IT7828365A0 - Circuito integrato protetto, relativo substrato di interconnessione protetto erelativo procedimento diproduzione. - Google Patents

Circuito integrato protetto, relativo substrato di interconnessione protetto erelativo procedimento diproduzione.

Info

Publication number
IT7828365A0
IT7828365A0 IT7828365A IT2836578A IT7828365A0 IT 7828365 A0 IT7828365 A0 IT 7828365A0 IT 7828365 A IT7828365 A IT 7828365A IT 2836578 A IT2836578 A IT 2836578A IT 7828365 A0 IT7828365 A0 IT 7828365A0
Authority
IT
Italy
Prior art keywords
protected
integrated circuit
production procedure
interconnection substrate
related production
Prior art date
Application number
IT7828365A
Other languages
English (en)
Other versions
IT1098983B (it
Original Assignee
Cii Honeywell Bull
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cii Honeywell Bull filed Critical Cii Honeywell Bull
Publication of IT7828365A0 publication Critical patent/IT7828365A0/it
Application granted granted Critical
Publication of IT1098983B publication Critical patent/IT1098983B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
IT28365/78A 1977-10-03 1978-10-03 Circuito integrato protetto,relativo substrato di interconnessione protetto e relativo procedimento di produzione IT1098983B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7729686A FR2404992A1 (fr) 1977-10-03 1977-10-03 Circuits electriques integres proteges, substrats d'interconnexion proteges comportant de tels circuits et procede d'obtention desdits circuits et substrats

Publications (2)

Publication Number Publication Date
IT7828365A0 true IT7828365A0 (it) 1978-10-03
IT1098983B IT1098983B (it) 1985-09-18

Family

ID=9196038

Family Applications (1)

Application Number Title Priority Date Filing Date
IT28365/78A IT1098983B (it) 1977-10-03 1978-10-03 Circuito integrato protetto,relativo substrato di interconnessione protetto e relativo procedimento di produzione

Country Status (8)

Country Link
JP (1) JPS5460566A (it)
BE (1) BE870878A (it)
DE (1) DE2843133A1 (it)
FR (1) FR2404992A1 (it)
GB (1) GB2009504B (it)
IT (1) IT1098983B (it)
NL (1) NL7809979A (it)
SE (1) SE7810315L (it)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2922005A1 (de) * 1979-05-30 1980-12-04 Siemens Ag Halbleiterbauelement mit passiviertem halbleiterkoerper
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
JPS56114363A (en) * 1980-02-15 1981-09-08 Toshiba Corp Semiconductor device sealed with resin
US4419999A (en) * 1981-04-17 1983-12-13 May Jr James W Method and apparatus for monitoring vascular flow
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
JPS59193596A (ja) * 1983-04-18 1984-11-02 Kyodo Printing Co Ltd Ｉｃカ−ド用ｉｃモジユ−ル
FI72409C (fi) * 1984-03-09 1987-05-11 Lohja Ab Oy Foerfarande foer inkapsling av pao en baerremsa anordnade halvledarkomponenter.
US4511620A (en) * 1984-06-29 1985-04-16 Dow Corning Corporation Method for prevention of bubble formation in polyorganosiloxane gels
DE3442131A1 (de) * 1984-11-17 1986-05-22 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen
US6437464B1 (en) 1999-07-29 2002-08-20 Encap Motor Corporation Motor and disc assembly for computer hard drive
US6501616B1 (en) 1999-07-29 2002-12-31 Encap Motor Corporation Hard disc drive with base incorporating a spindle motor stator
US6753628B1 (en) 1999-07-29 2004-06-22 Encap Motor Corporation High speed spindle motor for disc drive
US6617721B1 (en) 1999-07-29 2003-09-09 Encap Motor Corporation High speed spindle motor
US6300695B1 (en) 1999-07-29 2001-10-09 Encap Motor Corporation High speed spindle motor with hydrodynamic bearings
US6362554B1 (en) 1999-07-29 2002-03-26 Encap Motor Corporation Stator assembly
AU2580301A (en) 1999-12-17 2001-06-25 Encap Motor Corporation Spindle motor with encapsulated stator and method of making same
US6892439B1 (en) 2001-02-01 2005-05-17 Encap Motor Corporation Motor with stator made from linear core preform
US7036207B2 (en) 2001-03-02 2006-05-02 Encap Motor Corporation Stator assembly made from a plurality of toroidal core segments and motor using same

Also Published As

Publication number Publication date
IT1098983B (it) 1985-09-18
BE870878A (fr) 1979-01-15
SE7810315L (sv) 1979-04-04
NL7809979A (nl) 1979-04-05
GB2009504B (en) 1982-05-12
JPS5460566A (en) 1979-05-16
FR2404992B1 (it) 1981-05-08
DE2843133A1 (de) 1979-04-19
GB2009504A (en) 1979-06-13
FR2404992A1 (fr) 1979-04-27

Similar Documents

Publication Publication Date Title
NL189889C (nl) Geintegreerde halfgeleiderschakeling.
NL7901334A (nl) Halfgeleidersubstraat.
IT7828365A0 (it) Circuito integrato protetto, relativo substrato di interconnessione protetto erelativo procedimento diproduzione.
IT7822864A0 (it) Documento protetto e procedimento per fabbricare lo stesso.
NL191683C (nl) Halfgeleidergeheugenschakeling.
NL7612223A (nl) Geintegreerde schakeling.
IT7825213A0 (it) Struttura di circuito integrato.
IT1084379B (it) Procedimento di piroscissione.
IT7820837A0 (it) Memoria semiconduttrice.
IT7827716A0 (it) Spoletta elettronica.
NL177164C (nl) Foto-elektrisch halfgeleiderelement.
IT7828238A0 (it) Circuito integrato perfezionato.
EP0022870A4 (en) Semiconductor circuit.
NL7808060A (nl) Halfgeleiderelement.
NO142884C (no) Spenneanordning.
NL7704005A (nl) Geintegreerde schakeling.
NL7701379A (nl) Licht-uitzendend halfgeleiderelement.
IT7827013A0 (it) Circuito integrato semiconduttore.
NL7800409A (nl) Geintegreerde schakeling.
DE3784192D1 (de) Schaltungssubstrat.
NL7708369A (nl) Geintegreerde halfgeleiderketen.
IT7830411A0 (it) Circuito logico integrato perfezionato.
NL7712939A (nl) Geintegreerd circuit.
NL7811807A (nl) Laterale halfgeleiderinrichtingen.
IT8123851A0 (it) Circuito stampato e relativo procedimento di fabbricazione.