JP2000006080A - Substrate processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a pulley from conducting idle rotation at the time of adjusting tension, and adjust the tension easily. SOLUTION: A tension adjusting pulley 61 is supported so as to slide on a straight line L1 connecting the centers M of pulleys 48, 49 to each other, inside a frictional transmission belt 50. The diameter of the pulley 61 is set so as to be equal to that of the pulley having a larger diameter of the two pulleys 48, 49.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for performing predetermined processing on a substrate, and more particularly to a tension adjusting apparatus for adjusting the tension of a friction transmission belt for transporting a substrate.

[0002]

2. Description of the Related Art Generally, in a wafer processing apparatus for performing a predetermined process on a wafer of a semiconductor device, a wafer input position and a processing position are set to different positions.

For this reason, in this wafer processing apparatus, a wafer transfer robot for transferring a wafer is provided between a wafer input position and a processing position.

As the wafer transfer robot, for example, an articulated arm type robot is used. This articulated arm type robot is a robot that transfers a wafer using an articulated robot arm.

The articulated robot arm is configured by connecting a plurality of arms in series. Each arm is rotationally driven based on a rotational motion generated from a rotational drive source. Thus, the articulated robot arm is driven to rotate or expand and contract. The wafer is transferred by the rotation drive and the expansion / contraction drive.

[0006] As a rotary transmission for transmitting the rotary motion generated by the rotary drive source to the arm, for example, a rotary transmission of a winding transmission type is used. This winding transmission type rotation transmission device is a device that transmits rotational motion using two pulleys and a friction transmission belt wound around the two pulleys. In the wafer transfer robot, a metal belt is usually used as the friction transmission belt. This is to suppress the generation of particles from the friction transmission belt.

[0007] When a wrapping transmission type rotary transmission is used as the rotary transmission, a tension adjusting device for adjusting the tension of the friction transmission belt is usually provided. As this tension adjusting device, for example, there is a device using a tension adjusting pulley.

In the case of using a device using a tension adjusting pulley as a tension adjusting device in the articulated arm type robot, it is necessary to make the bending direction of the friction transmission belt by the pulley and the bending direction of the friction transmission belt by the tension adjusting pulley the same. There is. This is because if the two bending directions are set to different directions, the durability of the friction transmission belt decreases.

In order to meet this demand, in a conventional tension adjusting device using a tension adjusting pulley, the two bending directions are made the same by arranging the tension adjusting roller inside the friction transmission belt. .
FIG. 11 is a plan view showing the configuration of the tension adjusting device.

In the illustrated tension adjusting device, the tension adjusting pulley 11 is disposed inside a friction transmission belt 14 wound around pulleys 12 and 13. Also,
This pulley 11 has a center M between the two pulleys 12 and 13.
It is disposed on one of the left and right sides of a straight line L1 connecting the lines M1 and M2.
Furthermore, the diameter of this pulley 11 is
3 is set to be smaller than the diameter of the pulley 11 having a large diameter. The pulley 11 is connected to a straight line L1.
Are supported so as to be slidable in a direction (X1-X2) intersecting with.

In the above configuration, the friction transmission belt 14 is pushed outward by the tension adjusting pulley 11.
Thereby, the friction transmission belt 14 is bent by the tension adjusting pulley 11 in the same direction as the bending direction by the pulleys 12 and 13, that is, inward. Thereby, the durability of the friction transmission belt 14 is enhanced.

[0012]

However, in the above configuration, the friction transmission belt 14 is pushed only on one of the left and right sides of the straight line L1. As a result, when adjusting the tension,
There is a problem that the pulleys 12 and 13 idle and the relative angles of the adjacent arms may shift. Further, in such a configuration, there is a problem that it is difficult to adjust the tension.

In order to solve this problem, it is conceivable to use a device as shown in FIG. 12 as a tension adjusting device. This tension adjusting device adjusts the tension of the friction transmission belt 14 by inserting a length adjuster 15 in the middle of the friction transmission belt 14 and adjusting the length of the friction transmission belt 14 by the length adjuster 15. Things. However, even with such a configuration,
At the time of adjusting the tension, the friction transmission belt 14 can apply a force only to one of the left and right sides of the straight line L1, so that the above problem cannot be solved.

