IT8149950A0 - Sottogruppo elettro-ottico indicato re/telaio conduttore e relativo modulo cronometrico - Google Patents
Sottogruppo elettro-ottico indicato re/telaio conduttore e relativo modulo cronometricoInfo
- Publication number
- IT8149950A0 IT8149950A0 IT8149950A IT4995081A IT8149950A0 IT 8149950 A0 IT8149950 A0 IT 8149950A0 IT 8149950 A IT8149950 A IT 8149950A IT 4995081 A IT4995081 A IT 4995081A IT 8149950 A0 IT8149950 A0 IT 8149950A0
- Authority
- IT
- Italy
- Prior art keywords
- electro
- optical sub
- conductor frame
- assembly indicated
- chronometer
- Prior art date
Links
- 239000004020 conductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/642—Capacitive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Clocks (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Electromechanical Clocks (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/218,136 US4391531A (en) | 1980-12-19 | 1980-12-19 | Electrooptical display/lead frame subassembly and timepiece module including same |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8149950A0 true IT8149950A0 (it) | 1981-12-18 |
IT1218263B IT1218263B (it) | 1990-04-12 |
Family
ID=22813889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT49950/81A IT1218263B (it) | 1980-12-19 | 1981-12-18 | Sottogruppo elettro-ottico indicatore/telaio conduttore e relativo modulo cronometrico |
Country Status (9)
Country | Link |
---|---|
US (1) | US4391531A (it) |
JP (1) | JPS57124782A (it) |
CA (1) | CA1170343A (it) |
CH (1) | CH647640GA3 (it) |
DE (1) | DE3150196A1 (it) |
FR (1) | FR2498791B1 (it) |
GB (1) | GB2090055B (it) |
HK (1) | HK43385A (it) |
IT (1) | IT1218263B (it) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6068639A (ja) * | 1983-08-31 | 1985-04-19 | Toshiba Corp | 樹脂封止型半導体装置 |
US4598337A (en) * | 1984-09-17 | 1986-07-01 | Timex Corporation | Electronic circuit board for a timepiece |
GB2203270B (en) * | 1987-03-05 | 1991-09-11 | Seiko Epson Corp | Timepiece assembly. |
US5416752A (en) * | 1987-07-21 | 1995-05-16 | Seiko Epson Corporation | Timepiece |
US5444600A (en) * | 1992-12-03 | 1995-08-22 | Linear Technology Corporation | Lead frame capacitor and capacitively-coupled isolator circuit using the same |
EP0710432B1 (de) * | 1994-05-18 | 2004-01-02 | Dyconex AG | Verfahren zur herstellung von folienleiterplatten oder halbzeugen für folienleiterplatten sowie nach dem verfahren hergestellte folienleiterplatten und halbzeuge |
TW382079B (en) * | 1998-08-28 | 2000-02-11 | Via Tech Inc | Integrated real time clock integrated circuit device and manufacturing method thereof |
TW576957B (en) * | 2000-11-29 | 2004-02-21 | Ebauchesfabrik Eta Ag | Timepiece comprising means for allowing electric access to electric or electronic components of this timepiece |
DE10105471B4 (de) * | 2001-02-05 | 2007-07-12 | Robert Bosch Gmbh | Anzeigevorrichtung |
JP2003215278A (ja) * | 2002-01-24 | 2003-07-30 | Seiko Instruments Inc | 電子時計 |
EP1544917A1 (en) * | 2003-12-15 | 2005-06-22 | Dialog Semiconductor GmbH | Integrated battery pack with lead frame connection |
US8766435B2 (en) | 2004-06-30 | 2014-07-01 | Stmicroelectronics, Inc. | Integrated circuit package including embedded thin-film battery |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1684973A (en) * | 1925-09-12 | 1928-09-18 | Naylor Radio Corp | Contact-protecting means for vacuum tubes |
US1994849A (en) * | 1930-01-04 | 1935-03-19 | Bauza Jacques | Product for the protection of contacts in electric circuits |
US1925856A (en) * | 1930-08-08 | 1933-09-05 | Westinghouse Electric & Mfg Co | Contact terminal |
GB820900A (en) * | 1956-11-20 | 1959-09-30 | Texas Instruments Inc | Method of fixing electric leads to a silicon element and article resulting therefrom |
JPS5549273B2 (it) * | 1972-07-19 | 1980-12-11 | ||
JPS5616393B2 (it) * | 1972-08-03 | 1981-04-16 | ||
JPS56756B2 (it) * | 1972-10-07 | 1981-01-09 | ||
GB1468243A (en) * | 1973-07-20 | 1977-03-23 | Citizen Watch Co Ltd | Electronic optical display timepiece |
US4064689A (en) * | 1973-07-20 | 1977-12-27 | Citizen Watch Co., Ltd. | Electronic timepiece with electro-optical display |
GB1479779A (en) * | 1973-09-25 | 1977-07-13 | Citizen Watch Co Ltd | Liquid crystal display wrist watch |
US4065851A (en) * | 1974-04-20 | 1978-01-03 | W. C. Heraeus Gmbh | Method of making metallic support carrier for semiconductor elements |
