AR229102A1 - SIMPLE-IN-LINE CIRCUIT MODULE PLUGGABLE VERTICALLY WITHOUT CASING - Google Patents

SIMPLE-IN-LINE CIRCUIT MODULE PLUGGABLE VERTICALLY WITHOUT CASING

Info

Publication number
AR229102A1
AR229102A1 AR286748A AR28674881A AR229102A1 AR 229102 A1 AR229102 A1 AR 229102A1 AR 286748 A AR286748 A AR 286748A AR 28674881 A AR28674881 A AR 28674881A AR 229102 A1 AR229102 A1 AR 229102A1
Authority
AR
Argentina
Prior art keywords
casing
circuit module
line circuit
module pluggable
pluggable
Prior art date
Application number
AR286748A
Other languages
Spanish (es)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19803036196 external-priority patent/DE3036196A1/en
Priority claimed from DE19813121000 external-priority patent/DE3121000A1/en
Priority claimed from DE19813121515 external-priority patent/DE3121515A1/en
Priority claimed from DE19813123201 external-priority patent/DE3123201A1/en
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of AR229102A1 publication Critical patent/AR229102A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
AR286748A 1980-09-25 1981-09-11 SIMPLE-IN-LINE CIRCUIT MODULE PLUGGABLE VERTICALLY WITHOUT CASING AR229102A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE19803036196 DE3036196A1 (en) 1980-09-25 1980-09-25 Single in=line circuit module with no package - has metal plate heat sink, and is used esp. as coder-decoder in digital telecommunications systems
DE19813121000 DE3121000A1 (en) 1981-05-26 1981-05-26 Single-in-line circuit module which has no housing and can be plugged in vertically
DE19813121515 DE3121515A1 (en) 1981-05-29 1981-05-29 Single-in-line circuit module which has no housing and can be plugged in vertically
DE19813123201 DE3123201A1 (en) 1981-06-11 1981-06-11 Single-in-line circuit module which has no housing and can be plugged in vertically

Publications (1)

Publication Number Publication Date
AR229102A1 true AR229102A1 (en) 1983-06-15

Family

ID=27432577

Family Applications (1)

Application Number Title Priority Date Filing Date
AR286748A AR229102A1 (en) 1980-09-25 1981-09-11 SIMPLE-IN-LINE CIRCUIT MODULE PLUGGABLE VERTICALLY WITHOUT CASING

Country Status (6)

Country Link
EP (1) EP0048938B1 (en)
AR (1) AR229102A1 (en)
AU (1) AU7564381A (en)
BR (1) BR8106123A (en)
DE (1) DE3175034D1 (en)
LU (1) LU83439A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2522917A1 (en) * 1982-03-05 1983-09-09 Lignes Telegraph Telephon Telecommunications equipment rack with component cooling system - is partic. applicable to optical communication laser diode cooling and confines cooled space in narrow vertical channels
FR2567324B1 (en) * 1984-07-06 1986-11-28 Telemecanique Electrique MOUNTING DEVICE FOR A HYBRID COMPONENT WITH A THICK LAYER, ESPECIALLY FOR AN ELECTRONIC MODULE
EP0216174A1 (en) * 1985-09-25 1987-04-01 Siemens Aktiengesellschaft Light-directive coupling unit
DE3605692A1 (en) * 1986-02-21 1986-11-06 Siemens AG, 1000 Berlin und 8000 München TEMPERATURE CHANGES EXPOSED ARRANGEMENT
EP0268935B1 (en) * 1986-11-28 1991-12-18 Siemens Aktiengesellschaft Vertically pluggable single-in-line circuit module
DE3722119A1 (en) * 1987-07-03 1989-01-12 Siemens Ag CIRCUIT MODULE WITH A PLATE-SHAPED CIRCUIT BRACKET MADE OF GLASS OR CERAMIC
DE3738506A1 (en) * 1987-11-13 1989-06-01 Dornier System Gmbh ANTENNA STRUCTURE
FR2663809B1 (en) * 1990-06-21 1996-07-19 Siemens Automotive Sa MULTIPLE SPRING RETAINER AND MANUFACTURING METHOD THEREOF.
FR2679729B1 (en) * 1991-07-23 1994-04-29 Alcatel Telspace HEATSINK.
DE4240754A1 (en) * 1992-12-03 1994-06-16 Siemens Ag Electronic control device for motor vehicle engine or ABS system - has edge walls of cooling plate, plug connector and housing frame or cover forming four narrow sides of housing
DE4240755A1 (en) * 1992-12-03 1994-06-16 Siemens Ag Electronic control device for motor vehicle engine or ABS system - has cooling plate with PCBs fixed on both sides and with housing fixing section which extends out of housing
DE9319473U1 (en) * 1993-12-17 1994-06-23 Siemens Ag Hybrid circuit arrangement
CN111669923A (en) * 2020-07-03 2020-09-15 常州索维尔电子科技有限公司 Controller heat dissipation device and installation method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1243254B (en) * 1964-08-07 1967-06-29 Telefunken Patent Support body for microcircuits
DE2107786C3 (en) * 1971-02-18 1983-01-27 N.V. Philips' Gloeilampenfabrieken, 5621 Eindhoven Semiconductor component
DE2165649A1 (en) * 1971-12-30 1973-07-12 Staver Co HEAT SINK
DE2344145A1 (en) * 1973-09-01 1975-03-13 Bosch Gmbh Robert Central electronic unit for vehicles - has control element with support having contact springs
DE2516007A1 (en) * 1974-04-16 1975-11-06 Lucas Electrical Co Ltd ELECTRONIC UNIT
DE7434817U (en) * 1974-10-17 1975-01-23 Siemens Ag Circuit board for insertion in chassis or chassis-like support bodies of control systems
US4041524A (en) * 1974-12-30 1977-08-09 The Staver Company, Inc. Heat dissipating device for transistor with outwardly extending heat conductive tab
IN148328B (en) * 1977-04-18 1981-01-17 Rca Corp
DE2806518A1 (en) * 1978-02-16 1979-08-30 Bosch Gmbh Robert ARRANGEMENT FOR CONNECTING AND PACKING AT LEAST ONE SEMICONDUCTOR BODY

Also Published As

Publication number Publication date
LU83439A1 (en) 1981-10-29
DE3175034D1 (en) 1986-09-04
BR8106123A (en) 1982-06-15
AU7564381A (en) 1983-03-31
EP0048938A1 (en) 1982-04-07
EP0048938B1 (en) 1986-07-30

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