Accordingly, the present invention provides a method for adjusting tension,
An object of the present invention is to provide a substrate processing apparatus provided with a tension adjusting device capable of preventing a pulley from idling and easily adjusting a tension.

[0015]

According to a first aspect of the present invention, there is provided a substrate processing apparatus including a substrate processing unit and a substrate transfer unit. Here, the substrate processing means is means for performing a predetermined processing on the substrate. The substrate transfer means is a means for transferring a substrate.

The substrate transfer means has a rotational motion generating means, a transfer means, a rotation transmission means, and a tension adjusting means. Here, the rotating motion generating means is a means for generating a rotating motion. The transfer means is means for transferring the substrate based on the rotational motion generated by the rotational motion generating means. The rotation transmitting means is means for transmitting the rotational movement of the rotational movement generating means to the conveying means. This rotation transmission means has two pulleys having different diameters and a friction transmission belt wound between the two pulleys,
These are used to transmit rotational motion. Further, the tension adjusting means is means for adjusting the tension of the friction transmission belt of the rotation transmission means.

The tension adjusting means has a tension adjusting pulley and a pulley supporting means. Here, the tension adjusting pulley is a pulley that applies tension to a friction transmission belt by pushing the belt. The diameter of this pulley is set to be larger than the diameter of the smaller one of the two pulleys of the rotary transmission means. The pulley supporting means is means for supporting the tension adjusting pulley slidably on a straight line connecting the centers of the two pulleys of the rotary transmission means.

In the substrate processing apparatus according to the first aspect, the tension adjusting pulley is supported inside the friction transmission belt so as to be slidable on a straight line connecting the centers of the two pulleys of the rotary transmission means. . The diameter of this pulley is set to be larger than the diameter of the smaller one of the two pulleys of the rotary transmission means. Thus, the friction transmission belt is evenly pushed by the tension adjusting pulley on both the left and right sides of a straight line connecting the centers of the two pulleys of the rotary transmission means. As a result, at the time of adjusting the tension, it is possible to prevent the pulley of the rotation transmission means from idling. In addition, the tension can be easily adjusted.

In this substrate processing apparatus, if the diameter of the tension adjusting pulley is set to be equal to or less than the diameter of the larger pulley of the two pulleys of the rotary transmission means, the winding of the friction transmission belt around this pulley is performed. The angle can be set to 180 degrees or more. Thereby, the transmission torque by this pulley can be increased.

[0020]

Embodiments of the present invention will be described below in detail with reference to the drawings.

[1] One Embodiment [1-1] Overall Configuration of Substrate Processing Apparatus First, the overall configuration of an embodiment of the present invention will be described with reference to FIG. FIG. 1 is a plan view showing the overall configuration. FIG. 5 shows a typical case where the present invention is applied to a single wafer processing apparatus.

The illustrated wafer processing apparatus has two wafer processing chambers 21 and 22 and two load lock chambers 23 and 2.
4 and one wafer transfer chamber 25.

Here, the wafer processing chambers 21 and 22 are chambers for performing predetermined processing on the wafer W of the semiconductor device. The load lock chambers 23 and 24 are rooms for preventing the inside of the wafer processing chambers 21 and 22 from being opened to the atmosphere. Further, the wafer transfer chamber 25 includes:
This is a room for transferring the wafer W. A wafer transfer robot 26 for transferring the wafer W is accommodated inside the wafer transfer chamber 25. As the wafer transfer robot 26, for example, an articulated arm type robot is used.

[1-2] Operation of Substrate Processing Apparatus The operation of the substrate processing apparatus in the above configuration will be described.