US4075825A (en) * | 1974-06-28 | 1978-02-28 | Citizen Watch Co., Ltd. | Electronic timepiece substratum |
US4012117A (en) * | 1974-07-29 | 1977-03-15 | Rca Corporation | Liquid crystal module |
US3975899A (en) * | 1975-05-05 | 1976-08-24 | Haber Terry M | Multi-function watch casing |
US3984166A (en) * | 1975-05-07 | 1976-10-05 | Burroughs Corporation | Semiconductor device package having lead frame structure with integral spring contacts |
US3986334A (en) * | 1975-05-29 | 1976-10-19 | Texas Instruments Incorporated | Electronic watch and its method of fabrication |
US3986335A (en) * | 1975-05-29 | 1976-10-19 | Texas Instruments Incorporated | Electronic watch module and its method of fabrication |
US3992870A (en) * | 1975-08-14 | 1976-11-23 | Joseph Dekel | Watertight nonconductive electronic watchcase including conductive internal plate |
JPS5242765A (en) * | 1975-09-30 | 1977-04-02 | Seiko Instr & Electronics Ltd | Electronic watch |
US4144705A (en) * | 1975-10-15 | 1979-03-20 | Citizen Watch Co. Ltd. | Timepiece circuit device |
US4120147A (en) * | 1976-01-08 | 1978-10-17 | Citizen Watch Company Limited | Watch module assembly |
JPS5292368A (en) * | 1976-01-29 | 1977-08-03 | Seiko Instr & Electronics | Electronic wrist watch substrate mounting structure |
AT345326B (de) * | 1976-02-04 | 1978-09-11 | Plasser Bahnbaumasch Franz | Einrichtung zum loesen von stopfwerkzeugen aus deren halterung bei gleisstopfmaschinen |
US4183629A (en) * | 1976-07-21 | 1980-01-15 | Citizen Watch Co. Ltd. | Electronic optical display device and method of manufacturing the same |
US4079511A (en) * | 1976-07-30 | 1978-03-21 | Amp Incorporated | Method for packaging hermetically sealed integrated circuit chips on lead frames |
NL7610306A (nl) * | 1976-09-16 | 1978-03-20 | Du Pont | Contactinrichting voor een geintegreerde schakeling. |
US4142287A (en) * | 1976-12-27 | 1979-03-06 | Amp Incorporated | Electrical devices such as watches and method of construction thereof |
US4165607A (en) * | 1977-01-28 | 1979-08-28 | Motorola, Inc. | Watch module |
US4104086A (en) * | 1977-08-15 | 1978-08-01 | International Business Machines Corporation | Method for forming isolated regions of silicon utilizing reactive ion etching |
US4204317A (en) * | 1977-11-18 | 1980-05-27 | The Arnold Engineering Company | Method of making a lead frame |
US4177554A (en) * | 1978-04-26 | 1979-12-11 | Western Electric Co., Inc. | Assembling leads to a substrate |
GB1601520A (en) * | 1978-05-31 | 1981-10-28 | Gen Electric Co Ltd | Electric circuit arrangements |
US4219448A (en) * | 1978-06-08 | 1980-08-26 | Bernd Ross | Screenable contact structure and method for semiconductor devices |
US4185882A (en) * | 1978-07-14 | 1980-01-29 | Teledyne Industries, Inc. | Electrical connector for printed circuit boards or the like |
US4224637A (en) * | 1978-08-10 | 1980-09-23 | Minnesota Mining And Manufacturing Company | Leaded mounting and connector unit for an electronic device |
US4232815A (en) * | 1978-11-06 | 1980-11-11 | Kyocera International, Inc. | Integrated circuit lead coupling device and method |
US4335501A (en) * | 1979-10-31 | 1982-06-22 | The General Electric Company Limited | Manufacture of monolithic LED arrays for electroluminescent display devices |
-
1980
- 1980-12-19 US US06/218,136 patent/US4391531A/en not_active Expired - Fee Related
-
1981
- 1981-11-06 CA CA000389620A patent/CA1170343A/en not_active Expired
- 1981-11-25 GB GB8135519A patent/GB2090055B/en not_active Expired
- 1981-11-27 JP JP56190461A patent/JPS57124782A/ja active Pending
- 1981-12-18 CH CH812581A patent/CH647640GA3/de unknown
- 1981-12-18 DE DE19813150196 patent/DE3150196A1/de not_active Withdrawn
- 1981-12-18 FR FR8123758A patent/FR2498791B1/fr not_active Expired
- 1981-12-18 IT IT49950/81A patent/IT1218263B/it active
-
1985
- 1985-06-06 HK HK433/85A patent/HK43385A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
FR2498791B1 (fr) | 1987-12-24 |
GB2090055A (en) | 1982-06-30 |
CA1170343A (en) | 1984-07-03 |
DE3150196A1 (de) | 1982-07-15 |
IT1218263B (it) | 1990-04-12 |
GB2090055B (en) | 1985-01-09 |
HK43385A (en) | 1985-06-14 |
JPS57124782A (en) | 1982-08-03 |
CH647640GA3 (it) | 1985-02-15 |
US4391531A (en) | 1983-07-05 |
FR2498791A1 (fr) | 1982-07-30 |
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