IT8123502A0 - Procedimento per la fabbricazione di circuiti integrati. - Google Patents

Procedimento per la fabbricazione di circuiti integrati.

Info

Publication number
IT8123502A0
IT8123502A0 IT8123502A IT2350281A IT8123502A0 IT 8123502 A0 IT8123502 A0 IT 8123502A0 IT 8123502 A IT8123502 A IT 8123502A IT 2350281 A IT2350281 A IT 2350281A IT 8123502 A0 IT8123502 A0 IT 8123502A0
Authority
IT
Italy
Prior art keywords
procedure
manufacture
integrated circuits
circuits
integrated
Prior art date
Application number
IT8123502A
Other languages
English (en)
Other versions
IT1138909B (it
Inventor
Arthur Curtis Adams
Frank Bernard Alexander Jr
Hyman Joseph Levinstein
Louis Robert Thibault
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of IT8123502A0 publication Critical patent/IT8123502A0/it
Application granted granted Critical
Publication of IT1138909B publication Critical patent/IT1138909B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0277—Electrolithographic processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/143—Electron beam

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electron Beam Exposure (AREA)
IT23502/81A 1980-08-18 1981-08-13 Procedimento per la fabbricazione di circuiti integrati IT1138909B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/178,988 US4323638A (en) 1980-08-18 1980-08-18 Reducing charging effects in charged-particle-beam lithography

Publications (2)

Publication Number Publication Date
IT8123502A0 true IT8123502A0 (it) 1981-08-13
IT1138909B IT1138909B (it) 1986-09-17

Family

ID=22654758

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23502/81A IT1138909B (it) 1980-08-18 1981-08-13 Procedimento per la fabbricazione di circuiti integrati

Country Status (8)

Country Link
US (1) US4323638A (it)
JP (1) JPS5754323A (it)
CA (1) CA1157575A (it)
DE (1) DE3132080A1 (it)
FR (1) FR2488730A1 (it)
GB (1) GB2085613B (it)
IT (1) IT1138909B (it)
NL (1) NL8103848A (it)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4440804A (en) * 1982-08-02 1984-04-03 Fairchild Camera & Instrument Corporation Lift-off process for fabricating self-aligned contacts
JPS5948924A (ja) * 1982-09-14 1984-03-21 Nec Corp 電子線露光用位置合せマ−ク
JPS59132124A (ja) * 1983-01-17 1984-07-30 Mitsubishi Electric Corp 半導体装置の製造方法
US4555169A (en) * 1983-09-13 1985-11-26 Canon Kabushiki Kaisha Focus detecting device for a camera
US5843623A (en) * 1996-09-10 1998-12-01 International Business Machines Corporation Low profile substrate ground probe
DE19907621B4 (de) * 1999-02-23 2005-12-15 Robert Bosch Gmbh Ätzmaskierung
US6528934B1 (en) 2000-05-30 2003-03-04 Chunghwa Picture Tubes Ltd. Beam forming region for electron gun
US7038204B2 (en) * 2004-05-26 2006-05-02 International Business Machines Corporation Method for reducing proximity effects in electron beam lithography
WO2008140585A1 (en) * 2006-11-22 2008-11-20 Nexgen Semi Holding, Inc. Apparatus and method for conformal mask manufacturing
US10991545B2 (en) 2008-06-30 2021-04-27 Nexgen Semi Holding, Inc. Method and device for spatial charged particle bunching
US10566169B1 (en) 2008-06-30 2020-02-18 Nexgen Semi Holding, Inc. Method and device for spatial charged particle bunching
JP2016513372A (ja) * 2014-01-22 2016-05-12 マッパー・リソグラフィー・アイピー・ビー．ブイ． 荷電留意ビーム処理の間の半導体基板のための電気的なチャージの規制

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3689768A (en) * 1970-06-18 1972-09-05 Masamichi Sato Electron beam recording materials
US3874916A (en) * 1972-06-23 1975-04-01 Radiant Energy Systems Mask alignment system for electron beam pattern generator
US3949131A (en) * 1974-06-19 1976-04-06 Bell Telephone Laboratories, Incorporated Photomasks with antistatic control
US4165395A (en) * 1977-06-30 1979-08-21 International Business Machines Corporation Process for forming a high aspect ratio structure by successive exposures with electron beam and actinic radiation
US4224733A (en) * 1977-10-11 1980-09-30 Fujitsu Limited Ion implantation method
GB1604004A (en) * 1977-10-11 1981-12-02 Fujitsu Ltd Method and apparatus for processing semi-conductor wafers
DE2807478A1 (de) * 1978-02-22 1979-08-23 Ibm Deutschland Belichtungsverfahren
JPS54116883A (en) * 1978-03-02 1979-09-11 Mitsubishi Electric Corp Electron beam exposure method
US4244799A (en) * 1978-09-11 1981-01-13 Bell Telephone Laboratories, Incorporated Fabrication of integrated circuits utilizing thick high-resolution patterns

Also Published As

Publication number Publication date
FR2488730A1 (fr) 1982-02-19
JPS5754323A (it) 1982-03-31
IT1138909B (it) 1986-09-17
DE3132080A1 (de) 1982-04-15
GB2085613B (en) 1984-05-31
NL8103848A (nl) 1982-03-16
CA1157575A (en) 1983-11-22
GB2085613A (en) 1982-04-28
FR2488730B1 (it) 1984-11-23
US4323638A (en) 1982-04-06

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