A plurality of wafers W to be processed are loaded into the load lock chambers 23 and 24 while being housed in a cassette. This loading process is performed by a cassette transport device (not shown). When the loading process is completed, the load lock chambers 23 and 24 are purified by, for example, an inert gas. When the cleaning process is completed, the wafer W is transferred to the wafer processing chambers 21 and 21 by the wafer transfer robot 26.
2 is transferred. Thereby, a predetermined process is performed on the wafer W. When this process is completed, the wafer W is transferred to the load lock chambers 23 and 2 by the wafer transfer robot 26.
4 is returned to the cassette.

When the above processing is performed for all of the plurality of wafers W stored in the cassette, the cassette is unloaded from the load lock chambers 23 and 24 by the cassette transfer device. Hereinafter, similarly, the above-described processing is performed again on the wafer W stored in the next cassette.

[1-3] Configuration of Wafer Transfer Robot 26 Next, referring to FIG.
An example of the configuration will be described. FIG. 6 is a side sectional view showing the configuration of the robot 26. As shown in FIG.

The illustrated wafer transfer robot 26 has a robot arm 31, a rotation drive device 32, and rotation transmission devices 33 and 34. The robot arm 31 is configured by a two-joint robot arm. Rotary drive 3
Reference numeral 2 denotes a two-axis rotary drive device. Here, the two-axis rotation drive device is a device that rotationally drives two rotationally driven objects by two coaxially arranged rotary shafts. The rotation transmission devices 33 and 34 are configured by winding transmission-type rotation transmission devices.

The robot arm 31 includes a lower arm 41
, An upper arm 42 and a wafer holder 43. The rotation drive device 32 has first and second drive motors 44 and 45 of a direct drive system. The rotation shaft 441 of the first drive motor 44 is formed in a cylindrical shape,
The rotary shaft 451 of the drive motor 45 is formed in a cylindrical shape. Both rotating shafts 441 and 451 are arranged coaxially.

The rotary transmission 33 is provided on the lower arm 41, and the rotary transmission 34 is provided on the upper arm 42. The rotary transmission 33 has a fixed pulley 48, a transmission pulley 49, and a friction transmission belt 50. The rotation transmission device 34 includes an idle pulley 51, a driven pulley 52, and a friction transmission belt 54.

The base end of the lower arm 41 is fixed to the rotation shaft 441 of the first drive motor 44. A connecting shaft 46 is provided at the free end of the lower arm 41.
A transmission pulley 49 is rotatably attached to the center of the connecting shaft 46. A floating pulley 51 is fixed to the upper end.

The upper arm 42 is fixed to the transmission pulley 49. The upper arm 42 and the floating pulley 51 are connected via a bearing. Upper arm 4
A driven shaft 47 is fixed to the second free end. A driven pulley 52 is rotatably attached to the driven shaft 47. The driven pulley 52 has a wafer holding portion 4
3 is fixed. The fixed pulley 48 is fixed to a rotation shaft 451 of the second drive motor 45. The friction transmission belt 50 is wound around the fixed pulley 48 and the transmission pulley 49. The friction transmission belt 53 is wound around the floating pulley 51 and the driven pulley 52.

[1-4] Operation of Wafer Transfer Robot 26 The operation of the wafer transfer robot 26 in the above configuration will be described. As this transport operation, as shown in FIG.
There are an operation of transferring the wafer W and an operation of changing the transfer direction of the wafer W as shown in FIG.

First, the operation of transferring the wafer W will be described. FIG. 7A shows a state where the robot arm 31 is contracted. When the wafer W is transported forward from this state, as shown in FIG. 7B, the lower arm 41 is driven to rotate counterclockwise and the upper arm 42 is driven to rotate clockwise to hold the wafer. The part 43 is driven to rotate counterclockwise. Thereby, the robot arm 31 is extended. As a result, the wafer W is transferred forward.

Thereafter, as shown in FIG. 7C, the lower arm 41 is rotated by 90 degrees, and the upper arm 42 is
When the wafer holder 47 is driven to rotate by 90 degrees and rotated by 90 degrees, the robot arm 31 becomes linear. Thus, the transfer of the wafer W to the front is completed.

