JP1664282S - - Google Patents
Info
- Publication number
- JP1664282S JP1664282S JPD2019-16521F JP2019016521F JP1664282S JP 1664282 S JP1664282 S JP 1664282S JP 2019016521 F JP2019016521 F JP 2019016521F JP 1664282 S JP1664282 S JP 1664282S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2019-16521F JP1664282S (cs) | 2019-07-24 | 2019-07-24 | |
| TW108306575F TWD209934S (zh) | 2019-07-24 | 2019-10-23 | 半導體元件之部分 |
| US29/720,895 USD934821S1 (en) | 2019-07-24 | 2020-01-16 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2019-16521F JP1664282S (cs) | 2019-07-24 | 2019-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1664282S true JP1664282S (cs) | 2020-07-27 |
Family
ID=71663371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2019-16521F Active JP1664282S (cs) | 2019-07-24 | 2019-07-24 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD934821S1 (cs) |
| JP (1) | JP1664282S (cs) |
| TW (1) | TWD209934S (cs) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD994624S1 (en) | 2021-03-23 | 2023-08-08 | Rohm Co., Ltd. | Power semiconductor module |
| USD1021831S1 (en) | 2021-03-23 | 2024-04-09 | Rohm Co., Ltd. | Power semiconductor module |
| USD1030686S1 (en) | 2021-03-23 | 2024-06-11 | Rohm Co., Ltd. | Power semiconductor module |
| USD1056861S1 (en) | 2021-03-23 | 2025-01-07 | Rohm Co., Ltd. | Power semiconductor module |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD958762S1 (en) * | 2019-09-09 | 2022-07-26 | The Noco Company | Circuit board |
| USD903813S1 (en) | 2019-09-09 | 2020-12-01 | Michael G. Hetman | Rodent trap |
| USD951214S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD951215S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD951212S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD951213S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| CA202671S (en) * | 2021-04-09 | 2024-05-15 | 9493662 Canada Inc | Microfluidic slab with 2 well arrangements |
| CA202670S (en) * | 2021-04-09 | 2024-05-15 | 9493662 Canada Inc | Microfluidic slab with 4 well arrangements |
| JP1725480S (cs) * | 2022-01-05 | 2022-09-22 | ||
| JP1725479S (cs) * | 2022-01-05 | 2022-09-22 | ||
| USD1050059S1 (en) * | 2022-06-17 | 2024-11-05 | Seiko Epson Corporation | Circuit board for computer printers |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US295023A (en) * | 1884-03-11 | Jesse l | ||
| US273559A (en) * | 1883-03-06 | Chaeles s | ||
| US729489A (en) * | 1902-10-04 | 1903-05-26 | Mattson Rubber Company | Game-piece. |
| US1998526A (en) * | 1932-09-23 | 1935-04-23 | Schubert Philipp | Domino |
| USD319629S (en) * | 1988-04-13 | 1991-09-03 | Ibiden Co., Ltd. | Semiconductor substrate with conducting pattern |
| USD318461S (en) * | 1988-04-13 | 1991-07-23 | Ibiden Co., Ltd. | Semi-conductor mounting substrate |
| USD319814S (en) * | 1988-04-13 | 1991-09-10 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
| USD319045S (en) * | 1988-04-13 | 1991-08-13 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
| US5370398A (en) * | 1993-06-30 | 1994-12-06 | Nguyen; Thang V. | Close and open game |
| JPH0945723A (ja) * | 1995-07-31 | 1997-02-14 | Rohm Co Ltd | 半導体チップおよびこの半導体チップを組み込んだ半導体装置ならびにその製造方法 |
| JP2843315B1 (ja) * | 1997-07-11 | 1999-01-06 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
