ITMI20030069A1 - Dispositivi micromeccanici o microoptoelettronici con deposito di materiale getter e riscaldatore integrato. - Google Patents
Dispositivi micromeccanici o microoptoelettronici con deposito di materiale getter e riscaldatore integrato.Info
- Publication number
- ITMI20030069A1 ITMI20030069A1 IT000069A ITMI20030069A ITMI20030069A1 IT MI20030069 A1 ITMI20030069 A1 IT MI20030069A1 IT 000069 A IT000069 A IT 000069A IT MI20030069 A ITMI20030069 A IT MI20030069A IT MI20030069 A1 ITMI20030069 A1 IT MI20030069A1
- Authority
- IT
- Italy
- Prior art keywords
- micromechanical
- storage
- getter material
- integrated heater
- microoptoelectronic
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
- B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Micromachines (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT000069A ITMI20030069A1 (it) | 2003-01-17 | 2003-01-17 | Dispositivi micromeccanici o microoptoelettronici con deposito di materiale getter e riscaldatore integrato. |
PCT/IT2003/000857 WO2004065289A2 (en) | 2003-01-17 | 2003-12-24 | Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof |
CA002511836A CA2511836A1 (en) | 2003-01-17 | 2003-12-24 | Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof |
KR1020057013228A KR20050092426A (ko) | 2003-01-17 | 2003-12-24 | 게터 재료 증착물 및 집적 히터를 갖는 마이크로메카니칼 또는 마이크로옵토일렉트로닉 소자, 및 이들의 제조를 위한 지지부 |
AU2003295223A AU2003295223A1 (en) | 2003-01-17 | 2003-12-24 | Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof |
CNB200380108858XA CN100453442C (zh) | 2003-01-17 | 2003-12-24 | 微型机械或微型光电子器件及生产该器件的载体 |
JP2004567099A JP2006513046A (ja) | 2003-01-17 | 2003-12-24 | ゲッター物質のデポジットと組み込まれたヒーターを有するマイクロ機械デバイス又はマイクロオプトエレクトロニック・デバイス、及びその製造のためのサポート |
EP03786227A EP1592643A2 (en) | 2003-01-17 | 2003-12-24 | Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof |
TW093100361A TW200500291A (en) | 2003-01-17 | 2004-01-07 | Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof |
MYPI20040115A MY157923A (en) | 2003-01-17 | 2004-01-15 | Micromechanical or microoptoelectronic devices with deposit of getter material and integrated heater, and support for the production thereof |
NO20053804A NO20053804L (no) | 2003-01-17 | 2005-08-12 | Mikromekanisk eller mikrooptoelektronisk anordning med avsetning av gettermateriale og integrert oppvarmingsinnretning og stotteplate for produksjon av dette |
HK06107278.2A HK1087090A1 (en) | 2003-01-17 | 2006-06-28 | Micromechanical or microoptoelectronic devices and support for the production thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT000069A ITMI20030069A1 (it) | 2003-01-17 | 2003-01-17 | Dispositivi micromeccanici o microoptoelettronici con deposito di materiale getter e riscaldatore integrato. |
Publications (1)
Publication Number | Publication Date |
---|---|
ITMI20030069A1 true ITMI20030069A1 (it) | 2004-07-18 |
Family
ID=32750478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT000069A ITMI20030069A1 (it) | 2003-01-17 | 2003-01-17 | Dispositivi micromeccanici o microoptoelettronici con deposito di materiale getter e riscaldatore integrato. |
Country Status (12)
Country | Link |
---|---|
EP (1) | EP1592643A2 (no) |
JP (1) | JP2006513046A (no) |
KR (1) | KR20050092426A (no) |
CN (1) | CN100453442C (no) |
AU (1) | AU2003295223A1 (no) |
CA (1) | CA2511836A1 (no) |
HK (1) | HK1087090A1 (no) |
IT (1) | ITMI20030069A1 (no) |
MY (1) | MY157923A (no) |
NO (1) | NO20053804L (no) |
TW (1) | TW200500291A (no) |
WO (1) | WO2004065289A2 (no) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005001449B3 (de) * | 2005-01-12 | 2006-07-20 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Erzeugen eines vorgegebenen Innendrucks in einem Hohlraum eines Halbleiterbauelements |
ITMI20052343A1 (it) * | 2005-12-06 | 2007-06-07 | Getters Spa | Processo per la produzione di dispositivi micromeccanici contenenti un materiale getter e dispositivi cosi'prodotti |