When the wafer W is transported backward, the lower arm 41 is driven to rotate clockwise in the drawing, and the upper arm 42 is driven to rotate counterclockwise, as opposed to the case where the wafer W is transported forward. The wafer holder 43 is driven to rotate clockwise. Thereby, the robot arm 31 is contracted. As a result, the wafer W is transferred backward.

The above operation will be described in more detail with reference to FIG. Here, FIG.
, Upper arm 42, fixed pulley 48, floating pulley 51, driven pulley 52, and friction transmission belts 50 and 53.
It is a top view which shows rotation with.

When the wafer W is transported forward, FIG.
Is set to the stop mode, and
The first drive motor 44 is set to the rotation mode. In this case, the rotation shaft 441 of the first drive motor 44 is driven to rotate counterclockwise when viewed from above. As a result, the lower arm 41 is driven to rotate counterclockwise.

When the lower arm 41 is driven to rotate counterclockwise, the fixed pulley 48 is driven to rotate relatively clockwise as shown in FIG. This rotation is
The power is transmitted to the transmission pulley 49 via the friction transmission belt 50. Thereby, the transmission pulley 49 is driven to rotate clockwise. As a result, the upper arm 42 is driven to rotate clockwise. Thereby, the floating pulley 51 is driven to rotate relatively counterclockwise. This rotation is transmitted to the driven pulley 52 via the friction transmission belt 53. As a result, the driven pulley 52 is driven to rotate counterclockwise.
As a result, the wafer holder 43 is driven to rotate counterclockwise.

In this case, the fixed pulley 48 and the transmission pulley 4
The rotation ratio with respect to 9 is set to 1: 2. Thus, as shown in the schematic diagram of FIG. 10, when the lower arm 41 rotates by the angle α, the upper arm 42 rotates by the angle 2α.

The rotation ratio between the idle pulley 51 and the driven pulley 53 is set to 2: 1 as described above.
Thereby, as shown in the schematic diagram of FIG.
When 2 rotates by the angle 2α, the wafer holder 43 rotates by the angle α. As a result, the wafer W is transferred forward.

When the wafer W is transported backward, the rotating shaft 441 of the first drive motor 44 is rotated clockwise when viewed from above, contrary to the case where the wafer W is transported forward.
Thereby, in this case, the reverse operation to the case of transporting forward is performed.

Next, the operation for changing the transfer direction of the wafer W will be described. In this case, the robot arm 31
Is in a contracted state as shown in FIG. When the transfer direction of the wafer W is changed by 90 degrees clockwise from this state, the lower arm 41 is rotationally driven, for example, clockwise as shown in FIG. 8B. On the other hand, the upper arm 42 is held in a posture overlapping the lower arm 41. In addition, the substrate holding unit 43 includes the upper arm 4
2 is held at an angle of 90 degrees.

As a result, the robot arm 31 is
It is driven to rotate clockwise while maintaining the state shown in FIG. As a result, the transfer direction of the wafer W is changed as shown in FIG.
As shown in the figure, the angle is changed 90 degrees clockwise.

In this state, when the wafer W is transported in the counterclockwise direction, the lower arm 41 is rotated 90 degrees in the counterclockwise direction. As a result, the transfer direction of the wafer W is changed by 90 degrees in the counterclockwise direction.

The above operation will be described in more detail with reference to FIG.

When the transfer direction of the wafer W is changed in the clockwise direction, the rotating shafts 441 and 451 of the first and second drive motors 44 and 45 are driven to rotate in synchronization with the clockwise direction. Thus, the arms 41 and 42 are rotated clockwise while maintaining the overlapping state. As a result, the transfer direction of the wafer W is changed clockwise. Conversely, when changing the transfer direction of the wafer W in the counterclockwise direction, the rotating shafts 441 and 451 of the drive motors 44 and 45 are synchronously driven in the counterclockwise direction. Thereby, the arms 41, 42
Are rotated counterclockwise while maintaining the overlapping state.

[1-5] Configuration of Tension Adjusting Device Next, referring to FIGS.
Tension adjusting device 6 for adjusting the tension of 0, 53
0 will be described.

