IT8219222A0 - Laminazione di trasferimento di sottili fogli e pellicole di rame, relativo metodo e prodotto. - Google Patents

Laminazione di trasferimento di sottili fogli e pellicole di rame, relativo metodo e prodotto.

Info

Publication number
IT8219222A0
IT8219222A0 IT8219222A IT1922282A IT8219222A0 IT 8219222 A0 IT8219222 A0 IT 8219222A0 IT 8219222 A IT8219222 A IT 8219222A IT 1922282 A IT1922282 A IT 1922282A IT 8219222 A0 IT8219222 A0 IT 8219222A0
Authority
IT
Italy
Prior art keywords
film
product
thin copper
related method
copper sheets
Prior art date
Application number
IT8219222A
Other languages
English (en)
Other versions
IT1150131B (it
Inventor
Eric Lifshin
Margo Elaine Gill
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of IT8219222A0 publication Critical patent/IT8219222A0/it
Application granted granted Critical
Publication of IT1150131B publication Critical patent/IT1150131B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
IT19222/82A 1981-01-22 1982-01-21 Laminazione di trasferimento di sottili fogli e pellicole di rame,relativo metodo e prodotto IT1150131B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US22729081A 1981-01-22 1981-01-22

Publications (2)

Publication Number Publication Date
IT8219222A0 true IT8219222A0 (it) 1982-01-21
IT1150131B IT1150131B (it) 1986-12-10

Family

ID=22852538

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19222/82A IT1150131B (it) 1981-01-22 1982-01-21 Laminazione di trasferimento di sottili fogli e pellicole di rame,relativo metodo e prodotto

Country Status (5)

Country Link
JP (1) JPS57142355A (it)
DE (1) DE3200593A1 (it)
FR (1) FR2498125B1 (it)
GB (1) GB2091634B (it)
IT (1) IT1150131B (it)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4499152A (en) * 1982-08-09 1985-02-12 General Electric Company Metal-clad laminate construction
US4427716A (en) * 1983-01-21 1984-01-24 General Electric Company Method for predetermining peel strength at copper/aluminum interface
US4452664A (en) * 1983-08-01 1984-06-05 General Electric Company Method for predetermining peel strength at copper/aluminum interface
FR2554046B1 (fr) * 1983-10-28 1986-05-09 Gen Electric Stratifie recouvert de metal et procede de fabrication
GB2148182B (en) * 1983-11-03 1987-02-11 Gen Electric Metal-clad laminate construction
GB8333753D0 (en) * 1983-12-19 1984-01-25 Thorpe J E Dielectric boards
JPS6287831U (it) * 1985-11-22 1987-06-04
JPH0333469Y2 (it) * 1985-11-22 1991-07-16
EP0395871A3 (en) * 1989-05-05 1991-09-18 Gould Electronics Inc. Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing
DE4009182A1 (de) * 1990-03-22 1991-09-26 Bayer Ag Laminierte flaechengebilde
JP4754402B2 (ja) * 2006-05-17 2011-08-24 三井金属鉱業株式会社 キャリア箔付銅箔、キャリア箔付銅箔の製造方法、キャリア箔付表面処理銅箔及びそのキャリア箔付表面処理銅箔を用いた銅張積層板
US7913381B2 (en) * 2006-10-26 2011-03-29 Carestream Health, Inc. Metal substrate having electronic devices formed thereon
CN107889354A (zh) * 2016-09-29 2018-04-06 Ｊｘ金属株式会社 附载体的金属箔、积层体、印刷配线板的制造方法及电子机器的制造方法
JP7186141B2 (ja) * 2019-07-10 2022-12-08 Ｊｘ金属株式会社 フレキシブルプリント基板用銅箔

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL108173C (it) * 1954-06-25
US4100317A (en) * 1970-10-23 1978-07-11 Oike & Co., Ltd. Metal leaf
BE788117A (fr) * 1971-08-30 1973-02-28 Perstorp Ab Procede de production d'elements pour circuits imprimes
JPS4999779A (it) * 1973-01-09 1974-09-20
JPS49114772A (it) * 1973-03-10 1974-11-01
JPS5729878B2 (it) * 1973-03-10 1982-06-25
DE2413932C2 (de) * 1973-04-25 1984-08-30 Yates Industries, Inc., Bordentown, N.J. Verfahren zum Herstellen einer Verbundfolie für die Ausbildung gedruckter Schaltkreise
JPS5016624A (it) * 1973-06-08 1975-02-21
JPS514286A (ja) * 1974-07-01 1976-01-14 Nippon Denkai Kk Kinzokusuhakubarigoseijushibanno seizohoho
US4091138A (en) * 1975-02-12 1978-05-23 Sumitomo Bakelite Company Limited Insulating film, sheet, or plate material with metallic coating and method for manufacturing same
US3969199A (en) * 1975-07-07 1976-07-13 Gould Inc. Coating aluminum with a strippable copper deposit
CH613152A5 (en) * 1976-08-13 1979-09-14 Uop Inc Process for producing a metallised laminate
JPS53115069A (en) * 1977-03-18 1978-10-07 Nippon Mining Co Method of producing printed circuit board

Also Published As

Publication number Publication date
FR2498125B1 (fr) 1989-03-31
IT1150131B (it) 1986-12-10
GB2091634B (en) 1984-12-05
JPS57142355A (en) 1982-09-03
FR2498125A1 (fr) 1982-07-23
DE3200593A1 (de) 1982-09-02
GB2091634A (en) 1982-08-04

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