USD883241S1 - Power module - Google Patents
Power module Download PDFInfo
- Publication number
- USD883241S1 USD883241S1 US29/671,493 US201829671493F USD883241S US D883241 S1 USD883241 S1 US D883241S1 US 201829671493 F US201829671493 F US 201829671493F US D883241 S USD883241 S US D883241S
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- US
- United States
- Prior art keywords
- power module
- view
- ornamental design
- module
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/728,407 USD892754S1 (en) | 2018-06-04 | 2020-03-18 | Power module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE402018100539 | 2018-06-04 | ||
DE402018100539 | 2018-06-04 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/728,407 Division USD892754S1 (en) | 2018-06-04 | 2020-03-18 | Power module |
Publications (1)
Publication Number | Publication Date |
---|---|
USD883241S1 true USD883241S1 (en) | 2020-05-05 |
Family
ID=66097812
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/671,493 Active USD883241S1 (en) | 2018-06-04 | 2018-11-28 | Power module |
US29/728,407 Active USD892754S1 (en) | 2018-06-04 | 2020-03-18 | Power module |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/728,407 Active USD892754S1 (en) | 2018-06-04 | 2020-03-18 | Power module |
Country Status (2)
Country | Link |
---|---|
US (2) | USD883241S1 (ja) |
JP (3) | JP1629563S (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD892754S1 (en) * | 2018-06-04 | 2020-08-11 | Semikron Elektronik Gmbh & Co. Kg | Power module |
USD920937S1 (en) * | 2019-03-29 | 2021-06-01 | Shindengen Electric Manufacturing Co., Ltd. | Power module device containing semiconductor elements |
USD951185S1 (en) * | 2017-12-20 | 2022-05-10 | Arris Enterprises Llc | Power module |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD954667S1 (en) * | 2017-01-13 | 2022-06-14 | Wolfspeed, Inc. | Power module |
JP1640260S (ja) * | 2018-11-19 | 2019-09-02 | ||
JP1659678S (ja) | 2019-08-29 | 2020-05-18 | ||
JP1659674S (ja) | 2019-08-29 | 2020-05-18 | ||
JP1659675S (ja) | 2019-08-29 | 2020-05-18 | ||
JP1659676S (ja) | 2019-08-29 | 2020-05-18 | ||
JP1659716S (ja) | 2019-08-29 | 2020-05-18 | ||
JP1659673S (ja) | 2019-08-29 | 2020-05-18 | ||
JP1659677S (ja) | 2019-08-29 | 2020-05-18 | ||
JP1659672S (ja) * | 2019-08-29 | 2020-05-18 | ||
USD934185S1 (en) * | 2020-03-11 | 2021-10-26 | Thales Dms France Sas | Switch |
USD952585S1 (en) * | 2020-03-16 | 2022-05-24 | Dynatron Corporation | Vapor chamber |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130134572A1 (en) * | 2011-09-12 | 2013-05-30 | Infineon Technologies Ag | Semiconductor device including cladded base plate |
US20140168900A1 (en) * | 2012-12-14 | 2014-06-19 | GM Global Technology Operations LLC | Scalable and modular approach for power electronic building block design in automotive applications |
US20140376184A1 (en) * | 2012-04-16 | 2014-12-25 | Fuji Electric Co. Ltd. | Semiconductor device and cooler thereof |
US20150223339A1 (en) * | 2012-10-15 | 2015-08-06 | Fuji Electric Co., Ltd. | Semiconductor device |
USD762185S1 (en) * | 2014-08-21 | 2016-07-26 | Infineon Technologies Ag | Power semiconductor module |
US20160276927A1 (en) * | 2015-03-16 | 2016-09-22 | Cree, Inc. | High speed, efficient sic power module |
USD798832S1 (en) * | 2015-09-30 | 2017-10-03 | Mitsubishi Electric Corporation | Power semiconductor device |
USD799439S1 (en) * | 2016-05-31 | 2017-10-10 | Rohm Co., Ltd. | Power converting semiconductor module |
USD814431S1 (en) * | 2015-05-15 | 2018-04-03 | Mitsubishi Electric Corporation | Power semiconductor device |