The tension adjusting device 60 of the present embodiment
Are incorporated in the arms 41 and 42, and the friction transmission belt 5
Adjust the tension at 0,53. FIG. 1 shows a case where the tension adjusting device 60 is incorporated in the lower arm 41. Note that the configuration when the tension adjusting device 60 is incorporated into the upper arm 42 is the same as the configuration when the tension adjusting device 60 is incorporated into the lower arm 41, and a description thereof will be omitted.

The illustrated tension adjusting device 60 has a tension adjusting pulley 61 for adjusting the tension of the friction transmission belt 50. This tension adjustment pulley 6
1 is disposed inside a friction transmission belt 50 wound around pulleys 48 and 49. In addition, this pulley 61
Is a straight line L1 connecting the centers M1 and M2 of the pulleys 48 and 49.
It is arranged above. That is, the pulley 61 is disposed such that its center is located on the straight line L1.
Further, the pulley 61 is supported so as to be slidable on the straight line L1. The diameter of the pulley 61 is 2
Of the two pulleys 48 and 49,
That is, the diameter is set to be the same as the diameter of the fixed pulley 48.

FIGS. 2 and 3 show a tension adjusting device 60.
FIG. Here, FIG. 2A is a plan view of the tension adjusting device 60, and FIG. 2B is a side sectional view. FIG. 3 is an exploded side sectional view of the tension adjusting device 60.

As shown in these figures, in addition to the tension adjusting pulley 61, the tension adjusting device 60 includes a pulley support 62, a bearing 63, and a C-shaped retaining ring 6 for a hole.
4, a C-shaped retaining ring 65 for a shaft, and fixing bolts 66, 67
And washers 68 and 69. The tension adjustment pulley 61 is rotatably supported by a pulley support 62 via a bearing 63. The pulley 61 is prevented from coming off the pulley support 62 by retaining rings 64 and 65. The pulley support 62 includes washers 68, 6
9, the lower arm 41 is fixed by the fixing bolts 66, 67.
It is fixed to.

The tension adjusting pulley 61 has a cylindrical belt contact portion 611 and a bearing portion 612. These are arranged coaxially. These upper ends are connected by a ring-shaped connecting plate 613.
As a result, the tension adjusting pulley 61 in which the belt contact portion 611, the bearing portion 612, and the connecting plate 613 are integrated is formed.

The lower end of the belt contact portion 611 is open. On the other hand, a bottom plate 1a is formed at the lower end of the bearing 612. The bottom plate 1a is formed with a shaft through hole 2a through which the rotation shaft passes. A groove 3a (see FIG. 3) for fixing the C-shaped retaining ring 64 for a hole is formed on the inner side surface of the bearing portion 612.

The connecting plate 613 has two fixing bolts 6
Two bolt through holes 4a, 5a for passing the 6, 67 are formed. The bolt through holes 4 a and 5 a are arranged symmetrically with respect to the center of the connecting plate 613. The bolt holes 4a and 5a are formed as long holes. In this case, the elongated hole is formed to extend in the radial direction of the connecting plate 613.

The pulley support 62 has an elongated plate-shaped mounting portion 621. Both ends of the mounting portion 621 are formed in an arc shape in accordance with the curvature of the belt contact portion 611 of the tension adjusting pulley 61. A rotation shaft 622 is formed on the upper surface of the center of the mounting portion 621. A bearing mounting portion 6a (see FIG. 3) for mounting a bearing is formed on a side surface of the rotating shaft 622. Also, on the side surface of the rotating shaft 622,
A groove 7a for fixing the shaft C-shaped retaining ring 65 is formed.

The mounting portion 621 is formed with bolt through holes 8a and 9a through which two fixing bolts 68 and 69 pass. The bolt through holes 8 a and 9 a are formed symmetrically with respect to the center of the mounting portion 621. The bolt holes 8a and 9a are formed as long holes. In this case, the elongated hole is formed to extend in the radial direction of the connecting plate 613.

