IT986605B - SEMICONDUCTIVE DEVICE AND PROCESS FOR ITS MANUFACTURE - Google Patents

SEMICONDUCTIVE DEVICE AND PROCESS FOR ITS MANUFACTURE

Info

Publication number
IT986605B
IT986605B IT6892373A IT6892373A IT986605B IT 986605 B IT986605 B IT 986605B IT 6892373 A IT6892373 A IT 6892373A IT 6892373 A IT6892373 A IT 6892373A IT 986605 B IT986605 B IT 986605B
Authority
IT
Italy
Prior art keywords
manufacture
semiconductive device
semiconductive
Prior art date
Application number
IT6892373A
Other languages
Italian (it)
Original Assignee
Westinghouse Brake Semi Conduc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Brake Semi Conduc filed Critical Westinghouse Brake Semi Conduc
Application granted granted Critical
Publication of IT986605B publication Critical patent/IT986605B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01018—Argon [Ar]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13034—Silicon Controlled Rectifier [SCR]
IT6892373A 1972-06-28 1973-06-27 SEMICONDUCTIVE DEVICE AND PROCESS FOR ITS MANUFACTURE IT986605B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3036472 1972-06-28

Publications (1)

Publication Number Publication Date
IT986605B true IT986605B (en) 1975-01-30

Family

ID=10306498

Family Applications (1)

Application Number Title Priority Date Filing Date
IT6892373A IT986605B (en) 1972-06-28 1973-06-27 SEMICONDUCTIVE DEVICE AND PROCESS FOR ITS MANUFACTURE

Country Status (4)

Country Link
JP (1) JPS4944680A (en)
DE (1) DE2332574A1 (en)
FR (1) FR2191267B1 (en)
IT (1) IT986605B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5263494U (en) * 1975-10-31 1977-05-11
JPS5773945A (en) * 1980-10-27 1982-05-08 Hitachi Ltd Semiconductor device
JPS60177674A (en) * 1984-02-23 1985-09-11 Mitsubishi Electric Corp Fixing method for inserted electrode plate of compression bonded semiconductor device
AT393009B (en) * 1989-11-07 1991-07-25 Poska Albertas Ionas Antanovic AUTOMATIC VALVE

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514562B2 (en) * 1965-09-07 1972-12-07 Semikron Gesellschaft fur Gleich richterbau und Elektronik mbH, 8500 Nurn berg ARRANGEMENT FOR THE PRODUCTION OF A SEMICONDUCTOR COMPONENT
FR1530863A (en) * 1966-07-07 1968-06-28 Asea Ab Semiconductor stacking suitable for ordering
DE1288690B (en) * 1966-08-03 1969-02-06 Itt Ind Gmbh Deutsche Method for producing a well-adhering contact with aluminum on a silicon semiconductor body
US3508324A (en) * 1967-02-13 1970-04-28 Philco Ford Corp Method of making contacts to semiconductor devices
US3611066A (en) * 1969-12-12 1971-10-05 Gen Electric Thyristor with integrated ballasted gate auxiliary thyristor portion
DE2064110A1 (en) * 1970-01-02 1971-07-08 Westinghouse Electric Corp Switching device controllable by means of a gate electrode
DE2103146A1 (en) * 1970-01-26 1971-08-05 Westinghouse Electric Corp Switching element controlled by means of a gate electrode
US3654529A (en) * 1971-04-05 1972-04-04 Gen Electric Loose contact press pack

Also Published As

Publication number Publication date
JPS4944680A (en) 1974-04-26
FR2191267A1 (en) 1974-02-01
FR2191267B1 (en) 1977-02-18
DE2332574A1 (en) 1974-01-10

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