FR2898597B1 (fr) | 2006-03-16 | 2008-09-19 | Commissariat Energie Atomique | Encapsulation dans une cavite hermetique d'un compose microelectronique, notamment d'un mems |
FR2903678B1 (fr) * | 2006-07-13 | 2008-10-24 | Commissariat Energie Atomique | Microcomposant encapsule equipe d'au moins un getter |
US7402905B2 (en) * | 2006-08-07 | 2008-07-22 | Honeywell International Inc. | Methods of fabrication of wafer-level vacuum packaged devices |
ITMI20070301A1 (it) | 2007-02-16 | 2008-08-17 | Getters Spa | Supporti comprendenti materiali getter e sorgenti di metalli alcalini o alcalino-terrosi per sistemi di termoregolazione basati su effetto tunnel |
FR2933389B1 (fr) * | 2008-07-01 | 2010-10-29 | Commissariat Energie Atomique | Structure a base d'un materiau getter suspendu |
JP2010251702A (ja) * | 2009-03-27 | 2010-11-04 | Kyocera Corp | 電子部品、パッケージおよび赤外線センサ |
FR2956521B1 (fr) * | 2010-02-16 | 2012-08-17 | Thales Sa | Dispositif comprenant des composants electriques, electroniques, electromecaniques ou electro-optiques, a sensibilite reduite a faible debit de dose |
US9491802B2 (en) | 2012-02-17 | 2016-11-08 | Honeywell International Inc. | On-chip alkali dispenser |
EP2736071B8 (en) | 2012-11-22 | 2017-04-19 | Tronic's Microsystems S.A. | Wafer level package with getter |
US9479138B2 (en) | 2013-05-24 | 2016-10-25 | Epcos Ag | Microelectromechanical systems device package and method for producing the microelectromechanical systems device package |
EP2813465B1 (en) | 2013-06-12 | 2020-01-15 | Tronic's Microsystems | MEMS device with getter layer |
FR3008965B1 (fr) * | 2013-07-26 | 2017-03-03 | Commissariat Energie Atomique | Structure d'encapsulation comprenant un capot renforce mecaniquement et a effet getter |
CN104743502A (zh) * | 2013-12-31 | 2015-07-01 | 北京有色金属研究总院 | 一种具有复合吸气剂层的mems组件及其制备方法 |
JP2017224704A (ja) | 2016-06-15 | 2017-12-21 | セイコーエプソン株式会社 | 真空パッケージ、電子デバイス、電子機器及び移動体 |
CN109173690B (zh) * | 2018-09-20 | 2020-10-09 | 内蒙古科技大学 | 一种用于金属材料热处理中的空气消耗剂 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5734226A (en) * | 1992-08-12 | 1998-03-31 | Micron Technology, Inc. | Wire-bonded getters useful in evacuated displays |
US5610438A (en) * | 1995-03-08 | 1997-03-11 | Texas Instruments Incorporated | Micro-mechanical device with non-evaporable getter |
US5837935A (en) * | 1996-02-26 | 1998-11-17 | Ford Motor Company | Hermetic seal for an electronic component having a secondary chamber |
SE9700612D0 (sv) * | 1997-02-20 | 1997-02-20 | Cecap Ab | Sensorelement med integrerat referenstryck |
US6992375B2 (en) * | 2000-11-30 | 2006-01-31 | Texas Instruments Incorporated | Anchor for device package |
-
2003
- 2003-01-17 IT IT000069A patent/ITMI20030069A1/it unknown
- 2003-12-24 CA CA002511836A patent/CA2511836A1/en not_active Abandoned
- 2003-12-24 JP JP2004567099A patent/JP2006513046A/ja active Pending
- 2003-12-24 WO PCT/IT2003/000857 patent/WO2004065289A2/en active Application Filing
- 2003-12-24 KR KR1020057013228A patent/KR20050092426A/ko not_active Application Discontinuation
- 2003-12-24 CN CNB200380108858XA patent/CN100453442C/zh not_active Expired - Fee Related
- 2003-12-24 AU AU2003295223A patent/AU2003295223A1/en not_active Abandoned
- 2003-12-24 EP EP03786227A patent/EP1592643A2/en not_active Withdrawn
-
2004
- 2004-01-07 TW TW093100361A patent/TW200500291A/zh unknown
- 2004-01-15 MY MYPI20040115A patent/MY157923A/en unknown
-
2005
- 2005-08-12 NO NO20053804A patent/NO20053804L/no unknown
-
2006
- 2006-06-28 HK HK06107278.2A patent/HK1087090A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CA2511836A1 (en) | 2004-08-05 |
WO2004065289A3 (en) | 2005-01-06 |
AU2003295223A1 (en) | 2004-08-13 |
JP2006513046A (ja) | 2006-04-20 |
EP1592643A2 (en) | 2005-11-09 |
KR20050092426A (ko) | 2005-09-21 |
NO20053804L (no) | 2005-08-12 |
WO2004065289A2 (en) | 2004-08-05 |
MY157923A (en) | 2016-08-15 |
HK1087090A1 (en) | 2006-10-06 |
CN100453442C (zh) | 2009-01-21 |
CN1738765A (zh) | 2006-02-22 |
TW200500291A (en) | 2005-01-01 |
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