US10090774B1 (en) * | 2017-05-05 | 2018-10-02 | Semikron Elektronik Gmbh & Co. Kg | Power electronic arrangement with DC voltage connection element |
US10163761B2 (en) * | 2014-05-15 | 2018-12-25 | Semikron Elektronik Gmbh & Co., Kg | Power semiconductor arrangement |
US10270358B2 (en) * | 2017-07-14 | 2019-04-23 | Semikron Elektronik Gmbh & Co. Kg | Power electronics submodule having DC and AC voltage terminal elements, and assembly hereof |
USD853978S1 (en) * | 2017-02-28 | 2019-07-16 | Infineon Technologies Ag | High-performance semiconductor module |
USD858467S1 (en) * | 2017-01-05 | 2019-09-03 | Rohm Co., Ltd. | Power semiconductor module |
USD864132S1 (en) * | 2017-01-05 | 2019-10-22 | Rohm Co., Ltd. | Power semiconductor module |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD883241S1 (en) * | 2018-06-04 | 2020-05-05 | Semikron Elektronik Gmbh & Co. Kg | Power module |
-
2018
- 2018-11-28 US US29/671,493 patent/USD883241S1/en active Active
- 2018-11-30 JP JPD2018-26018F patent/JP1629563S/ja active Active
- 2018-11-30 JP JPD2018-26019F patent/JP1629564S/ja active Active
- 2018-11-30 JP JPD2018-26020F patent/JP1629565S/ja active Active
-
2020
- 2020-03-18 US US29/728,407 patent/USD892754S1/en active Active
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130134572A1 (en) * | 2011-09-12 | 2013-05-30 | Infineon Technologies Ag | Semiconductor device including cladded base plate |
US20140376184A1 (en) * | 2012-04-16 | 2014-12-25 | Fuji Electric Co. Ltd. | Semiconductor device and cooler thereof |
US20150223339A1 (en) * | 2012-10-15 | 2015-08-06 | Fuji Electric Co., Ltd. | Semiconductor device |
US20140168900A1 (en) * | 2012-12-14 | 2014-06-19 | GM Global Technology Operations LLC | Scalable and modular approach for power electronic building block design in automotive applications |
US10163761B2 (en) * | 2014-05-15 | 2018-12-25 | Semikron Elektronik Gmbh & Co., Kg | Power semiconductor arrangement |
USD762185S1 (en) * | 2014-08-21 | 2016-07-26 | Infineon Technologies Ag | Power semiconductor module |
US20160276927A1 (en) * | 2015-03-16 | 2016-09-22 | Cree, Inc. | High speed, efficient sic power module |
USD814431S1 (en) * | 2015-05-15 | 2018-04-03 | Mitsubishi Electric Corporation | Power semiconductor device |
USD798832S1 (en) * | 2015-09-30 | 2017-10-03 | Mitsubishi Electric Corporation | Power semiconductor device |
USD799439S1 (en) * | 2016-05-31 | 2017-10-10 | Rohm Co., Ltd. | Power converting semiconductor module |
USD858467S1 (en) * | 2017-01-05 | 2019-09-03 | Rohm Co., Ltd. | Power semiconductor module |
USD864132S1 (en) * | 2017-01-05 | 2019-10-22 | Rohm Co., Ltd. | Power semiconductor module |
USD853978S1 (en) * | 2017-02-28 | 2019-07-16 | Infineon Technologies Ag | High-performance semiconductor module |
US10090774B1 (en) * | 2017-05-05 | 2018-10-02 | Semikron Elektronik Gmbh & Co. Kg | Power electronic arrangement with DC voltage connection element |
US10270358B2 (en) * | 2017-07-14 | 2019-04-23 | Semikron Elektronik Gmbh & Co. Kg | Power electronics submodule having DC and AC voltage terminal elements, and assembly hereof |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD951185S1 (en) * | 2017-12-20 | 2022-05-10 | Arris Enterprises Llc | Power module |
USD892754S1 (en) * | 2018-06-04 | 2020-08-11 | Semikron Elektronik Gmbh & Co. Kg | Power module |
USD920937S1 (en) * | 2019-03-29 | 2021-06-01 | Shindengen Electric Manufacturing Co., Ltd. | Power module device containing semiconductor elements |
Also Published As
Publication number | Publication date |
---|---|
JP1629565S (ja) | 2019-04-15 |
USD892754S1 (en) | 2020-08-11 |
JP1629564S (ja) | 2019-04-15 |
JP1629563S (ja) | 2019-04-15 |
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