IT986605B - Dispositivo semiconduttore e pro cedimento per la sua fabbricazio ne - Google Patents

Dispositivo semiconduttore e pro cedimento per la sua fabbricazio ne

Info

Publication number
IT986605B
IT986605B IT6892373A IT6892373A IT986605B IT 986605 B IT986605 B IT 986605B IT 6892373 A IT6892373 A IT 6892373A IT 6892373 A IT6892373 A IT 6892373A IT 986605 B IT986605 B IT 986605B
Authority
IT
Italy
Prior art keywords
manufacture
semiconductive device
semiconductive
Prior art date
Application number
IT6892373A
Other languages
English (en)
Italian (it)
Original Assignee
Westinghouse Brake Semi Conduc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Brake Semi Conduc filed Critical Westinghouse Brake Semi Conduc
Application granted granted Critical
Publication of IT986605B publication Critical patent/IT986605B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01018—Argon [Ar]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13034—Silicon Controlled Rectifier [SCR]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thyristors (AREA)
IT6892373A 1972-06-28 1973-06-27 Dispositivo semiconduttore e pro cedimento per la sua fabbricazio ne IT986605B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3036472 1972-06-28

Publications (1)

Publication Number Publication Date
IT986605B true IT986605B (it) 1975-01-30

Family

ID=10306498

Family Applications (1)

Application Number Title Priority Date Filing Date
IT6892373A IT986605B (it) 1972-06-28 1973-06-27 Dispositivo semiconduttore e pro cedimento per la sua fabbricazio ne

Country Status (4)

Country Link
JP (1) JPS4944680A (el)
DE (1) DE2332574A1 (el)
FR (1) FR2191267B1 (el)
IT (1) IT986605B (el)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5263494U (el) * 1975-10-31 1977-05-11
JPS5773945A (en) * 1980-10-27 1982-05-08 Hitachi Ltd Semiconductor device
JPS60177674A (ja) * 1984-02-23 1985-09-11 Mitsubishi Electric Corp 圧接形半導体装置の插入電極板の固定方法
AT393009B (de) * 1989-11-07 1991-07-25 Poska Albertas Ionas Antanovic Selbsttaetiges ventil

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514562B2 (de) * 1965-09-07 1972-12-07 Semikron Gesellschaft fur Gleich richterbau und Elektronik mbH, 8500 Nurn berg Anordnung zur herstellung eines halbleiter-bauelementes
FR1530863A (fr) * 1966-07-07 1968-06-28 Asea Ab Empilage de semi-conducteurs se prêtant à la commande
DE1288690B (de) * 1966-08-03 1969-02-06 Itt Ind Gmbh Deutsche Verfahren zum Herstellen eines gut haftenden Kontaktes mit Aluminium an einem Siliziumhalbleiterkoerper
US3508324A (en) * 1967-02-13 1970-04-28 Philco Ford Corp Method of making contacts to semiconductor devices
US3611066A (en) * 1969-12-12 1971-10-05 Gen Electric Thyristor with integrated ballasted gate auxiliary thyristor portion
DE2064110A1 (de) * 1970-01-02 1971-07-08 Westinghouse Electric Corp Mittels einer Gate-Elektrode steuerbare Schalteinrichtung
DE2103146A1 (de) * 1970-01-26 1971-08-05 Westinghouse Electric Corp Mittels einer Gate Elektrode Steuer bares Schaltelement
US3654529A (en) * 1971-04-05 1972-04-04 Gen Electric Loose contact press pack

Also Published As

Publication number Publication date
DE2332574A1 (de) 1974-01-10
JPS4944680A (el) 1974-04-26
FR2191267B1 (el) 1977-02-18
FR2191267A1 (el) 1974-02-01

Similar Documents

Publication Publication Date Title
IT980547B (it) Transistore ripolare e procedimento per la sua fabbricazione
SE7708341L (sv) Analysforfarande och -apparat
SE398319B (sv) Anordning for deckframstellning
BG20352A3 (bg) Метод за получаване на пиридил-фенил оксиалкани
IT977791B (it) Convettore e procedimento per la sua fabbricazione
IT943189B (it) Dispositivo semiconduttore e proce dimento per la sua fabbricazione
IT1000635B (it) Dispositivo semiconduttore e proce dimento per la sua fabbricazione
IT1047152B (it) Dispositivo semiconduttore e procedimento per la sua fabbricazione
BG21861A3 (bg) Метод за получаване на 3-хидрокси-цефалоспорини
IT991685B (it) Procedimento per la fabbricazione di fiale e macchina per la sua attuazione
BG22817A3 (bg) Метод за получаване на 1-хидрокси-2-пиридони
IT939391B (it) Pasticca semiconduttrice nonche metodo e dispositivo per la sua produzione
IT958758B (it) Dispositivo semiconduttore e procedimento per la sua fabbrica zione
IT1009927B (it) Procedimento e dispositivo per la confettatura di pastiglie
IT997293B (it) Procedimento e dispositivo per produrre wafers
IT980717B (it) Dipeptide e procedimento per la sua produzione
IT982490B (it) Dispositivo e metodo per formare doppie pieghe
IT975251B (it) Confezione ermetica e procedimento per la sua fabbricazione
BG25985A3 (bg) Метод за получаване на 13 бета-етил-17 d-етинил-гон- -4-еп-3-он-17 бета-ол
IT986605B (it) Dispositivo semiconduttore e pro cedimento per la sua fabbricazio ne
IT965358B (it) Dispositivo vibratore
IT994621B (it) Pneumatico radiale e procedimento per la sua fabbricazion
SE395772B (sv) Anordning for bearbetning av metsignaler
AT346209B (de) Ueberwachungseinrichtung
SU426992A1 (el)