ITMI931115A0 - Procedimanto e dispositivo per la lavorazione di materiali per mezzo di un raggio laser ad alta energia, nonche' applicazioni di tale dispositivo - Google Patents

Procedimanto e dispositivo per la lavorazione di materiali per mezzo di un raggio laser ad alta energia, nonche' applicazioni di tale dispositivo

Info

Publication number
ITMI931115A0
ITMI931115A0 IT93MI1115A ITMI931115A ITMI931115A0 IT MI931115 A0 ITMI931115 A0 IT MI931115A0 IT 93MI1115 A IT93MI1115 A IT 93MI1115A IT MI931115 A ITMI931115 A IT MI931115A IT MI931115 A0 ITMI931115 A0 IT MI931115A0
Authority
IT
Italy
Prior art keywords
procedure
applications
well
laser beam
high energy
Prior art date
Application number
IT93MI1115A
Other languages
English (en)
Inventor
Peter Hoffmann
Manfred Geiger
Stefan Schuberth
Claudius Kozlik
Original Assignee
Diehl Gmbh & Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diehl Gmbh & Co filed Critical Diehl Gmbh & Co
Publication of ITMI931115A0 publication Critical patent/ITMI931115A0/it
Publication of ITMI931115A1 publication Critical patent/ITMI931115A1/it
Application granted granted Critical
Publication of IT1264513B1 publication Critical patent/IT1264513B1/it

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046Automatically focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/53Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
IT93MI001115A 1992-06-01 1993-05-28 Procedimento e dispositivo per la lavorazione di materiali per mezzo di un raggio laser ad alta energia, nonche' applicazioni di tale IT1264513B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4217705A DE4217705C2 (de) 1992-06-01 1992-06-01 Einrichtung zur Materialbearbeitung

Publications (3)

Publication Number Publication Date
ITMI931115A0 true ITMI931115A0 (it) 1993-05-28
ITMI931115A1 ITMI931115A1 (it) 1994-11-28
IT1264513B1 IT1264513B1 (it) 1996-09-24

Family

ID=6459940

Family Applications (1)

Application Number Title Priority Date Filing Date
IT93MI001115A IT1264513B1 (it) 1992-06-01 1993-05-28 Procedimento e dispositivo per la lavorazione di materiali per mezzo di un raggio laser ad alta energia, nonche' applicazioni di tale

Country Status (3)

Country Link
CH (1) CH687132A5 (it)
DE (1) DE4217705C2 (it)
IT (1) IT1264513B1 (it)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4420347C2 (de) * 1994-06-01 1997-04-17 Laser Micro Praezision Lmp Verfahren zum Abgleich von elektronischen Bauelementen
DE9409869U1 (de) * 1994-06-17 1995-10-12 Diehl GmbH & Co, 90478 Nürnberg Deformierbarer Spiegel, insbesondere für eine Laserstrahl-Materialbearbeitungseinrichtung
DE4424492C2 (de) * 1994-07-12 1996-07-11 Diehl Gmbh & Co Anordnung zur Werkstückbearbeitung mittels eines auf einen Brennfleck fokussierbaren Lasers
DE19516376C2 (de) * 1995-05-04 1998-12-03 Blz Gmbh Verfahren und Vorrichtung zur Kontrolle und Regelung der Brennfleckposition bei der Lasermaterialbearbeitung
JP3514129B2 (ja) * 1998-07-22 2004-03-31 スズキ株式会社 レーザ加工装置
JP3456424B2 (ja) * 1998-09-30 2003-10-14 スズキ株式会社 レーザ溶接方法及びレーザ溶接装置
JP2001121278A (ja) * 1999-10-22 2001-05-08 Sumitomo Electric Ind Ltd レーザ切断方法
DE10329075A1 (de) * 2003-06-27 2005-01-20 Schuler Held Lasertechnik Gmbh & Co. Kg Multifokales Schweißverfahren und Schweißeinrichtung
JP4299185B2 (ja) * 2004-04-27 2009-07-22 株式会社ディスコ レーザー加工装置
JP4182034B2 (ja) * 2004-08-05 2008-11-19 ファナック株式会社 切断加工用レーザ装置
EP1695786B1 (de) * 2005-02-25 2010-03-10 Trumpf Werkzeugmaschinen GmbH + Co. KG Anordnung zur Laserbearbeitung, insbesondere zum Laserschweissen von 3D-Bauteilen, mit einem ersten optischen Element zur Aufteilung eines Laserstrahles und einem zweiten optischen Element zur Fokusierung der Teilstrahlen
JP5384354B2 (ja) 2006-10-30 2014-01-08 オルセン,フレミング・オベ・エルホルム レーザー加工方法及びシステム
EP1918062A1 (en) * 2006-10-30 2008-05-07 Danmarks Tekniske Universitet Method and system for laser processing
US8212177B2 (en) * 2007-08-15 2012-07-03 Caterpillar Inc. Variable focus laser machining system
DE102010011988A1 (de) * 2010-03-18 2011-09-22 Jenoptik Automatisierungstechnik Gmbh Vorrichtung zur Bearbeitung eines Werkstückes mittels ablenkbarem Laserstrahl
DE102010049453A1 (de) * 2010-10-23 2012-04-26 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Hochdynamisch translatorisch bewegbare Einrichtung zur Zusammenführung einer energetischen Strahlwirkung und eines Hilfsmediums an einem Wirkpunkt
JP5788749B2 (ja) * 2011-09-15 2015-10-07 株式会社ディスコ レーザー加工装置
CN102658431B (zh) * 2012-05-18 2014-09-03 中国科学院光电技术研究所 一种自动诊断并校正激光光束发散角及光束质量的装置
DE102013225490A1 (de) * 2013-12-10 2015-06-11 Siemens Aktiengesellschaft Oszillierendes Schweißverfahren
CN112122774A (zh) * 2020-08-12 2020-12-25 深圳市圭华智能科技有限公司 一种压电促动器实时焦点跟踪系统

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3916264A1 (de) * 1989-05-18 1990-11-22 Diehl Gmbh & Co Einrichtung zur strahlfuehrung bei der laser-werkstueckbearbeitung
DE4108419C2 (de) * 1991-03-15 1995-03-16 Diehl Gmbh & Co Einrichtung zur Beeinflussung der Divergenz eines Laserstrahles

Also Published As

Publication number Publication date
DE4217705A1 (de) 1993-12-02
CH687132A5 (de) 1996-09-30
IT1264513B1 (it) 1996-09-24
DE4217705C2 (de) 1995-04-20
ITMI931115A1 (it) 1994-11-28

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Legal Events

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0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970529