[1-6] Assembling of Tension Adjustment Device 60 In the above configuration, an example of how to assemble the tension adjustment device 60 will be described with reference to FIG.

First, the rotating shaft 622 of the pulley support 62 is passed through the shaft through hole 2a of the tension adjusting pulley 61. Next, the bearing 63 is fitted to the rotating shaft 622. At this time, the bearing 63 is mounted on the bearing mounting portion 6a formed on the side surface of the rotating shaft 622.

Next, for example, the C-shaped retaining ring 65 for the shaft is fitted into the groove 7 a formed on the side surface of the rotating shaft 622. Thus, the bearing 63 is fixed to the rotating shaft 622.
Next, the C-shaped retaining ring 64 for a hole is fitted into the groove 3 a formed on the side surface of the bearing portion 612. As a result, the tension adjusting pulley 61 is connected to the rotating shaft 622 via the bearing 63.
That is, it is supported rotatably.

[1-7] Attachment of Tension Adjustment Device 60 Next, an example of how to attach the tension adjustment device 60 to the lower arm 41 will be described with reference to FIG. Here, FIG. 4 is a plan view showing a mounting position of the tension adjusting device 60 on the lower arm 41.

As shown in the figure, the lower arm 41 has, for example, six bolt holes 71, 72, 7 along the straight line L1.
3, 74, 75, 76 are formed. These are used as bolt holes for attaching the tension adjusting device 60 to the lower arm 41. Here, in the figure, the first bolt hole 71 and the fourth bolt hole 74 from the left side form a pair. Similarly, the second bolt hole 72 and the fifth bolt hole 75, the third bolt hole 73 and the sixth bolt hole 76
Are paired with each other. Spacing D1 of the pair of bolt holes
Is set to coincide with the distance between the centers of the bolt through holes 8a, 9a of the pulley support 62.

The tension adjusting device 60 is connected to the lower arm 41.
In the case of mounting on any one of the three pairs of bolt holes described above, any one pair of bolt holes is selected. Then, the mounting bolts 66 and 67 are screwed into the selected bolt holes. For example, when the bolt holes 71 and 74 are selected,
The mounting bolts 66 and 67 are screwed to these. Thereby, the tension adjusting device 60 is attached to the lower arm 41. In this case, the mounting bolt 66 is screwed into the bolt hole 71 via the bolt through hole 4 a formed in the connecting plate 613 of the tension adjusting pulley 61 and the bolt through hole 8 a formed in the mounting portion 621 of the pulley support 62. Is done. Similarly, the mounting bolt 67 is screwed into the bolt hole 74 via the bolt through hole 5a formed in the connecting plate 613 and the bolt through hole 6a formed in the mounting portion 621.

[1-8] Adjustment of Tension Next, adjustment of the tension of the friction transmission belt 50 will be described with reference to FIG.

The tension adjusting pulley 61 is disposed inside the friction transmission belt 50. Also, this pulley 6
1 is disposed on the straight line L1. Further, the diameter of the pulley 61 is set to be the same as the diameter of the larger fixed pulley 48 of the two pulleys 48 and 49.

Thus, the friction transmission belt 50 is pushed from the inside to the outside by the tension adjusting pulley 61. The belt 50 is evenly pushed on both the left and right sides of the straight line L1. Thereby, the friction transmission belt 5
0 is evenly tensioned on the left and right sides of the straight line L1 by the tension adjusting pulley 61.

This tension is adjusted by sliding the tension adjusting pulley 61 along the straight line L1. In this case, if the tension adjusting pulley 61 is moved to the fixed pulley 48 side, the tension increases. Conversely, if it is moved to the transmission pulley 49 side, the tension is reduced.

There are the following two methods for moving the tension adjusting pulley 49. The first method is to remove the mounting bolts 66 and 67 and move them.
A second method is to loosen the mounting bolts 66 and 67 and move them. The maximum movement amount in this case is an amount obtained by subtracting the diameter of the mounting bolts 66, 67 from the length of the bolt through holes 8a, 9a. The moving operation according to the first method is also an operation of selecting a mounting position of the tension adjusting device 60. In this tension adjusting method, the coarse adjustment of the tension is performed. On the other hand, in the second method, fine adjustment of the tension is performed.

