IT1397091B1 - Metodo per realizzare un sistema di recupero di calore, in particolare basato sull'effetto seebeck e relativo sistema. - Google Patents

Metodo per realizzare un sistema di recupero di calore, in particolare basato sull'effetto seebeck e relativo sistema.

Info

Publication number
IT1397091B1
IT1397091B1 ITMI2009A002313A ITMI20092313A IT1397091B1 IT 1397091 B1 IT1397091 B1 IT 1397091B1 IT MI2009A002313 A ITMI2009A002313 A IT MI2009A002313A IT MI20092313 A ITMI20092313 A IT MI20092313A IT 1397091 B1 IT1397091 B1 IT 1397091B1
Authority
IT
Italy
Prior art keywords
realizing
heat recovery
seebeck effect
particularly based
recovery system
Prior art date
Application number
ITMI2009A002313A
Other languages
English (en)
Inventor
Sebastiano Ravesi
Giovanni Abagnale
Original Assignee
Stmicroelectronics S Rl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stmicroelectronics S Rl filed Critical Stmicroelectronics S Rl
Priority to ITMI2009A002313A priority Critical patent/IT1397091B1/it
Priority to US12/975,222 priority patent/US9105811B2/en
Publication of ITMI20092313A1 publication Critical patent/ITMI20092313A1/it
Application granted granted Critical
Publication of IT1397091B1 publication Critical patent/IT1397091B1/it
Priority to US14/788,743 priority patent/US10510941B2/en
Priority to US16/692,861 priority patent/US11594667B2/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
ITMI2009A002313A 2009-12-28 2009-12-28 Metodo per realizzare un sistema di recupero di calore, in particolare basato sull'effetto seebeck e relativo sistema. IT1397091B1 (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
ITMI2009A002313A IT1397091B1 (it) 2009-12-28 2009-12-28 Metodo per realizzare un sistema di recupero di calore, in particolare basato sull'effetto seebeck e relativo sistema.
US12/975,222 US9105811B2 (en) 2009-12-28 2010-12-21 Process for realizing a system for recovering heat, in particular based on the Seebeck's effect, and corresponding system
US14/788,743 US10510941B2 (en) 2009-12-28 2015-06-30 Process for realizing a system for recovering heat, in particular based on the seebeck's effect, and corresponding system
US16/692,861 US11594667B2 (en) 2009-12-28 2019-11-22 Process for realizing a system for recovering heat, in particular based on the Seebeck's effect, and corresponding system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI2009A002313A IT1397091B1 (it) 2009-12-28 2009-12-28 Metodo per realizzare un sistema di recupero di calore, in particolare basato sull'effetto seebeck e relativo sistema.

Publications (2)

Publication Number Publication Date
ITMI20092313A1 ITMI20092313A1 (it) 2011-06-29
IT1397091B1 true IT1397091B1 (it) 2012-12-28

Family

ID=42358568

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI2009A002313A IT1397091B1 (it) 2009-12-28 2009-12-28 Metodo per realizzare un sistema di recupero di calore, in particolare basato sull'effetto seebeck e relativo sistema.

Country Status (2)

Country Link
US (3) US9105811B2 (it)
IT (1) IT1397091B1 (it)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2053146B1 (en) * 2006-08-07 2016-08-31 Seiko Instruments Inc. Method for manufacturing electroformed mold, electroformed mold, and method for manufacturing electroformed parts
IT1397091B1 (it) 2009-12-28 2012-12-28 Stmicroelectronics S Rl Metodo per realizzare un sistema di recupero di calore, in particolare basato sull'effetto seebeck e relativo sistema.
JP6417586B2 (ja) * 2014-08-25 2018-11-07 セイコーエプソン株式会社 造形方法および造形物
TR201700484A2 (tr) * 2017-01-12 2017-10-23 Hat Teknoloji A S Güneş işiğindan elektri̇k üretmek i̇çi̇n bi̇r solar hücre ve solar panel
WO2018182619A1 (en) * 2017-03-30 2018-10-04 Intel Corporation Co-integrating compositionally different semiconductor materials using a common thin seed layer

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03502859A (ja) * 1988-02-22 1991-06-27 ミゴフスキ、フリードリッヒ‐カール 熱発電機
US5167723A (en) * 1988-03-10 1992-12-01 Yamaha Hatsudoki Kabushiki Kaisha Thermocouple with overlapped dissimilar conductors
DE69130654T2 (de) * 1990-04-20 1999-08-12 Matsushita Electric Ind Co Ltd Vakuumisolierter thermoelektrischer Halbleiter bestehend aus einer porösen Struktur und thermoelektrisches Bauelement
JP2636119B2 (ja) * 1992-09-08 1997-07-30 工業技術院長 熱電素子シートとその製造方法
US6121539A (en) * 1998-08-27 2000-09-19 International Business Machines Corporation Thermoelectric devices and methods for making the same
DE10004390C2 (de) * 2000-02-02 2002-05-02 Infineon Technologies Ag Thermoelektrischer Generator und Verfahren zu seiner Herstellung
US6747572B2 (en) * 2001-01-30 2004-06-08 Oceana Sensor Technologies, Inc. Autonomous sensor system for remote sensing and signal transmission
DE10112383B4 (de) * 2001-03-15 2004-01-29 Forschungszentrum Karlsruhe Gmbh Thermoelement und daraus aufgebauter Thermogenerator
US9281461B2 (en) * 2003-12-02 2016-03-08 Battelle Memorial Institute Thermoelectric devices and applications for the same
US8455751B2 (en) * 2003-12-02 2013-06-04 Battelle Memorial Institute Thermoelectric devices and applications for the same
JP2006086510A (ja) * 2004-08-17 2006-03-30 Nagoya Institute Of Technology 熱電変換装置及びその製造方法
EP1840980A1 (en) * 2006-03-31 2007-10-03 STMicroelectronics S.r.l. Structure comprising Peltier cells integrated on a semiconductor substrate and corresponding manufacturing process
WO2007141890A1 (ja) * 2006-06-09 2007-12-13 Murata Manufacturing Co., Ltd. 熱電変換モジュールおよびその製造方法
WO2008153686A2 (en) * 2007-05-21 2008-12-18 Gmz Energy, Inc. Solar thermoelectric and thermal cogeneration
JP5007748B2 (ja) * 2007-07-19 2012-08-22 株式会社村田製作所 熱電変換モジュールおよび熱電変換モジュールの製造方法
WO2009030236A2 (en) * 2007-09-03 2009-03-12 Inno Power Aps Layered structure for generating electrical energy
US9373771B2 (en) * 2008-12-04 2016-06-21 Sheetak Inc. Enhanced metal-core thermoelectric cooling and power generation device
JP5515721B2 (ja) * 2009-12-21 2014-06-11 富士通株式会社 熱電変換モジュールの製造方法
IT1397091B1 (it) 2009-12-28 2012-12-28 Stmicroelectronics S Rl Metodo per realizzare un sistema di recupero di calore, in particolare basato sull'effetto seebeck e relativo sistema.

Also Published As

Publication number Publication date
US9105811B2 (en) 2015-08-11
US20200161528A1 (en) 2020-05-21
US10510941B2 (en) 2019-12-17
US20150303367A1 (en) 2015-10-22
US20110155201A1 (en) 2011-06-30
US11594667B2 (en) 2023-02-28
ITMI20092313A1 (it) 2011-06-29

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