equipment
CN117894882B (en) * 2024-03-15 2024-05-28 河北大学 Optical annealing device and method for heterojunction of antimony selenide solar cell

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10892177B2 (en) 2017-09-22 2021-01-12 SCREEN Holdings Co., Ltd. Substrate processing method and substrate processing apparatus

Also Published As

Publication number Publication date
JP2000031082A (en) 2000-01-28

Similar Documents

Publication Publication Date Title
EP1067593B1 (en) Semiconductor thin film forming system
US6242291B1 (en) Laser annealing method and laser annealing device
US7396712B2 (en) Thin film processing method and thin processing apparatus
US6632711B2 (en) Process for producing thin film semiconductor device and laser irradiation apparatus
US7419861B2 (en) Laser irradiation apparatus, laser irradiation method, semiconductor device, and method of manufacturing a semiconductor device
JP3586558B2 (en) Method for reforming thin film and apparatus used for implementing the method
EP0886319A2 (en) Method for making a thin film transistor
KR100534501B1 (en) Method for processing thin film and apparatus for processing thin film
JP2001035806A (en) Manufacture of semiconductor thin film
JPH01187814A (en) Manufacture of thin film semiconductor device
JP3505395B2 (en) Laser annealing equipment
KR100522643B1 (en) Method for manufacturing polycrystalline semiconductor layer, and laser annealing apparatus
JP2004006703A (en) Treatment method and its apparatus for annealing and doping semiconductor
JPH1126854A (en) Laser annealing apparatus
JPH08213341A (en) Laser annealing and irradiation with laser beam
JP2002093738A (en) Manufacturing device for polycrystalline semiconductor film
JP2000216088A (en) Method of forming semiconductor thin film and laser irradiator
JPH05275336A (en) Manufacture of polycrystalline semiconductor thin film and laser anneal device
JP3735394B2 (en) Method for manufacturing thin film semiconductor device
JPH1126393A (en) Laser annealer
JP3315738B2 (en) Laser annealing method and liquid crystal display device manufacturing method
JPH06208133A (en) Manufacture of liquid crystal display substrate
JP3917934B2 (en) Laser annealing method
JPH11204433A (en) Method of manufacturing semiconductor film and liquid crystal display
JPH1140513A (en) Laser anneal equipment

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20031209

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20031215

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081219

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081219

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091219

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101219

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101219

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111219

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121219

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131219

Year of fee payment: 10

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term