| KR100209760B1 (ko) * | 1996-12-19 | 1999-07-15 | 구본준 | 반도체 패키지 및 이의 제조방법 |
| USD427159S (en) * | 1997-06-27 | 2000-06-27 | Sony Corporation | Semiconductor element |
| JP2001257307A (ja) * | 2000-03-09 | 2001-09-21 | Sharp Corp | 半導体装置 |
| USD457146S1 (en) * | 2000-11-29 | 2002-05-14 | Kabushiki Kaisha Toshiba | Substrate for a semiconductor element |
| USD456367S1 (en) * | 2000-12-15 | 2002-04-30 | Protek Devices, Lp | Semiconductor chip |
| USD466093S1 (en) * | 2001-04-27 | 2002-11-26 | Taiyo Yuden Co., Ltd. | Hybird integrated circuit board |
| US6753482B1 (en) * | 2002-05-06 | 2004-06-22 | Micron Technology, Inc. | Semiconductor component with adjustment circuitry |
| TWD101154S1 (zh) * | 2002-07-10 | 2004-11-01 | 松下電器產業股份有限公司 | 資訊記憶用半導體元件 |
| USD510728S1 (en) * | 2004-08-11 | 2005-10-18 | Semiconductor Components Industries Llc | Semiconductor device package |
| USD504874S1 (en) * | 2004-08-11 | 2005-05-10 | Semiconductor Components Industries, Llc | Semiconductor device package |
| USD540272S1 (en) * | 2005-04-18 | 2007-04-10 | Murata Manufacturing Co., Ltd. | Semiconductor module |
| USD598380S1 (en) * | 2008-05-09 | 2009-08-18 | Fujifilm Corporation | Conductive sheet |
| USD648290S1 (en) * | 2010-06-08 | 2011-11-08 | Miyoshi Electronics Corporation | Semiconductor device |
| KR101744756B1 (ko) * | 2010-06-08 | 2017-06-09 | 삼성전자 주식회사 | 반도체 패키지 |
| TWD149025S (zh) * | 2011-11-08 | 2012-09-01 | 精工愛普生股份有限公司 | 墨匣用電路基板 |
| USD687898S1 (en) * | 2012-06-11 | 2013-08-13 | Raymond Lupkas | Set of pai-gow tiles |
| USD721047S1 (en) * | 2013-03-07 | 2015-01-13 | Vlt, Inc. | Semiconductor device |
| USD754083S1 (en) * | 2013-10-17 | 2016-04-19 | Vlt, Inc. | Electric terminal |
| USD768115S1 (en) * | 2015-02-05 | 2016-10-04 | Armen E. Kazanchian | Module |
| USD789456S1 (en) * | 2015-02-12 | 2017-06-13 | Wenlan H. Frost | Set of square domino tiles |
| JP1582228S (cs) | 2016-08-02 | 2017-07-24 | ||
| JP1588481S (cs) | 2017-04-26 | 2017-10-16 | ||
| JP1588125S (cs) | 2017-04-26 | 2017-10-16 | ||
| JP1604002S (cs) * | 2017-09-27 | 2018-05-14 | ||
| JP1603911S (cs) * | 2017-09-27 | 2018-05-14 | ||
| JP1604003S (cs) * | 2017-09-27 | 2018-05-14 | ||
| JP1641048S (cs) | 2018-06-19 | 2019-09-09 | ||
| JP1640664S (cs) | 2018-06-19 | 2019-09-09 | ||
| JP1641049S (cs) | 2018-06-19 | 2019-09-09 | ||
| JP1632597S (cs) | 2018-09-28 | 2019-05-27 | ||
| JP1632160S (cs) | 2018-09-28 | 2019-05-27 | ||
| JP1642346S (cs) * | 2019-03-20 | 2019-09-30 |
-
2019
- 2019-07-24 JP JPD2019-16521F patent/JP1664282S/ja active Active
- 2019-10-23 TW TW108306575F patent/TWD209934S/zh unknown
-
2020
- 2020-01-16 US US29/720,895 patent/USD934821S1/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD994624S1 (en) | 2021-03-23 | 2023-08-08 | Rohm Co., Ltd. | Power semiconductor module |
| USD1021831S1 (en) | 2021-03-23 | 2024-04-09 | Rohm Co., Ltd. | Power semiconductor module |
| USD1030686S1 (en) | 2021-03-23 | 2024-06-11 | Rohm Co., Ltd. | Power semiconductor module |
| USD1056861S1 (en) | 2021-03-23 | 2025-01-07 | Rohm Co., Ltd. | Power semiconductor module |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD209934S (zh) | 2021-02-21 |
| USD934821S1 (en) | 2021-11-02 |