ITMI20041715A1 - STRENGTH OF ALLOY PROTEBERANCE FOR REINFORCED WELDING AND PROCEDURE FOR FORMING AN ALLOY PROTUBERANCE FOR REINFORCED WELDING - Google Patents

STRENGTH OF ALLOY PROTEBERANCE FOR REINFORCED WELDING AND PROCEDURE FOR FORMING AN ALLOY PROTUBERANCE FOR REINFORCED WELDING

Info

Publication number
ITMI20041715A1
ITMI20041715A1 IT001715A ITMI20041715A ITMI20041715A1 IT MI20041715 A1 ITMI20041715 A1 IT MI20041715A1 IT 001715 A IT001715 A IT 001715A IT MI20041715 A ITMI20041715 A IT MI20041715A IT MI20041715 A1 ITMI20041715 A1 IT MI20041715A1
Authority
IT
Italy
Prior art keywords
alloy
reinforced welding
proteberance
protuberance
procedure
Prior art date
Application number
IT001715A
Other languages
Italian (it)
Inventor
Se-Young Jeong
Nam-Seog Kim
Soon-Bum Kim
In-Young Lee
Ju-Hyun Lyu
Se-Yong Oh
Sun-Young Park
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/825,199 external-priority patent/US7015590B2/en
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of ITMI20041715A1 publication Critical patent/ITMI20041715A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
IT001715A 2003-09-23 2004-09-08 STRENGTH OF ALLOY PROTEBERANCE FOR REINFORCED WELDING AND PROCEDURE FOR FORMING AN ALLOY PROTUBERANCE FOR REINFORCED WELDING ITMI20041715A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020030065946A KR100553562B1 (en) 2003-09-23 2003-09-23 Solder bump structure and manufacturing method thereof
US10/825,199 US7015590B2 (en) 2003-01-10 2004-04-16 Reinforced solder bump structure and method for forming a reinforced solder bump

Publications (1)

Publication Number Publication Date
ITMI20041715A1 true ITMI20041715A1 (en) 2004-12-08

Family

ID=37386175

Family Applications (1)

Application Number Title Priority Date Filing Date
IT001715A ITMI20041715A1 (en) 2003-09-23 2004-09-08 STRENGTH OF ALLOY PROTEBERANCE FOR REINFORCED WELDING AND PROCEDURE FOR FORMING AN ALLOY PROTUBERANCE FOR REINFORCED WELDING

Country Status (2)

Country Link
KR (1) KR100553562B1 (en)
IT (1) ITMI20041715A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100708936B1 (en) 2005-10-17 2007-04-17 삼성전기주식회사 Nitride semiconductor light emitting device for flip-chip
KR100752672B1 (en) 2006-09-06 2007-08-29 삼성전자주식회사 Printed circuit board(pcb) having reliable bump interconnection structure and fabrication method, and semiconductor package using the same
KR100762354B1 (en) * 2006-09-11 2007-10-12 주식회사 네패스 Flip chip semiconductor package and fabrication method thereof
KR101328551B1 (en) 2006-10-02 2013-11-13 삼성전자주식회사 Semiconductor devices
KR101664481B1 (en) * 2009-09-08 2016-10-10 엘지이노텍 주식회사 Wafer and substrate having structure for penetrationn of solder ball and method for manufacturing same
US9230932B2 (en) 2012-02-09 2016-01-05 Taiwan Semiconductor Manufacturing Company, Ltd. Interconnect crack arrestor structure and methods
US9515036B2 (en) * 2012-04-20 2016-12-06 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for solder connections
KR101354750B1 (en) * 2012-04-20 2014-01-23 앰코 테크놀로지 코리아 주식회사 Semiconductor Device And Fabricating Method Thereof
KR20160119942A (en) 2015-04-06 2016-10-17 에스케이하이닉스 주식회사 Semiconductor package with socket plug interconnection
KR20210113492A (en) 2020-03-06 2021-09-16 에스케이하이닉스 주식회사 Semiconductor substrate, semiconductor package including the semi.conductor substrate and test method of the semiconductor substrate

Also Published As

Publication number Publication date
KR20050029602A (en) 2005-03-28
KR100553562B1 (en) 2006-02-22

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