IT8224237A0 - Tavolo di incisione a radiofrequenza con organo di estensione polarizzato. - Google Patents
Tavolo di incisione a radiofrequenza con organo di estensione polarizzato.Info
- Publication number
- IT8224237A0 IT8224237A0 IT8224237A IT2423782A IT8224237A0 IT 8224237 A0 IT8224237 A0 IT 8224237A0 IT 8224237 A IT8224237 A IT 8224237A IT 2423782 A IT2423782 A IT 2423782A IT 8224237 A0 IT8224237 A0 IT 8224237A0
- Authority
- IT
- Italy
- Prior art keywords
- radio frequency
- engraving table
- polarized
- organ
- extension organ
- Prior art date
Links
- 210000000056 organ Anatomy 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/320,385 US4392938A (en) | 1981-11-12 | 1981-11-12 | Radio frequency etch table with biased extension member |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8224237A0 true IT8224237A0 (it) | 1982-11-12 |
IT1153022B IT1153022B (it) | 1987-01-14 |
Family
ID=23246176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT24237/82A IT1153022B (it) | 1981-11-12 | 1982-11-12 | Tavolo di incisione a radio requenza con organo di estensione polarizzato |
Country Status (6)
Country | Link |
---|---|
US (1) | US4392938A (it) |
JP (1) | JPS5889826A (it) |
DE (1) | DE3241391A1 (it) |
FR (1) | FR2516308B1 (it) |
GB (1) | GB2109282B (it) |
IT (1) | IT1153022B (it) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4473455A (en) * | 1981-12-21 | 1984-09-25 | At&T Bell Laboratories | Wafer holding apparatus and method |
JPS60213026A (ja) * | 1984-04-09 | 1985-10-25 | Kokusai Electric Co Ltd | ドライエツチング装置 |
DE3835153A1 (de) * | 1988-10-15 | 1990-04-26 | Leybold Ag | Vorrichtung zum aetzen von substraten durch eine glimmentladung |
DE3900768C1 (en) * | 1989-01-12 | 1990-02-22 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De | Plasma etching device and method for operating it |
US5102496A (en) * | 1989-09-26 | 1992-04-07 | Applied Materials, Inc. | Particulate contamination prevention using low power plasma |
US5498313A (en) * | 1993-08-20 | 1996-03-12 | International Business Machines Corp. | Symmetrical etching ring with gas control |
JP2659919B2 (ja) * | 1994-01-13 | 1997-09-30 | インターナショナル・ビジネス・マシーンズ・コーポレイション | プラズマの不均一性を補正するプラズマ装置 |
CN105977126B (zh) * | 2011-05-31 | 2018-12-07 | 应用材料公司 | 用于等离子体蚀刻腔室的孔部件 |
US11049701B2 (en) | 2016-11-26 | 2021-06-29 | Applied Materials, Inc. | Biased cover ring for a substrate processing system |
US10879052B2 (en) * | 2018-11-21 | 2020-12-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Plasma processing apparatus and manufacturing method using the same |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB736512A (en) * | 1952-08-25 | 1955-09-07 | Edwards & Co London Ltd W | Improvements in or relating to cathode sputtering apparatus |
FR2082505A5 (it) * | 1970-03-18 | 1971-12-10 | Radiotechnique Compelec | |
JPS53123669A (en) * | 1977-04-05 | 1978-10-28 | Fujitsu Ltd | Wafer holding method |
US4261762A (en) * | 1979-09-14 | 1981-04-14 | Eaton Corporation | Method for conducting heat to or from an article being treated under vacuum |
US4297162A (en) * | 1979-10-17 | 1981-10-27 | Texas Instruments Incorporated | Plasma etching using improved electrode |
JPS5687671A (en) * | 1979-12-15 | 1981-07-16 | Anelva Corp | Dry etching apparatus |
JPS5687672A (en) * | 1979-12-15 | 1981-07-16 | Anelva Corp | Dry etching apparatus |
JPS5694745A (en) * | 1979-12-28 | 1981-07-31 | Sony Corp | Plasma treatment device |
JPS5796530A (en) * | 1980-12-09 | 1982-06-15 | Nec Corp | Lasma etching device |
JPS57149734A (en) * | 1981-03-12 | 1982-09-16 | Anelva Corp | Plasma applying working device |
-
1981
- 1981-11-12 US US06/320,385 patent/US4392938A/en not_active Expired - Lifetime
-
1982
- 1982-10-28 GB GB08230873A patent/GB2109282B/en not_active Expired
- 1982-11-09 DE DE19823241391 patent/DE3241391A1/de not_active Withdrawn
- 1982-11-12 IT IT24237/82A patent/IT1153022B/it active
- 1982-11-12 JP JP57197863A patent/JPS5889826A/ja active Pending
- 1982-11-12 FR FR8218996A patent/FR2516308B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2516308B1 (fr) | 1988-12-23 |
DE3241391A1 (de) | 1983-05-19 |
GB2109282A (en) | 1983-06-02 |
US4392938A (en) | 1983-07-12 |
IT1153022B (it) | 1987-01-14 |
FR2516308A1 (fr) | 1983-05-13 |
JPS5889826A (ja) | 1983-05-28 |
GB2109282B (en) | 1985-09-04 |
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