FR2163453A1 - - Google Patents

Info

Publication number
FR2163453A1
FR2163453A1 FR7242053A FR7242053A FR2163453A1 FR 2163453 A1 FR2163453 A1 FR 2163453A1 FR 7242053 A FR7242053 A FR 7242053A FR 7242053 A FR7242053 A FR 7242053A FR 2163453 A1 FR2163453 A1 FR 2163453A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7242053A
Other languages
French (fr)
Other versions
FR2163453B1 (cs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
M&T Chemicals Inc
Original Assignee
M&T Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M&T Chemicals Inc filed Critical M&T Chemicals Inc
Publication of FR2163453A1 publication Critical patent/FR2163453A1/fr
Application granted granted Critical
Publication of FR2163453B1 publication Critical patent/FR2163453B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
FR7242053A 1971-12-16 1972-11-27 Expired FR2163453B1 (cs)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20888571A 1971-12-16 1971-12-16

Publications (2)

Publication Number Publication Date
FR2163453A1 true FR2163453A1 (cs) 1973-07-27
FR2163453B1 FR2163453B1 (cs) 1977-01-14

Family

ID=22776434

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7242053A Expired FR2163453B1 (cs) 1971-12-16 1972-11-27

Country Status (8)

Country Link
US (1) US3749649A (cs)
JP (1) JPS5629758B2 (cs)
CA (1) CA1115654A (cs)
DE (1) DE2256845A1 (cs)
FR (1) FR2163453B1 (cs)
GB (1) GB1408148A (cs)
IT (1) IT970627B (cs)
NL (1) NL7217115A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2428686A1 (fr) * 1978-06-16 1980-01-11 M & T Chemicals Inc Nouveau bain de depot electrolytique d'etain brillant

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3850765A (en) * 1973-05-21 1974-11-26 Oxy Metal Finishing Corp Bright solder plating
SE390986B (sv) * 1973-10-18 1977-01-31 Modo Kemi Ab Forfarande for elektropletering aw beleggningar av tenn eller tenn- blylegerinh ur ett surt elektrolytbad
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
US4263106A (en) * 1979-12-31 1981-04-21 Bell Telephone Laboratories, Incorporated Solder plating process
US4376018A (en) * 1979-12-31 1983-03-08 Bell Telephone Laboratories, Incorporated Electrodeposition of nickel
US4377448A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic gold plating
US4379738A (en) * 1979-12-31 1983-04-12 Bell Telephone Laboratories, Incorporated Electroplating zinc
US4377449A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic silver plating
US4347107A (en) * 1981-04-02 1982-08-31 Hooker Chemicals & Plastics Corp. Electroplating tin and tin alloys and baths therefor
SE8204505L (sv) * 1981-09-08 1983-03-09 Occidental Chem Co Elektropletering for avsettning av tenn-blylegeringar pa olika underlag
US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5066367B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5094726B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4701244A (en) * 1983-12-22 1987-10-20 Learonal, Inc. Bath and process for electroplating tin, lead and tin/alloys
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
US4688899A (en) * 1984-07-27 1987-08-25 Casio Computer Co., Ltd. Dual-frequency, dielectric anisotropy liquid crystal display
JPS61117297A (ja) * 1984-11-13 1986-06-04 Ebara Yuujiraito Kk スズ属金属めつき液
US4880507A (en) * 1987-12-10 1989-11-14 Learonal, Inc. Tin, lead or tin/lead alloy electrolytes for high speed electroplating
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
JP2752046B2 (ja) * 1989-12-05 1998-05-18 株式会社村田製作所 クエン酸系錫または錫合金系めっき浴
CA2047502C (en) * 1991-07-22 1995-05-09 Peter Tsuk Selectively plating electrically conductive pin
US6562221B2 (en) 2001-09-28 2003-05-13 David Crotty Process and composition for high speed plating of tin and tin alloys
EP1342817A3 (en) * 2002-03-05 2006-05-24 Shipley Co. L.L.C. Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions
RU2363769C2 (ru) * 2003-01-10 2009-08-10 Хенкель Коммандитгезелльшафт ауф Акциен Состав для нанесения покрытий
US7063735B2 (en) * 2003-01-10 2006-06-20 Henkel Kommanditgesellschaft Auf Aktien Coating composition
US20060172064A1 (en) * 2003-01-10 2006-08-03 Henkel Kommanditgesellschaft Auf Aktien Process of coating metals prior to cold forming
EP1696052B1 (en) 2005-02-28 2010-10-06 Rohm and Haas Electronic Materials, L.L.C. Improved fluxing methods
JP6099256B2 (ja) 2012-01-20 2017-03-22 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ スズおよびスズ合金のための改良されたフラックス方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1468084A (fr) * 1965-02-13 1967-02-03 Philips Nv Bain acide pour l'étamage électrolytique
FR1539596A (fr) * 1967-10-06 1968-09-13 Hyogo Prefectural Government Procédé de revêtement électrolytique par un alliage brillant étain-plomb et nouveaux produits ainsi obtenus
FR2111779A1 (cs) * 1970-10-22 1972-06-09 Kenvert Int Corp

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1468084A (fr) * 1965-02-13 1967-02-03 Philips Nv Bain acide pour l'étamage électrolytique
FR1539596A (fr) * 1967-10-06 1968-09-13 Hyogo Prefectural Government Procédé de revêtement électrolytique par un alliage brillant étain-plomb et nouveaux produits ainsi obtenus
FR2111779A1 (cs) * 1970-10-22 1972-06-09 Kenvert Int Corp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2428686A1 (fr) * 1978-06-16 1980-01-11 M & T Chemicals Inc Nouveau bain de depot electrolytique d'etain brillant

Also Published As

Publication number Publication date
AU4828472A (en) 1974-05-02
JPS5629758B2 (cs) 1981-07-10
US3749649A (en) 1973-07-31
DE2256845A1 (de) 1973-06-20
NL7217115A (cs) 1973-06-19
FR2163453B1 (cs) 1977-01-14
CA1115654A (en) 1982-01-05
GB1408148A (en) 1975-10-01
IT970627B (it) 1974-04-20
JPS4866537A (cs) 1973-09-12

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Legal Events

Date Code Title Description
ST Notification of lapse