ITMI20041715A1 - Struttura di protiberanza di lega per saldatura rinforzata e procedimento per formare una protuberanza di lega per saldatura rinforzata - Google Patents

Struttura di protiberanza di lega per saldatura rinforzata e procedimento per formare una protuberanza di lega per saldatura rinforzata

Info

Publication number
ITMI20041715A1
ITMI20041715A1 IT001715A ITMI20041715A ITMI20041715A1 IT MI20041715 A1 ITMI20041715 A1 IT MI20041715A1 IT 001715 A IT001715 A IT 001715A IT MI20041715 A ITMI20041715 A IT MI20041715A IT MI20041715 A1 ITMI20041715 A1 IT MI20041715A1
Authority
IT
Italy
Prior art keywords
alloy
reinforced welding
proteberance
protuberance
procedure
Prior art date
Application number
IT001715A
Other languages
English (en)
Italian (it)
Inventor
Se-Young Jeong
Nam-Seog Kim
Soon-Bum Kim
In-Young Lee
Ju-Hyun Lyu
Se-Yong Oh
Sun-Young Park
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/825,199 external-priority patent/US7015590B2/en
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of ITMI20041715A1 publication Critical patent/ITMI20041715A1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
IT001715A 2003-09-23 2004-09-08 Struttura di protiberanza di lega per saldatura rinforzata e procedimento per formare una protuberanza di lega per saldatura rinforzata ITMI20041715A1 (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020030065946A KR100553562B1 (ko) 2003-09-23 2003-09-23 솔더 범프 구조 및 그 제조 방법
US10/825,199 US7015590B2 (en) 2003-01-10 2004-04-16 Reinforced solder bump structure and method for forming a reinforced solder bump

Publications (1)

Publication Number Publication Date
ITMI20041715A1 true ITMI20041715A1 (it) 2004-12-08

Family

ID=37386175

Family Applications (1)

Application Number Title Priority Date Filing Date
IT001715A ITMI20041715A1 (it) 2003-09-23 2004-09-08 Struttura di protiberanza di lega per saldatura rinforzata e procedimento per formare una protuberanza di lega per saldatura rinforzata

Country Status (2)

Country Link
KR (1) KR100553562B1 (ko)
IT (1) ITMI20041715A1 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100708936B1 (ko) 2005-10-17 2007-04-17 삼성전기주식회사 플립칩용 질화물계 반도체 발광소자
KR100752672B1 (ko) 2006-09-06 2007-08-29 삼성전자주식회사 신뢰성 있는 범프 접속 구조를 갖는 인쇄 회로 기판 및 그제조방법, 및 이를 이용한 반도체 패키지
KR100762354B1 (ko) * 2006-09-11 2007-10-12 주식회사 네패스 플립칩 반도체 패키지 및 그 제조방법
KR101328551B1 (ko) 2006-10-02 2013-11-13 삼성전자주식회사 반도체 장치
KR101664481B1 (ko) * 2009-09-08 2016-10-10 엘지이노텍 주식회사 솔더볼 내부 관통 범핑 구조를 갖는 웨이퍼 및 기판의 접합구조 및 이들의 제조 방법
US9230932B2 (en) 2012-02-09 2016-01-05 Taiwan Semiconductor Manufacturing Company, Ltd. Interconnect crack arrestor structure and methods
KR101354750B1 (ko) * 2012-04-20 2014-01-23 앰코 테크놀로지 코리아 주식회사 반도체 디바이스 및 그 제조 방법
US9515036B2 (en) * 2012-04-20 2016-12-06 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for solder connections
KR20160119942A (ko) 2015-04-06 2016-10-17 에스케이하이닉스 주식회사 소켓 플러그 접속 구조를 포함하는 반도체 패키지
KR20210113492A (ko) 2020-03-06 2021-09-16 에스케이하이닉스 주식회사 반도체 기판, 반도체 기판을 포함하는 반도체 패키지 및 반도체 기판의 테스트 방법

Also Published As

Publication number Publication date
KR20050029602A (ko) 2005-03-28
KR100553562B1 (ko) 2006-02-22

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