ITMI952531A0 - - Google Patents

Info

Publication number
ITMI952531A0
ITMI952531A0 ITMI952531A ITMI952531A ITMI952531A0 IT MI952531 A0 ITMI952531 A0 IT MI952531A0 IT MI952531 A ITMI952531 A IT MI952531A IT MI952531 A ITMI952531 A IT MI952531A IT MI952531 A0 ITMI952531 A0 IT MI952531A0
Authority
IT
Italy
Application number
ITMI952531A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of ITMI952531A0 publication Critical patent/ITMI952531A0/it
Publication of ITMI952531A3 publication Critical patent/ITMI952531A3/it
Publication of ITMI952531A1 publication Critical patent/ITMI952531A1/it
Application granted granted Critical
Publication of IT1282804B1 publication Critical patent/IT1282804B1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Combinations Of Printed Boards (AREA)
  • Control Of Electric Motors In General (AREA)
IT95MI002531A 1994-12-24 1995-12-01 Apparecchio elettrico, in particolare apparecchio di comando o di regolazione elettronico per una disposizione elettromeccanica IT1282804B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4446594A DE4446594A1 (de) 1994-12-24 1994-12-24 Elektrisches Gerät

Publications (4)

Publication Number Publication Date
ITMI952531A0 true ITMI952531A0 (it) 1995-12-01
ITMI952531A3 ITMI952531A3 (it) 1996-06-24
ITMI952531A1 ITMI952531A1 (it) 1997-06-01
IT1282804B1 IT1282804B1 (it) 1998-03-31

Family

ID=6537118

Family Applications (2)

Application Number Title Priority Date Filing Date
IT95MI002531A IT1282804B1 (it) 1994-12-24 1995-12-01 Apparecchio elettrico, in particolare apparecchio di comando o di regolazione elettronico per una disposizione elettromeccanica
IT95MI000829U ITMI950829U3 (it) 1994-12-24 1995-12-01 Apparecchio elettrico

Family Applications After (1)

Application Number Title Priority Date Filing Date
IT95MI000829U ITMI950829U3 (it) 1994-12-24 1995-12-01 Apparecchio elettrico

Country Status (5)

Country Link
JP (1) JPH08236893A (it)
KR (1) KR960028747A (it)
DE (1) DE4446594A1 (it)
GB (1) GB2296604A (it)
IT (2) IT1282804B1 (it)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2119276C1 (ru) * 1997-11-03 1998-09-20 Закрытое акционерное общество "Техно-ТМ" Трехмерный гибкий электронный модуль
DE29819349U1 (de) * 1998-10-30 1999-12-09 Siemens Ag Halbleiter-Schaltungsanordnung, insbesondere Hochstromumrichter mit niedriger Zwischenkreisspannung
KR100441568B1 (ko) * 2001-11-16 2004-07-23 한스타 디스플레이 코퍼레이션 열소산 구조물
JP4556174B2 (ja) * 2004-12-15 2010-10-06 日本電気株式会社 携帯端末機器及び放熱方法
TWI357802B (en) * 2008-08-07 2012-02-01 Arcadyan Technology Corp Fixing cooling unit and electronic device having f
EP2180774B1 (en) * 2008-10-21 2013-08-07 Moxa Inc. Heat-dissipating structure for expansion board architecture
JP5161192B2 (ja) * 2009-11-06 2013-03-13 三菱電機株式会社 パワー回路配線構造
JP5652453B2 (ja) 2012-09-28 2015-01-14 株式会社村田製作所 複合モジュールおよびこれを備えた電子機器
JP5765357B2 (ja) * 2013-03-22 2015-08-19 カシオ計算機株式会社 回路基板構造、及び電子機器
JP7072387B2 (ja) * 2018-01-11 2022-05-20 長野日本無線株式会社 基板連結装置及び基板連結方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1081526A (en) * 1965-05-17 1967-08-31 Standard Telephones Cables Ltd Housing assembly for circuit boards
GB1604368A (en) * 1978-05-31 1981-12-09 Ard Tech Ass Eng Printed circuit board support system
GB2137422B (en) * 1983-03-30 1986-10-29 Ferranti Plc Printed circuit board
GB2192758B (en) * 1986-07-18 1990-03-28 Anamartic Ltd A modular high-density packaging scheme for wsi components

Also Published As

Publication number Publication date
ITMI950829V0 (it) 1995-12-01
IT1282804B1 (it) 1998-03-31
ITMI952531A1 (it) 1997-06-01
KR960028747A (ko) 1996-07-22
JPH08236893A (ja) 1996-09-13
GB9526253D0 (en) 1996-02-21
GB2296604A (en) 1996-07-03
DE4446594A1 (de) 1996-06-27
ITMI950829U3 (it) 1997-06-02
ITMI952531A3 (it) 1996-06-24

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Legal Events

Date Code Title Description
0001 Granted