[1-9] Effects According to the present embodiment described in detail above, the following effects can be obtained.

(1) First, according to the present embodiment, the tension adjusting pulley 61 is slidably supported on the straight line L1 inside the friction transmission belt 50. The diameter of the pulley 61 is the smaller of the two pulleys, that is, the transmission pulley 49.
It is set to be larger than the diameter of. As a result, the tension can be evenly applied to the friction transmission belt 50 on both the left and right sides of the straight line L1. As a result, it is possible to prevent the pulleys 48 and 49 from idling at the time of adjusting the tension. Thereby, the arms 41, 4
2 can be prevented from shifting. Further, tension can be easily applied to the friction transmission belt 50.

(2) According to this embodiment, the diameter of the tension adjusting pulley 61 is the larger of the two pulleys 48, 49, that is, the fixed pulley 48.
It is set to be the same as the diameter. Thereby, the winding angle of the friction transmission belt 50 around the fixed pulley 48 is set to 1
An angle of 80 degrees can be secured. As a result, the transmission torque of the fixed pulley 48 can be increased.

(3) According to this embodiment, the diameter of the tension adjusting pulley 61 is set to be the same as the diameter of the fixed pulley 48 as described above. Thereby, the adjustment range of the tension of the friction transmission belt 50 can be increased as compared with the case where the diameter of the tension adjusting pulley 61 is smaller than the diameter of the fixed pulley 48.

(4) According to the present embodiment, three pairs of bolt holes (71, 74), (72, 75),
(73, 76) are provided. Thereby, the adjustment range of the tension of the friction transmission belt 50 can be increased as compared with the case where only a pair of bolt holes are provided.

[2] Other Embodiments While one embodiment of the present invention has been described in detail, the present invention is not limited to the above-described embodiment.

(1) For example, in the above embodiment, the case where the diameter of the tension adjusting pulley 61 is made equal to the diameter of the larger one of the two pulleys 48 and 49 has been described. However, in the present invention, as long as the diameter of the tension adjusting pulley 61 is made larger than the diameter of the smaller diameter pulley 49, it may be larger or smaller than the diameter of the larger diameter pulley 48. Is also good. in this case,
If the diameter is smaller than the diameter of the larger pulley 48, the winding angle of the friction transmission belt 50 around the pulley 48 can be made larger than 180 degrees. Thus, in this case, the transmission torque of pulley 48 can be increased as compared with the previous embodiment.

(2) In the above embodiment, the case where the present invention is applied to a tension adjusting device of a wafer transfer robot for directly transferring a wafer has been described. However, the present invention can also be applied to a tension adjusting device of a wafer transfer robot that transfers a wafer indirectly. That is, the present invention can be applied to a tension adjusting device of a wafer transfer robot that transfers a wafer in a state of being housed in a wafer housing such as a cassette.

(3) In the above embodiment, the case where the present invention is applied to a tension adjusting device of a wafer transfer robot for transferring a semiconductor device wafer has been described. However, the present invention can also be applied to a tension adjusting device of a glass substrate transport robot that transports a glass substrate of a liquid crystal display device. In other words, the present invention can be generally applied to a tension adjusting device of a substrate transport device such as a substrate transport robot that transports a substrate of a solid-state device.

(4) In the above embodiment, the case where the present invention is applied to the tension adjusting device of the substrate transfer device has been described. However, the present invention can be applied to a tension adjusting device of an apparatus other than the substrate transfer apparatus. In other words, the present invention is an apparatus necessary for performing a predetermined process on a substrate of a solid-state device, and can be generally applied to a tension adjusting apparatus of an apparatus using a winding transmission.

(5) In addition, it goes without saying that the present invention can be variously modified and implemented without departing from the scope of the invention.

