AR229102A1 - Modulo de circuito simple-en-linea enchufable verticalmente sin carcasa - Google Patents

Modulo de circuito simple-en-linea enchufable verticalmente sin carcasa

Info

Publication number
AR229102A1
AR229102A1 AR286748A AR28674881A AR229102A1 AR 229102 A1 AR229102 A1 AR 229102A1 AR 286748 A AR286748 A AR 286748A AR 28674881 A AR28674881 A AR 28674881A AR 229102 A1 AR229102 A1 AR 229102A1
Authority
AR
Argentina
Prior art keywords
casing
circuit module
line circuit
module pluggable
pluggable
Prior art date
Application number
AR286748A
Other languages
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19803036196 external-priority patent/DE3036196A1/de
Priority claimed from DE19813121000 external-priority patent/DE3121000A1/de
Priority claimed from DE19813121515 external-priority patent/DE3121515A1/de
Priority claimed from DE19813123201 external-priority patent/DE3123201A1/de
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of AR229102A1 publication Critical patent/AR229102A1/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AR286748A 1980-09-25 1981-09-11 Modulo de circuito simple-en-linea enchufable verticalmente sin carcasa AR229102A1 (es)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE19803036196 DE3036196A1 (de) 1980-09-25 1980-09-25 Gehaeuseloses senkrecht steckbares single-in-line-schaltungsmodul
DE19813121000 DE3121000A1 (de) 1981-05-26 1981-05-26 Gehaeuseloses, senkrecht steckbares single-in-line-schaltungsmodul
DE19813121515 DE3121515A1 (de) 1981-05-29 1981-05-29 Gehaeuseloses, senkrecht steckbares single-in-line-schaltungsmodul
DE19813123201 DE3123201A1 (de) 1981-06-11 1981-06-11 Gehaeuseloses, senkrecht steckbares single-in-line-schaltungsmodul

Publications (1)

Publication Number Publication Date
AR229102A1 true AR229102A1 (es) 1983-06-15

Family

ID=27432577

Family Applications (1)

Application Number Title Priority Date Filing Date
AR286748A AR229102A1 (es) 1980-09-25 1981-09-11 Modulo de circuito simple-en-linea enchufable verticalmente sin carcasa

Country Status (6)

Country Link
EP (1) EP0048938B1 (es)
AR (1) AR229102A1 (es)
AU (1) AU7564381A (es)
BR (1) BR8106123A (es)
DE (1) DE3175034D1 (es)
LU (1) LU83439A1 (es)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2522917A1 (fr) * 1982-03-05 1983-09-09 Lignes Telegraph Telephon Dispositif de refroidissement de composants electroniques et baie de telecommunication comportant un tel dispositif
FR2567324B1 (fr) * 1984-07-06 1986-11-28 Telemecanique Electrique Dispositif de montage, pour composant hybride a couche epaisse notamment pour module electronique
EP0216174A1 (de) * 1985-09-25 1987-04-01 Siemens Aktiengesellschaft Lichtweichen-Einheit
DE3605692A1 (de) * 1986-02-21 1986-11-06 Siemens AG, 1000 Berlin und 8000 München Temperaturaenderungen ausgesetzte anordnung
ATE70661T1 (de) * 1986-11-28 1992-01-15 Siemens Ag Senkrecht steckbares single-in-lineschaltungsmodul.
DE3722119A1 (de) * 1987-07-03 1989-01-12 Siemens Ag Schaltungsmodul mit einem plattenfoermigen schaltungstraeger aus glas oder keramik
DE3738506A1 (de) * 1987-11-13 1989-06-01 Dornier System Gmbh Antennenstruktur
FR2663809B1 (fr) * 1990-06-21 1996-07-19 Siemens Automotive Sa Organe multiple de retenue a ressort et son procede de fabrication.
FR2679729B1 (fr) * 1991-07-23 1994-04-29 Alcatel Telspace Dissipateur thermique.
DE4240754A1 (de) * 1992-12-03 1994-06-16 Siemens Ag Steuergerät, insbesondere für ein Kraftfahrzeug
DE4240755A1 (de) * 1992-12-03 1994-06-16 Siemens Ag Steuergerät, insbesondere für ein Kraftfahrzeug
DE9319473U1 (de) * 1993-12-17 1994-06-23 Siemens AG, 80333 München Hybridschaltungsanordnung
CN111669923A (zh) * 2020-07-03 2020-09-15 常州索维尔电子科技有限公司 控制器散热装置及其安装方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1243254B (de) * 1964-08-07 1967-06-29 Telefunken Patent Traegerkoerper fuer Mikroschaltkreise
DE2107786C3 (de) * 1971-02-18 1983-01-27 N.V. Philips' Gloeilampenfabrieken, 5621 Eindhoven Halbleiterbauelement
DE2165649A1 (de) * 1971-12-30 1973-07-12 Staver Co Kuehlkoerper
DE2344145A1 (de) * 1973-09-01 1975-03-13 Bosch Gmbh Robert Steuerteil fuer ein elektronisches steuergeraet, insbesondere fuer die zentralelektronik in fahrzeugen
DE2516007A1 (de) * 1974-04-16 1975-11-06 Lucas Electrical Co Ltd Elektronikeinheit
DE7434817U (de) * 1974-10-17 1975-01-23 Siemens Ag Schaltungsplatte zum Einsetzen in Chassis oder chassisähnliche Trägerkörper von Steueranlagen
US4041524A (en) * 1974-12-30 1977-08-09 The Staver Company, Inc. Heat dissipating device for transistor with outwardly extending heat conductive tab
IN148328B (es) * 1977-04-18 1981-01-17 Rca Corp
DE2806518A1 (de) * 1978-02-16 1979-08-30 Bosch Gmbh Robert Anordnung zum anschluss und verpacken mindestens eines halbleiterkoerpers

Also Published As

Publication number Publication date
LU83439A1 (de) 1981-10-29
AU7564381A (en) 1983-03-31
EP0048938A1 (de) 1982-04-07
DE3175034D1 (en) 1986-09-04
EP0048938B1 (de) 1986-07-30
BR8106123A (pt) 1982-06-15

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