IT1318929B1 - Procedimento di incollatura - Google Patents
Procedimento di incollaturaInfo
- Publication number
- IT1318929B1 IT1318929B1 IT2000MI002086A ITMI20002086A IT1318929B1 IT 1318929 B1 IT1318929 B1 IT 1318929B1 IT 2000MI002086 A IT2000MI002086 A IT 2000MI002086A IT MI20002086 A ITMI20002086 A IT MI20002086A IT 1318929 B1 IT1318929 B1 IT 1318929B1
- Authority
- IT
- Italy
- Prior art keywords
- gluing procedure
- gluing
- procedure
- Prior art date
Links
- 238000004026 adhesive bonding Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
- B29C66/826—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined
- B29C66/8266—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined
- B29C66/82661—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined by means of vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
- B29C66/826—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined
- B29C66/8266—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/45—Joining of substantially the whole surface of the articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/074—Features related to the fluid pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Saccharide Compounds (AREA)
- Medicines Containing Material From Animals Or Micro-Organisms (AREA)
- Medicines That Contain Protein Lipid Enzymes And Other Medicines (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19946745A DE19946745C1 (de) | 1999-09-29 | 1999-09-29 | Klebeverfahren |
Publications (3)
Publication Number | Publication Date |
---|---|
ITMI20002086A0 ITMI20002086A0 (it) | 2000-09-26 |
ITMI20002086A1 ITMI20002086A1 (it) | 2002-03-26 |
IT1318929B1 true IT1318929B1 (it) | 2003-09-19 |
Family
ID=7923759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT2000MI002086A IT1318929B1 (it) | 1999-09-29 | 2000-09-26 | Procedimento di incollatura |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE19946745C1 (it) |
FR (1) | FR2798935A1 (it) |
IT (1) | IT1318929B1 (it) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2961519B1 (fr) | 2010-06-18 | 2012-07-06 | Commissariat Energie Atomique | Procede de collage calibre en epaisseur entre au moins deux substrats |
EP2521430A1 (de) * | 2011-05-06 | 2012-11-07 | Pierburg Pump Technology GmbH | Verfahren zur Befestigung einer Leiterplatte auf einem Körper sowie elektromotorisch angetriebene Pumpe |
EP3258596A1 (en) * | 2016-06-16 | 2017-12-20 | Morgonsol Väst AB | Photovoltaic thermal plant |
DE102019132433B4 (de) * | 2019-11-29 | 2021-08-12 | Marcel P. HOFSAESS | Temperaturabhängiger Schalter und Verfahren zu dessen Herstellung |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3899377A (en) * | 1971-10-20 | 1975-08-12 | Penelope Jane Vesey Luc | Bonding aluminium |
JPS5757767A (en) * | 1980-09-24 | 1982-04-07 | Matsushita Electric Ind Co Ltd | Bonding method |
JPS5847075A (ja) * | 1981-09-16 | 1983-03-18 | Mitsubishi Heavy Ind Ltd | 接着工法 |
DE3425853A1 (de) * | 1984-07-13 | 1985-05-02 | Gerd 2000 Hamburg Schulz | Befestigungseinrichtung durch unterdruck an oberflaechen aus luftundurchlaessigen werkstoffen |
DE3803636A1 (de) * | 1988-02-06 | 1989-04-06 | Daimler Benz Ag | Verfahren und anordnung zum aufkleben von weichstoffauflagen auf raeumlich gekruemmte blechbauteile |
DE3937943A1 (de) * | 1989-11-15 | 1991-05-16 | Nokia Unterhaltungselektronik | Verfahren zum verkleben von substratplatten fuer fluessigkristallzellen |
FR2659344A1 (fr) * | 1990-03-09 | 1991-09-13 | Thomson Csf | Procede de collage instantane, sans bulles, notamment de surfaces d'elements rigides et non poreux, et dispositif de mise en óoeuvre. |
US5176778A (en) * | 1991-03-26 | 1993-01-05 | Harold Curtis | Method for making fiberglass articles |
US5515188A (en) * | 1994-06-03 | 1996-05-07 | Motorola, Inc. | Method of manufacturing a liquid crystal display device in which a vacuum reservoir attached to the LCD is placed in a conformable container or bag |
DE19622684A1 (de) * | 1996-06-05 | 1997-12-11 | Siemens Ag | Verfahren zur Herstellung mechanisch fester Klebstoffverbindungen zwischen Oberflächen |
FI105845B (fi) * | 1997-11-26 | 2000-10-13 | Wimacor Oy | Menetelmä kerroselementin valmistamiseksi ja kerroselementti |
-
1999
- 1999-09-29 DE DE19946745A patent/DE19946745C1/de not_active Expired - Fee Related
-
2000
- 2000-09-26 IT IT2000MI002086A patent/IT1318929B1/it active
- 2000-09-27 FR FR0012298A patent/FR2798935A1/fr active Pending
Also Published As
Publication number | Publication date |
---|---|
DE19946745C1 (de) | 2001-04-05 |
ITMI20002086A0 (it) | 2000-09-26 |
FR2798935A1 (fr) | 2001-03-30 |
ITMI20002086A1 (it) | 2002-03-26 |
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