ITMI941689A0 - Apparecchio elettrico in particolare apparecchio di commutazione o di comando per autoveicoli - Google Patents

Apparecchio elettrico in particolare apparecchio di commutazione o di comando per autoveicoli

Info

Publication number
ITMI941689A0
ITMI941689A0 ITMI941689A ITMI941689A ITMI941689A0 IT MI941689 A0 ITMI941689 A0 IT MI941689A0 IT MI941689 A ITMI941689 A IT MI941689A IT MI941689 A ITMI941689 A IT MI941689A IT MI941689 A0 ITMI941689 A0 IT MI941689A0
Authority
IT
Italy
Prior art keywords
motor vehicles
equipment
particular switching
electrical equipment
control equipment
Prior art date
Application number
ITMI941689A
Other languages
English (en)
Inventor
Thomas Wiesa
Ralph Schimitzek
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI941689A0 publication Critical patent/ITMI941689A0/it
Publication of ITMI941689A1 publication Critical patent/ITMI941689A1/it
Application granted granted Critical
Publication of IT1274704B publication Critical patent/IT1274704B/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239—Electronic boxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
ITMI941689A 1993-08-06 1994-08-03 Apparecchio elettrico in particolare apparecchio di commutazione o di comando per autoveicoli IT1274704B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4326506A DE4326506A1 (de) 1993-08-06 1993-08-06 Elektrisches Gerät, insbesondere Schalt- oder Steuergerät für Kraftfahrzeuge

Publications (3)

Publication Number Publication Date
ITMI941689A0 true ITMI941689A0 (it) 1994-08-03
ITMI941689A1 ITMI941689A1 (it) 1996-02-03
IT1274704B IT1274704B (it) 1997-07-24

Family

ID=6494639

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI941689A IT1274704B (it) 1993-08-06 1994-08-03 Apparecchio elettrico in particolare apparecchio di commutazione o di comando per autoveicoli

Country Status (5)

Country Link
US (1) US5539618A (it)
JP (1) JPH0779053A (it)
DE (1) DE4326506A1 (it)
FR (1) FR2708826B1 (it)
IT (1) IT1274704B (it)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6252179B1 (en) * 1995-04-27 2001-06-26 International Business Machines Corporation Electronic package on metal carrier
DE19601649A1 (de) * 1996-01-18 1997-07-24 Telefunken Microelectron Anordnung zur Verbesserung der Wärmeableitung bei elektrischen und elektronischen Bauelementen
DE19654606C2 (de) * 1996-12-20 1998-10-22 Siemens Ag Beidseitig oder mehrschichtig kupferkaschierte Leiterplatte und Verfahren zu ihrer Herstellung
DE19654353A1 (de) * 1996-12-24 1998-06-25 Bosch Gmbh Robert Montageanordnung eines Halbleiterbauelements auf einer Leiterplatte
US5994679A (en) * 1997-12-19 1999-11-30 Lucent Technologies Inc. Thermal housing for optical circuits
DE19805492C2 (de) * 1998-02-11 1999-12-02 Siemens Ag Leiterplatte
FR2775553B1 (fr) * 1998-03-02 2000-05-19 Valeo Electronique Raccordement d'un point d'une carte electronique a circuit imprime sur un substrat metallique qui porte ladite carte
JPH11297906A (ja) * 1998-03-23 1999-10-29 Motorola Inc 電子アセンブリおよび製造方法
DE19949429C2 (de) * 1999-10-13 2003-10-09 Conti Temic Microelectronic Verfahren zur Bearbeitung einer durchkontaktierten Leiterplatte
FR2801763B1 (fr) * 1999-11-30 2002-02-15 Sagem Module electronique de puissance et procede de fabrication d'un tel module
FR2802714B1 (fr) * 1999-12-21 2002-03-08 Sagem Module electrique de puissance et procede pour sa fabrication
JP3804861B2 (ja) 2002-08-29 2006-08-02 株式会社デンソー 電気装置および配線基板
DE10250697A1 (de) * 2002-10-31 2004-05-13 Hella Kg Hueck & Co. Leiterplatte
DE102005019922A1 (de) * 2005-04-27 2006-11-02 Conti Temic Microelectronic Gmbh Multilayerleiterplatte mit integriertem Widerstand
DE102005021918B4 (de) * 2005-05-12 2015-04-02 Conti Temic Microelectronic Gmbh Verfahren zur Bestimmung der Temperatur eines Bauelementes
DE102007029422A1 (de) * 2007-06-26 2009-01-08 Behr-Hella Thermocontrol Gmbh Thermische Kontaktierung eines Leistungsbauelements auf einem Schaltungsträger durch Kaltgasspritzen
DE102007037297A1 (de) 2007-08-07 2009-02-19 Continental Automotive Gmbh Schaltungsträgeraufbau mit verbesserter Wärmeableitung
DE102007062167A1 (de) * 2007-12-21 2009-06-25 Robert Bosch Gmbh Leistungsschaltung
CN103025122A (zh) * 2011-09-23 2013-04-03 联想(北京)有限公司 一种电子设备
JP6287659B2 (ja) * 2014-07-22 2018-03-07 株式会社オートネットワーク技術研究所 回路構成体
JP6287815B2 (ja) * 2014-12-24 2018-03-07 株式会社オートネットワーク技術研究所 回路構成体の製造方法
FR3036917B1 (fr) * 2015-05-28 2018-11-02 IFP Energies Nouvelles Dispositif electronique comprenant une carte de circuit imprime avec un refroidissement ameliore.
DE102018200022A1 (de) * 2018-01-02 2019-07-04 Osram Gmbh Anordnung und scheinwerfer

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3115017A1 (de) * 1981-04-14 1982-11-04 Blaupunkt-Werke Gmbh, 3200 Hildesheim Elektronisches bauelement
GB2135521A (en) * 1983-02-16 1984-08-30 Ferranti Plc Printed circuit boards
US4628407A (en) * 1983-04-22 1986-12-09 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
DE4023319C1 (it) * 1990-07-21 1991-12-12 Robert Bosch Gmbh, 7000 Stuttgart, De
DE4107312A1 (de) * 1991-03-07 1992-09-10 Telefunken Electronic Gmbh Montageanordnung von halbleiterbauelementen auf einer leiterplatte
US5285352A (en) * 1992-07-15 1994-02-08 Motorola, Inc. Pad array semiconductor device with thermal conductor and process for making the same

Also Published As

Publication number Publication date
IT1274704B (it) 1997-07-24
ITMI941689A1 (it) 1996-02-03
US5539618A (en) 1996-07-23
DE4326506A1 (de) 1995-02-09
FR2708826B1 (fr) 1996-03-22
JPH0779053A (ja) 1995-03-20
FR2708826A1 (fr) 1995-02-10

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970828