JP1629563S - - Google Patents

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Publication number
JP1629563S
JP1629563S JPD2018-26018F JP2018026018F JP1629563S JP 1629563 S JP1629563 S JP 1629563S JP 2018026018 F JP2018026018 F JP 2018026018F JP 1629563 S JP1629563 S JP 1629563S
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JP
Japan
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JPD2018-26018F
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JPD2018-26018F 2018-06-04 2018-11-30 Active JP1629563S (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE402018100539 2018-06-04

Publications (1)

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JP1629563S true JP1629563S (ja) 2019-04-15

Family

ID=66097812

Family Applications (3)

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JPD2018-26018F Active JP1629563S (ja) 2018-06-04 2018-11-30
JPD2018-26020F Active JP1629565S (ja) 2018-06-04 2018-11-30
JPD2018-26019F Active JP1629564S (ja) 2018-06-04 2018-11-30

Family Applications After (2)

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JPD2018-26020F Active JP1629565S (ja) 2018-06-04 2018-11-30
JPD2018-26019F Active JP1629564S (ja) 2018-06-04 2018-11-30

Country Status (2)

Country Link
US (2) USD883241S1 (ja)
JP (3) JP1629563S (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD954667S1 (en) * 2017-01-13 2022-06-14 Wolfspeed, Inc. Power module
USD951185S1 (en) * 2017-12-20 2022-05-10 Arris Enterprises Llc Power module
USD883241S1 (en) * 2018-06-04 2020-05-05 Semikron Elektronik Gmbh & Co. Kg Power module
JP1640260S (ja) * 2018-11-19 2019-09-02
USD920937S1 (en) * 2019-03-29 2021-06-01 Shindengen Electric Manufacturing Co., Ltd. Power module device containing semiconductor elements
JP1659716S (ja) 2019-08-29 2020-05-18
JP1659672S (ja) * 2019-08-29 2020-05-18
JP1659677S (ja) 2019-08-29 2020-05-18
JP1659675S (ja) 2019-08-29 2020-05-18
JP1659676S (ja) 2019-08-29 2020-05-18
JP1659674S (ja) 2019-08-29 2020-05-18
JP1659673S (ja) 2019-08-29 2020-05-18
JP1659678S (ja) 2019-08-29 2020-05-18
USD934185S1 (en) * 2020-03-11 2021-10-26 Thales Dms France Sas Switch
USD952585S1 (en) * 2020-03-16 2022-05-24 Dynatron Corporation Vapor chamber

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8963321B2 (en) * 2011-09-12 2015-02-24 Infineon Technologies Ag Semiconductor device including cladded base plate
US9472488B2 (en) * 2012-04-16 2016-10-18 Fuji Electric Co., Ltd. Semiconductor device and cooler thereof
CN104919589B (zh) * 2012-10-15 2019-01-29 富士电机株式会社 半导体装置
US9295184B2 (en) * 2012-12-14 2016-03-22 GM Global Technology Operations LLC Scalable and modular approach for power electronic building block design in automotive applications
DE102014106857B4 (de) * 2014-05-15 2020-11-26 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
US10680518B2 (en) * 2015-03-16 2020-06-09 Cree, Inc. High speed, efficient SiC power module
USD814431S1 (en) * 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
JP1551316S (ja) * 2015-09-30 2016-06-13
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
JP1585831S (ja) * 2017-01-05 2017-09-11
USD864132S1 (en) * 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD853978S1 (en) * 2017-02-28 2019-07-16 Infineon Technologies Ag High-performance semiconductor module
DE102017109706B3 (de) * 2017-05-05 2018-03-08 Semikron Elektronik Gmbh & Co. Kg Leistungselektronische Anordnung mit Gleichspannungsverbindungselement
DE102017115883B4 (de) * 2017-07-14 2020-04-02 Semikron Elektronik Gmbh & Co. Kg Leistungselektronisches Submodul mit Gleich- und Wechselspannungsanschlusselementen und Anordnung hiermit
USD883241S1 (en) * 2018-06-04 2020-05-05 Semikron Elektronik Gmbh & Co. Kg Power module

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Publication number Publication date
JP1629564S (ja) 2019-04-15
JP1629565S (ja) 2019-04-15
USD883241S1 (en) 2020-05-05
USD892754S1 (en) 2020-08-11

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