IT8248887A0 - Metodo ed apparecchiatura per la elettrodeposizione attivata con laser - Google Patents
Metodo ed apparecchiatura per la elettrodeposizione attivata con laserInfo
- Publication number
- IT8248887A0 IT8248887A0 IT8248887A IT4888782A IT8248887A0 IT 8248887 A0 IT8248887 A0 IT 8248887A0 IT 8248887 A IT8248887 A IT 8248887A IT 4888782 A IT4888782 A IT 4888782A IT 8248887 A0 IT8248887 A0 IT 8248887A0
- Authority
- IT
- Italy
- Prior art keywords
- electrodeposition
- laser
- activated
- equipment
- activated electrodeposition
- Prior art date
Links
- 238000004070 electrodeposition Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/024—Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11536981A JPS5819488A (ja) | 1981-07-24 | 1981-07-24 | メツキ装置 |
JP12774281A JPS5831092A (ja) | 1981-08-17 | 1981-08-17 | 電鋳装置 |
JP5649482A JPS58174598A (ja) | 1982-04-07 | 1982-04-07 | 複合メツキ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8248887A0 true IT8248887A0 (it) | 1982-07-26 |
IT1148391B IT1148391B (it) | 1986-12-03 |
Family
ID=27295938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT8248887A IT1148391B (it) | 1981-07-24 | 1982-07-26 | Metodo ed apparecchiatura per la elettrodeposizione attivata con laser |
Country Status (5)
Country | Link |
---|---|
US (1) | US4430165A (it) |
DE (1) | DE3227878A1 (it) |
FR (1) | FR2513273B1 (it) |
GB (1) | GB2106542B (it) |
IT (1) | IT1148391B (it) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4519876A (en) * | 1984-06-28 | 1985-05-28 | Thermo Electron Corporation | Electrolytic deposition of metals on laser-conditioned surfaces |
GB2188774B (en) * | 1986-04-02 | 1990-10-31 | Westinghouse Electric Corp | Method of forming a conductive pattern on a semiconductor surface |
JP2896726B2 (ja) * | 1992-03-30 | 1999-05-31 | セイコーインスツルメンツ株式会社 | 微細加工装置 |
US5595637A (en) * | 1995-11-17 | 1997-01-21 | Rockwell International Corporation | Photoelectrochemical fabrication of electronic circuits |
US8246808B2 (en) * | 2008-08-08 | 2012-08-21 | GM Global Technology Operations LLC | Selective electrochemical deposition of conductive coatings on fuel cell bipolar plates |
CN101864587B (zh) * | 2009-04-20 | 2013-08-21 | 鸿富锦精密工业(深圳)有限公司 | 纳米级金属粒子/金属复合镀层的形成装置及形成方法 |
US8764515B2 (en) * | 2012-05-14 | 2014-07-01 | United Technologies Corporation | Component machining method and assembly |
US10242789B2 (en) * | 2015-06-16 | 2019-03-26 | Murata Manufacturing Co., Ltd. | Method for manufacturing ceramic electronic component, and ceramic electronic component |
CN109735883B (zh) | 2019-02-20 | 2021-02-12 | 江苏大学 | 一种激光辅助柔性随动式工具电极微细电沉积的装置及方法 |
CN112899740B (zh) * | 2019-11-15 | 2022-04-19 | 源秩科技(上海)有限公司 | 基于电化学的加工装置和方法 |
CN112176383B (zh) * | 2020-08-18 | 2022-01-11 | 江苏大学 | 一种利用激光电沉积复合加工的装置及方法 |
CN112126955B (zh) * | 2020-08-18 | 2021-08-03 | 江苏大学 | 一种膛线式空心旋转电极的激光电化学复合沉积的方法及装置 |
CN113897654B (zh) * | 2021-11-11 | 2023-03-28 | 浙江工业大学 | 一种同轴式激光辅助微弧氧化装置及方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB847927A (en) * | 1955-10-11 | 1960-09-14 | Philco Corp | A method and apparatus for the electrolytic treatment of semiconductive bodies |
US4217183A (en) * | 1979-05-08 | 1980-08-12 | International Business Machines Corporation | Method for locally enhancing electroplating rates |
-
1982
- 1982-07-23 US US06/401,247 patent/US4430165A/en not_active Expired - Lifetime
- 1982-07-23 GB GB08221336A patent/GB2106542B/en not_active Expired
- 1982-07-23 FR FR828212947A patent/FR2513273B1/fr not_active Expired - Fee Related
- 1982-07-26 IT IT8248887A patent/IT1148391B/it active
- 1982-07-26 DE DE19823227878 patent/DE3227878A1/de active Granted
Also Published As
Publication number | Publication date |
---|---|
US4430165A (en) | 1984-02-07 |
FR2513273B1 (fr) | 1990-02-09 |
IT1148391B (it) | 1986-12-03 |
DE3227878C2 (it) | 1990-03-01 |
GB2106542A (en) | 1983-04-13 |
FR2513273A1 (fr) | 1983-03-25 |
DE3227878A1 (de) | 1983-02-10 |
GB2106542B (en) | 1985-10-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19950728 |