IT970627B - Processo e composizione per il de posito elettrolitico di una lega di stagno e piombo - Google Patents

Processo e composizione per il de posito elettrolitico di una lega di stagno e piombo

Info

Publication number
IT970627B
IT970627B IT9792/72A IT979272A IT970627B IT 970627 B IT970627 B IT 970627B IT 9792/72 A IT9792/72 A IT 9792/72A IT 979272 A IT979272 A IT 979272A IT 970627 B IT970627 B IT 970627B
Authority
IT
Italy
Prior art keywords
posit
electrolytic
tin
composition
lead alloy
Prior art date
Application number
IT9792/72A
Other languages
English (en)
Italian (it)
Inventor
S Valayl
Original Assignee
Met Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Met Chemicals Inc filed Critical Met Chemicals Inc
Application granted granted Critical
Publication of IT970627B publication Critical patent/IT970627B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
IT9792/72A 1971-12-16 1972-12-15 Processo e composizione per il de posito elettrolitico di una lega di stagno e piombo IT970627B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20888571A 1971-12-16 1971-12-16

Publications (1)

Publication Number Publication Date
IT970627B true IT970627B (it) 1974-04-20

Family

ID=22776434

Family Applications (1)

Application Number Title Priority Date Filing Date
IT9792/72A IT970627B (it) 1971-12-16 1972-12-15 Processo e composizione per il de posito elettrolitico di una lega di stagno e piombo

Country Status (8)

Country Link
US (1) US3749649A (cs)
JP (1) JPS5629758B2 (cs)
CA (1) CA1115654A (cs)
DE (1) DE2256845A1 (cs)
FR (1) FR2163453B1 (cs)
GB (1) GB1408148A (cs)
IT (1) IT970627B (cs)
NL (1) NL7217115A (cs)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3850765A (en) * 1973-05-21 1974-11-26 Oxy Metal Finishing Corp Bright solder plating
SE390986B (sv) * 1973-10-18 1977-01-31 Modo Kemi Ab Forfarande for elektropletering aw beleggningar av tenn eller tenn- blylegerinh ur ett surt elektrolytbad
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
NZ190645A (en) * 1978-06-16 1980-11-14 M & T Chemicals Inc Aqueous acid tin plating bath containing 2,5-dimethoxy-benzaldehyde as brightening agent
US4263106A (en) * 1979-12-31 1981-04-21 Bell Telephone Laboratories, Incorporated Solder plating process
US4376018A (en) * 1979-12-31 1983-03-08 Bell Telephone Laboratories, Incorporated Electrodeposition of nickel
US4377448A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic gold plating
US4379738A (en) * 1979-12-31 1983-04-12 Bell Telephone Laboratories, Incorporated Electroplating zinc
US4377449A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic silver plating
US4347107A (en) * 1981-04-02 1982-08-31 Hooker Chemicals & Plastics Corp. Electroplating tin and tin alloys and baths therefor
SE8204505L (sv) * 1981-09-08 1983-03-09 Occidental Chem Co Elektropletering for avsettning av tenn-blylegeringar pa olika underlag
US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5066367B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5094726B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4701244A (en) * 1983-12-22 1987-10-20 Learonal, Inc. Bath and process for electroplating tin, lead and tin/alloys
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
US4688899A (en) * 1984-07-27 1987-08-25 Casio Computer Co., Ltd. Dual-frequency, dielectric anisotropy liquid crystal display
JPS61117297A (ja) * 1984-11-13 1986-06-04 Ebara Yuujiraito Kk スズ属金属めつき液
US4880507A (en) * 1987-12-10 1989-11-14 Learonal, Inc. Tin, lead or tin/lead alloy electrolytes for high speed electroplating
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
JP2752046B2 (ja) * 1989-12-05 1998-05-18 株式会社村田製作所 クエン酸系錫または錫合金系めっき浴
CA2047502C (en) * 1991-07-22 1995-05-09 Peter Tsuk Selectively plating electrically conductive pin
US6562221B2 (en) 2001-09-28 2003-05-13 David Crotty Process and composition for high speed plating of tin and tin alloys
EP1342817A3 (en) * 2002-03-05 2006-05-24 Shipley Co. L.L.C. Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions
RU2363769C2 (ru) * 2003-01-10 2009-08-10 Хенкель Коммандитгезелльшафт ауф Акциен Состав для нанесения покрытий
US7063735B2 (en) * 2003-01-10 2006-06-20 Henkel Kommanditgesellschaft Auf Aktien Coating composition
US20060172064A1 (en) * 2003-01-10 2006-08-03 Henkel Kommanditgesellschaft Auf Aktien Process of coating metals prior to cold forming
EP1696052B1 (en) 2005-02-28 2010-10-06 Rohm and Haas Electronic Materials, L.L.C. Improved fluxing methods
JP6099256B2 (ja) 2012-01-20 2017-03-22 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ スズおよびスズ合金のための改良されたフラックス方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1141284A (en) * 1965-02-13 1969-01-29 Philips Electronic Associated Improvements in acid tin electroplating solutions
FR1539596A (fr) * 1967-10-06 1968-09-13 Hyogo Prefectural Government Procédé de revêtement électrolytique par un alliage brillant étain-plomb et nouveaux produits ainsi obtenus
US3785939A (en) * 1970-10-22 1974-01-15 Conversion Chem Corp Tin/lead plating bath and method

Also Published As

Publication number Publication date
AU4828472A (en) 1974-05-02
JPS5629758B2 (cs) 1981-07-10
US3749649A (en) 1973-07-31
FR2163453A1 (cs) 1973-07-27
DE2256845A1 (de) 1973-06-20
NL7217115A (cs) 1973-06-19
FR2163453B1 (cs) 1977-01-14
CA1115654A (en) 1982-01-05
GB1408148A (en) 1975-10-01
JPS4866537A (cs) 1973-09-12

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