JP1648531S - - Google Patents

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Publication number
JP1648531S
JP1648531S JPD2019-1458F JP2019001458F JP1648531S JP 1648531 S JP1648531 S JP 1648531S JP 2019001458 F JP2019001458 F JP 2019001458F JP 1648531 S JP1648531 S JP 1648531S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2019-1458F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2019-1458F priority Critical patent/JP1648531S/ja
Priority to TW108303614F priority patent/TWD203444S/zh
Priority to US29/699,539 priority patent/USD901564S1/en
Application granted granted Critical
Publication of JP1648531S publication Critical patent/JP1648531S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2019-1458F 2019-01-28 2019-01-28 Active JP1648531S (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2019-1458F JP1648531S (zh) 2019-01-28 2019-01-28
TW108303614F TWD203444S (zh) 2019-01-28 2019-06-19 基板處理裝置用氣體導入管
US29/699,539 USD901564S1 (en) 2019-01-28 2019-07-26 Gas inlet attachment for wafer processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2019-1458F JP1648531S (zh) 2019-01-28 2019-01-28

Publications (1)

Publication Number Publication Date
JP1648531S true JP1648531S (zh) 2019-12-23

Family

ID=68916739

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2019-1458F Active JP1648531S (zh) 2019-01-28 2019-01-28

Country Status (3)

Country Link
US (1) USD901564S1 (zh)
JP (1) JP1648531S (zh)
TW (1) TWD203444S (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD964443S1 (en) 2020-08-18 2022-09-20 Kokusai Electric Corporation Gas inlet attachment for wafer processing apparatus

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1624352S (zh) * 2018-07-19 2019-02-12
JP1651622S (zh) * 2019-07-17 2020-01-27
JP1672083S (zh) * 2019-11-13 2020-11-09
JP1672164S (zh) * 2020-03-25 2020-11-09
JP1684258S (zh) 2020-07-27 2021-04-26
USD983151S1 (en) * 2020-09-09 2023-04-11 Kokusai Electric Corporation Exhaust liner for reaction tube
JP1700780S (zh) 2021-03-22 2021-11-29
TWD223988S (zh) 2022-03-03 2023-03-01 家登精密工業股份有限公司 氣匣

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD326273S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
USD326272S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
KR100500246B1 (ko) * 2003-04-09 2005-07-11 삼성전자주식회사 가스공급장치
JP5044931B2 (ja) * 2005-10-31 2012-10-10 東京エレクトロン株式会社 ガス供給装置及び基板処理装置
CN100451163C (zh) * 2006-10-18 2009-01-14 中微半导体设备(上海)有限公司 用于半导体工艺件处理反应器的气体分布装置及其反应器
JP2009239082A (ja) * 2008-03-27 2009-10-15 Tokyo Electron Ltd ガス供給装置、処理装置及び処理方法
JP5292160B2 (ja) * 2009-03-31 2013-09-18 東京エレクトロン株式会社 ガス流路構造体及び基板処理装置
US10683571B2 (en) * 2014-02-25 2020-06-16 Asm Ip Holding B.V. Gas supply manifold and method of supplying gases to chamber using same
US20150348755A1 (en) * 2014-05-29 2015-12-03 Charm Engineering Co., Ltd. Gas distribution apparatus and substrate processing apparatus including same
JP6578243B2 (ja) * 2015-07-17 2019-09-18 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ ガス供給ノズル、基板処理装置、半導体装置の製造方法およびプログラム
USD787458S1 (en) * 2015-11-18 2017-05-23 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
TWD178424S (zh) * 2016-01-08 2016-09-21 Asm Ip Holding Bv 用於半導體製造設備的氣流控制板
KR102613349B1 (ko) * 2016-08-25 2023-12-14 에이에스엠 아이피 홀딩 비.브이. 배기 장치 및 이를 이용한 기판 가공 장치와 박막 제조 방법
JP6710134B2 (ja) * 2016-09-27 2020-06-17 東京エレクトロン株式会社 ガス導入機構及び処理装置
JP6550029B2 (ja) 2016-09-28 2019-07-24 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、ノズル基部および半導体装置の製造方法
JP6737139B2 (ja) * 2016-11-14 2020-08-05 東京エレクトロン株式会社 ガスインジェクタ、及び縦型熱処理装置
KR102546317B1 (ko) * 2016-11-15 2023-06-21 에이에스엠 아이피 홀딩 비.브이. 기체 공급 유닛 및 이를 포함하는 기판 처리 장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD964443S1 (en) 2020-08-18 2022-09-20 Kokusai Electric Corporation Gas inlet attachment for wafer processing apparatus

Also Published As

Publication number Publication date
USD901564S1 (en) 2020-11-10
TWD203444S (zh) 2020-03-21

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