ITMI20021579A1 - Sistema per l'applicazione di un dispositivo assorbitore di gas su una superficie e procedimenti per la produzione di tale sistema - Google Patents

Sistema per l'applicazione di un dispositivo assorbitore di gas su una superficie e procedimenti per la produzione di tale sistema

Info

Publication number
ITMI20021579A1
ITMI20021579A1 IT2002MI001579A ITMI20021579A ITMI20021579A1 IT MI20021579 A1 ITMI20021579 A1 IT MI20021579A1 IT 2002MI001579 A IT2002MI001579 A IT 2002MI001579A IT MI20021579 A ITMI20021579 A IT MI20021579A IT MI20021579 A1 ITMI20021579 A1 IT MI20021579A1
Authority
IT
Italy
Prior art keywords
procedures
production
application
absorbing device
gas absorbing
Prior art date
Application number
IT2002MI001579A
Other languages
English (en)
Inventor
Porta Anna Della
Original Assignee
Getters Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Getters Spa filed Critical Getters Spa
Priority to IT2002MI001579A priority Critical patent/ITMI20021579A1/it
Priority to EP03425450A priority patent/EP1383182A3/en
Publication of ITMI20021579A1 publication Critical patent/ITMI20021579A1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
IT2002MI001579A 2002-07-17 2002-07-17 Sistema per l'applicazione di un dispositivo assorbitore di gas su una superficie e procedimenti per la produzione di tale sistema ITMI20021579A1 (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT2002MI001579A ITMI20021579A1 (it) 2002-07-17 2002-07-17 Sistema per l'applicazione di un dispositivo assorbitore di gas su una superficie e procedimenti per la produzione di tale sistema
EP03425450A EP1383182A3 (en) 2002-07-17 2003-07-08 System for applying a gas sorbing device on a surface and processes for the production thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT2002MI001579A ITMI20021579A1 (it) 2002-07-17 2002-07-17 Sistema per l'applicazione di un dispositivo assorbitore di gas su una superficie e procedimenti per la produzione di tale sistema

Publications (1)

Publication Number Publication Date
ITMI20021579A1 true ITMI20021579A1 (it) 2004-01-19

Family

ID=29765343

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2002MI001579A ITMI20021579A1 (it) 2002-07-17 2002-07-17 Sistema per l'applicazione di un dispositivo assorbitore di gas su una superficie e procedimenti per la produzione di tale sistema

Country Status (2)

Country Link
EP (1) EP1383182A3 (it)
IT (1) ITMI20021579A1 (it)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007046018A1 (de) 2007-09-26 2009-04-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Organisches elektronisches Bauelement mit trockenmittelhaltigem Passivierungsmaterial
US20110025196A1 (en) * 2009-07-31 2011-02-03 General Electric Company Hermetic package with getter materials
DE102011084276B4 (de) * 2011-10-11 2019-10-10 Osram Oled Gmbh Verkapselung für ein organisches elektronisches bauelement, ein organisches elektronisches bauelement mit der verkapselung und ein verfahren zur herstellung eines organischen elektronischen bauelements mit der verkapselung
CN103367647A (zh) * 2012-03-29 2013-10-23 海洋王照明科技股份有限公司 一种有机电致发光器件及其制备方法
CN103378303A (zh) * 2012-04-23 2013-10-30 海洋王照明科技股份有限公司 一种有机电致发光器件及其封装方法
TW201436855A (zh) * 2012-12-21 2014-10-01 Tesa Se 從平面結構物移除滲透物的方法
DE102012224319A1 (de) * 2012-12-21 2014-06-26 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
DE102012224310A1 (de) * 2012-12-21 2014-06-26 Tesa Se Gettermaterial enthaltendes Klebeband
CN104064682A (zh) * 2013-03-21 2014-09-24 海洋王照明科技股份有限公司 有机电致发光器件及其制备方法
CN104064681A (zh) * 2013-03-21 2014-09-24 海洋王照明科技股份有限公司 有机电致发光器件
GB2559097B (en) * 2016-07-04 2020-11-11 Innovia Films Ltd Label
GB2559096B (en) * 2016-07-04 2020-11-11 Innovia Films Ltd Label
TWI795430B (zh) * 2017-08-25 2023-03-11 美商3M新設資產公司 容許無損傷移除的黏著劑物品
CN109742227B (zh) * 2019-01-03 2022-07-01 业成科技（成都）有限公司 封装膜、封装装置、封装方法及电子器件

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2926724B2 (ja) * 1988-11-09 1999-07-28 三菱瓦斯化学株式会社 酸素吸収体収納袋及びその切断方法
JP2644377B2 (ja) * 1991-01-07 1997-08-25 マルチフォーム デシカンツ，インク． 酸素−吸収性ラベル
JPH0672471A (ja) * 1992-08-24 1994-03-15 Toyo Alum Kk 脱酸素剤包装体
US6226890B1 (en) * 2000-04-07 2001-05-08 Eastman Kodak Company Desiccation of moisture-sensitive electronic devices
US6493960B2 (en) * 2000-12-05 2002-12-17 Cardiac Pacemakers, Inc. Parylene coated desiccant sheet with activation strip

Also Published As

Publication number Publication date
EP1383182A2 (en) 2004-01-21
EP1383182A3 (en) 2007-10-17

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