JP1664282S - - Google Patents

Info

Publication number
JP1664282S
JP1664282S JPD2019-16521F JP2019016521F JP1664282S JP 1664282 S JP1664282 S JP 1664282S JP 2019016521 F JP2019016521 F JP 2019016521F JP 1664282 S JP1664282 S JP 1664282S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2019-16521F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2019-16521F priority Critical patent/JP1664282S/ja
Priority to TW108306575F priority patent/TWD209934S/zh
Priority to US29/720,895 priority patent/USD934821S1/en
Application granted granted Critical
Publication of JP1664282S publication Critical patent/JP1664282S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2019-16521F 2019-07-24 2019-07-24 Active JP1664282S (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2019-16521F JP1664282S (zh) 2019-07-24 2019-07-24
TW108306575F TWD209934S (zh) 2019-07-24 2019-10-23 半導體元件之部分
US29/720,895 USD934821S1 (en) 2019-07-24 2020-01-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2019-16521F JP1664282S (zh) 2019-07-24 2019-07-24

Publications (1)

Publication Number Publication Date
JP1664282S true JP1664282S (zh) 2020-07-27

Family

ID=71663371

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2019-16521F Active JP1664282S (zh) 2019-07-24 2019-07-24

Country Status (3)

Country Link
US (1) USD934821S1 (zh)
JP (1) JP1664282S (zh)
TW (1) TWD209934S (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD994624S1 (en) 2021-03-23 2023-08-08 Rohm Co., Ltd. Power semiconductor module
USD1021831S1 (en) 2021-03-23 2024-04-09 Rohm Co., Ltd. Power semiconductor module
USD1030686S1 (en) 2021-03-23 2024-06-11 Rohm Co., Ltd. Power semiconductor module

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD958762S1 (en) * 2019-09-09 2022-07-26 The Noco Company Circuit board
USD951212S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951215S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951213S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
USD951214S1 (en) * 2019-12-11 2022-05-10 Panasonic Semiconductor Solutions Co., Ltd. Semiconductor device
CA202671S (en) * 2021-04-09 2024-05-15 9493662 Canada Inc Microfluidic slab with 2 well arrangements
CA202670S (en) * 2021-04-09 2024-05-15 9493662 Canada Inc Microfluidic slab with 4 well arrangements

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US273559A (en) * 1883-03-06 Chaeles s
US295023A (en) * 1884-03-11 Jesse l
US729489A (en) * 1902-10-04 1903-05-26 Mattson Rubber Company Game-piece.
US1998526A (en) * 1932-09-23 1935-04-23 Schubert Philipp Domino
USD319045S (en) * 1988-04-13 1991-08-13 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
USD319814S (en) * 1988-04-13 1991-09-10 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
USD318461S (en) * 1988-04-13 1991-07-23 Ibiden Co., Ltd. Semi-conductor mounting substrate
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
US5370398A (en) * 1993-06-30 1994-12-06 Nguyen; Thang V. Close and open game
JPH0945723A (ja) * 1995-07-31 1997-02-14 Rohm Co Ltd 半導体チップおよびこの半導体チップを組み込んだ半導体装置ならびにその製造方法
JP2843315B1 (ja) * 1997-07-11 1999-01-06 株式会社日立製作所 半導体装置およびその製造方法
KR100209760B1 (ko) * 1996-12-19 1999-07-15 구본준 반도체 패키지 및 이의 제조방법
USD427159S (en) * 1997-06-27 2000-06-27 Sony Corporation Semiconductor element
JP2001257307A (ja) * 2000-03-09 2001-09-21 Sharp Corp 半導体装置
USD457146S1 (en) * 2000-11-29 2002-05-14 Kabushiki Kaisha Toshiba Substrate for a semiconductor element
USD456367S1 (en) * 2000-12-15 2002-04-30 Protek Devices, Lp Semiconductor chip
USD466093S1 (en) * 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
US6753482B1 (en) * 2002-05-06 2004-06-22 Micron Technology, Inc. Semiconductor component with adjustment circuitry
USD487430S1 (en) * 2002-07-10 2004-03-09 Matsushita Electric Industrial Co., Ltd. Semiconductor memory element
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD540272S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD598380S1 (en) * 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
KR101744756B1 (ko) * 2010-06-08 2017-06-09 삼성전자 주식회사 반도체 패키지
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
TWD149025S (zh) * 2011-11-08 2012-09-01 精工愛普生股份有限公司 墨匣用電路基板
USD687898S1 (en) * 2012-06-11 2013-08-13 Raymond Lupkas Set of pai-gow tiles
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD754083S1 (en) * 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module
USD789456S1 (en) * 2015-02-12 2017-06-13 Wenlan H. Frost Set of square domino tiles
JP1581768S (zh) 2016-08-02 2017-07-24
JP1588481S (zh) 2017-04-26 2017-10-16
JP1588125S (zh) 2017-04-26 2017-10-16
JP1604002S (zh) * 2017-09-27 2018-05-14
JP1603911S (zh) * 2017-09-27 2018-05-14
JP1604003S (zh) * 2017-09-27 2018-05-14
JP1640664S (zh) 2018-06-19 2019-09-09
JP1641048S (zh) 2018-06-19 2019-09-09
JP1641049S (zh) 2018-06-19 2019-09-09
JP1632160S (zh) 2018-09-28 2019-05-27
JP1632597S (zh) 2018-09-28 2019-05-27
JP1642346S (zh) * 2019-03-20 2019-09-30

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD994624S1 (en) 2021-03-23 2023-08-08 Rohm Co., Ltd. Power semiconductor module
USD1021831S1 (en) 2021-03-23 2024-04-09 Rohm Co., Ltd. Power semiconductor module
USD1030686S1 (en) 2021-03-23 2024-06-11 Rohm Co., Ltd. Power semiconductor module

Also Published As

Publication number Publication date
USD934821S1 (en) 2021-11-02
TWD209934S (zh) 2021-02-21

Similar Documents

Publication Publication Date Title
JP1642346S (zh)
BR112021017339A2 (zh)
JP1664282S (zh)
BR112021018450A2 (zh)
BR112021017939A2 (zh)
BR112021017738A2 (zh)
BR112021017892A2 (zh)
BR112021017782A2 (zh)
BR112021017637A2 (zh)
BR112021018168A2 (zh)
BR112021018452A2 (zh)
BR112021017234A2 (zh)
BR112021017355A2 (zh)
BR112021017703A2 (zh)
BR112021017173A2 (zh)
BR112021018102A2 (zh)
BR112021018584A2 (zh)
BR112021017083A2 (zh)
BR112021018250A2 (zh)
BR112021018084A2 (zh)
BR112021018093A2 (zh)
BR112021013128A2 (zh)
BR112021018484A2 (zh)
BR112021016821A2 (zh)
BR112021017949A2 (zh)