IT7829674A0 - Struttura per il montaggio di chipa circuito integrato e relativo processo di fabbricazione. - Google Patents

Struttura per il montaggio di chipa circuito integrato e relativo processo di fabbricazione.

Info

Publication number
IT7829674A0
IT7829674A0 IT7829674A IT2967478A IT7829674A0 IT 7829674 A0 IT7829674 A0 IT 7829674A0 IT 7829674 A IT7829674 A IT 7829674A IT 2967478 A IT2967478 A IT 2967478A IT 7829674 A0 IT7829674 A0 IT 7829674A0
Authority
IT
Italy
Prior art keywords
chipa
integrated circuit
manufacturing process
assembly structure
circuit assembly
Prior art date
Application number
IT7829674A
Other languages
English (en)
Other versions
IT1160061B (it
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of IT7829674A0 publication Critical patent/IT7829674A0/it
Application granted granted Critical
Publication of IT1160061B publication Critical patent/IT1160061B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
IT29674/78A 1977-11-18 1978-11-10 Struttura per il montaggio di chip a circuito integrato e relativo processo di fabbricazione IT1160061B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US85277977A 1977-11-18 1977-11-18

Publications (2)

Publication Number Publication Date
IT7829674A0 true IT7829674A0 (it) 1978-11-10
IT1160061B IT1160061B (it) 1987-03-04

Family

ID=25314194

Family Applications (1)

Application Number Title Priority Date Filing Date
IT29674/78A IT1160061B (it) 1977-11-18 1978-11-10 Struttura per il montaggio di chip a circuito integrato e relativo processo di fabbricazione

Country Status (3)

Country Link
EP (1) EP0002166A3 (it)
JP (1) JPS5843909B2 (it)
IT (1) IT1160061B (it)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551192A (en) * 1983-06-30 1985-11-05 International Business Machines Corporation Electrostatic or vacuum pinchuck formed with microcircuit lithography
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US4896464A (en) * 1988-06-15 1990-01-30 International Business Machines Corporation Formation of metallic interconnects by grit blasting
US5170245A (en) * 1988-06-15 1992-12-08 International Business Machines Corp. Semiconductor device having metallic interconnects formed by grit blasting
US5243133A (en) * 1992-02-18 1993-09-07 International Business Machines, Inc. Ceramic chip carrier with lead frame or edge clip
US6336269B1 (en) 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
US6835898B2 (en) 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
KR100335166B1 (ko) * 1994-11-15 2002-05-04 이고르 와이. 칸드로스 반도체 장치를 실행시키는 방법
EP0792517B1 (en) * 1994-11-15 2003-10-22 Formfactor, Inc. Electrical contact structures from flexible wire
EP0792519B1 (en) * 1994-11-15 2003-03-26 Formfactor, Inc. Interconnection elements for microelectronic components
US6727579B1 (en) 1994-11-16 2004-04-27 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
CN1151009C (zh) * 1995-05-26 2004-05-26 福姆法克特公司 利用牺牲基片制作互连件和接点
US20100065963A1 (en) 1995-05-26 2010-03-18 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3757271A (en) * 1971-10-04 1973-09-04 Ibm Integrated circuit package
US3959874A (en) * 1974-12-20 1976-06-01 Western Electric Company, Inc. Method of forming an integrated circuit assembly

Also Published As

Publication number Publication date
JPS5473566A (en) 1979-06-12
EP0002166A2 (fr) 1979-05-30
EP0002166A3 (fr) 1979-08-08
JPS5843909B2 (ja) 1983-09-29
IT1160061B (it) 1987-03-04

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