[0080]

As described above in detail, according to the substrate processing apparatus of the first aspect, the tension adjusting pulley can slide on the straight line connecting the centers of the two pulleys inside the friction transmission belt. It is supported by. The diameter of the tension adjusting pulley is set to be equal to or less than the diameter of the larger one of the two pulleys and larger than the diameter of the smaller one. Thereby, at the time of adjusting the tension, it is possible to prevent the two pulleys from idling, and it is possible to easily apply tension to the friction transmission belt.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration of a tension adjusting device in a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of a tension adjusting device in the substrate processing apparatus according to one embodiment of the present invention.

FIG. 3 is an exploded view showing a configuration of a tension adjusting device in the substrate processing apparatus according to one embodiment of the present invention.

FIG. 4 is a plan view showing a configuration of a mounting position of a tension adjusting device in the substrate processing apparatus according to one embodiment of the present invention.

FIG. 5 is a plan view showing the overall configuration of the substrate processing apparatus according to one embodiment of the present invention.

FIG. 6 is a side sectional view showing a configuration of a wafer transfer robot in the substrate processing apparatus according to one embodiment of the present invention.

FIG. 7 is a diagram for explaining the operation of the wafer transfer robot in the substrate processing apparatus according to one embodiment of the present invention.

FIG. 8 is a diagram for explaining the operation of the wafer transfer robot in the substrate processing apparatus according to one embodiment of the present invention.

FIG. 9 is a diagram for explaining the operation of the wafer transfer robot in the substrate processing apparatus according to one embodiment of the present invention.

FIG. 10 is a diagram for explaining the operation of the wafer transfer robot in the substrate processing apparatus according to one embodiment of the present invention.

FIG. 11 is a plan view showing a configuration of an example of a conventional tension adjusting device.

FIG. 12 is a plan view showing the configuration of another example of the conventional tension adjusting device.

[Explanation of symbols]

21, 22 wafer processing chamber, 23, 24 load lock chamber, 25 wafer transfer chamber, 26 wafer transfer robot, 31 robot arm, 32 rotary drive device, 3
Reference numerals 3, 34: rotary transmission device, 41: lower arm, 42: upper arm, 43: wafer holder, 44: first drive motor, 441: rotary shaft, 45: second drive motor, 45
DESCRIPTION OF SYMBOLS 1 ... Rotating shaft, 46 ... Connecting shaft, 47 ... Driven shaft, 48 ... Fixed pulley, 49 ... Transmission pulley, 50 ... Friction transmission belt, 5
DESCRIPTION OF SYMBOLS 1 ... Floating pulley, 52 ... Driven pulley, 53 ... Friction transmission belt, 60 ... Tension adjustment device, 61 ... Tension adjustment pulley, 62 ... Pulley support, 63 ... Bearing, 6
4: C-shaped retaining ring for hole, 65: C-shaped retaining ring for shaft, 66, 6
7 mounting bolts, 68, 69 washers, 611 belt contact portion, 612 bearing portion, 613 connecting plate, 621
Mounting portion, 622: rotating shaft, 1a: bottom plate, 2a: shaft through hole, 3a: groove, 4a, 5a: bolt through hole, 6a: bearing mounting portion, 7a: groove, 8a, 9a: bolt through hole.

Claims (1)

[Claims] 1. A substrate processing means for performing a predetermined process on a substrate, a substrate transport means for transporting the substrate, the substrate transport means comprising: a rotational motion generating means for generating a rotational motion; Transport means for transporting the substrate on the basis of the rotational movement generated by the means; two pulleys having different diameters; and a friction transmission belt wound between the two pulleys; A rotation transmission means for transmitting the rotational movement of the means to the conveyance means; and a tension adjustment means for adjusting the tension of the friction transmission belt of the rotation transmission means, wherein the tension adjustment means pushes the friction transmission belt. A tension adjusting pulley having a diameter larger than the diameter of the smaller one of the two pulleys. Pulley support means for supporting the tension adjustment pulley slidably on a straight line connecting the centers of the two pulleys inside the friction transmission belt wound around the two pulleys of the rotary transmission means; A substrate processing apparatus comprising: