IT1282709B1 - Procedimento di formazione di configurazione ultrafine e procedimento di incisione ultrafine utilizzando derivato di - Google Patents

Procedimento di formazione di configurazione ultrafine e procedimento di incisione ultrafine utilizzando derivato di

Info

Publication number
IT1282709B1
IT1282709B1 IT96MI000382A ITMI960382A IT1282709B1 IT 1282709 B1 IT1282709 B1 IT 1282709B1 IT 96MI000382 A IT96MI000382 A IT 96MI000382A IT MI960382 A ITMI960382 A IT MI960382A IT 1282709 B1 IT1282709 B1 IT 1282709B1
Authority
IT
Italy
Prior art keywords
ultrafine
derivative
training process
engraving procedure
configuration training
Prior art date
Application number
IT96MI000382A
Other languages
English (en)
Inventor
Yoshitake Ohnishi
Jun-Ichi Fujita
Arturo Arduini
Alessandro Casnati
Andrea Pochini
Rocco Ungaro
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to IT96MI000382A priority Critical patent/IT1282709B1/it
Publication of ITMI960382A0 publication Critical patent/ITMI960382A0/it
Priority to JP8157287A priority patent/JP2792508B2/ja
Priority to US08/693,672 priority patent/US5702620A/en
Publication of ITMI960382A1 publication Critical patent/ITMI960382A1/it
Application granted granted Critical
Publication of IT1282709B1 publication Critical patent/IT1282709B1/it

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0277—Electrolithographic processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/143—Electron beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/167—X-ray
    • Y10S430/168—X-ray exposure process

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Paints Or Removers (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
IT96MI000382A 1996-02-28 1996-02-28 Procedimento di formazione di configurazione ultrafine e procedimento di incisione ultrafine utilizzando derivato di IT1282709B1 (it)

Priority Applications (3)

Application Number Priority Date Filing Date Title
IT96MI000382A IT1282709B1 (it) 1996-02-28 1996-02-28 Procedimento di formazione di configurazione ultrafine e procedimento di incisione ultrafine utilizzando derivato di
JP8157287A JP2792508B2 (ja) 1996-02-28 1996-06-18 超微細パタン形成方法及び超微細エッチング方法
US08/693,672 US5702620A (en) 1996-02-28 1996-08-13 Ultrafine pattern forming method and ultrafine etching method using calixarene derivative as negative resist

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT96MI000382A IT1282709B1 (it) 1996-02-28 1996-02-28 Procedimento di formazione di configurazione ultrafine e procedimento di incisione ultrafine utilizzando derivato di

Publications (3)

Publication Number Publication Date
ITMI960382A0 ITMI960382A0 (it) 1996-02-28
ITMI960382A1 ITMI960382A1 (it) 1997-08-28
IT1282709B1 true IT1282709B1 (it) 1998-03-31

Family

ID=11373436

Family Applications (1)

Application Number Title Priority Date Filing Date
IT96MI000382A IT1282709B1 (it) 1996-02-28 1996-02-28 Procedimento di formazione di configurazione ultrafine e procedimento di incisione ultrafine utilizzando derivato di

Country Status (3)

Country Link
US (1) US5702620A (it)
JP (1) JP2792508B2 (it)
IT (1) IT1282709B1 (it)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3486341B2 (ja) * 1997-09-18 2004-01-13 株式会社東芝 感光性組成物およびそれを用いたパターン形成法
US7514197B2 (en) 2002-09-09 2009-04-07 Nec Corporation Resist and method of forming resist pattern
DE102004012179A1 (de) 2004-03-10 2005-09-29 Universität Kassel Verfahren zur elektrostatischen Strukturierung einer Substratoberfläche und Rastersonden-Lithographieverfahren damit
TWI494697B (zh) 2004-12-24 2015-08-01 Mitsubishi Gas Chemical Co 光阻用化合物
JP4830138B2 (ja) * 2005-08-22 2011-12-07 和歌山県 多孔質薄膜の製造方法
KR100757341B1 (ko) * 2005-12-23 2007-09-11 삼성전자주식회사 실록산 화합물, 이를 포함하는 분자 포토레지스트 조성물및 패턴 형성 방법
TWI432408B (zh) 2007-01-09 2014-04-01 Jsr Corp 化合物及敏輻射線性組成物
WO2009022540A1 (ja) 2007-08-13 2009-02-19 Jsr Corporation 化合物及び感放射線性組成物
DE102012224537A1 (de) 2012-12-31 2014-07-03 Technische Universität Ilmenau Lithographieverfahren und Lithographievorrichtung für Bauteile und Schaltungen mit Strukturabmessungen im Mikro- und Nanobereich

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653819B2 (ja) * 1990-05-10 1994-07-20 日本電気株式会社 カリックスアレーンおよび／またはカリックスアレーン誘導体のフィルムおよびその製造法
US5143784A (en) * 1990-05-10 1992-09-01 Nec Corporation Soluble calixarene derivative and films thereof
JPH0723340B2 (ja) * 1990-09-19 1995-03-15 日本電気株式会社 カリックスアレーン誘導体およびそのフィルムおよびそのパターン形成方法
JP2893923B2 (ja) * 1990-10-18 1999-05-24 日本電気株式会社 組成物およびそのフイルムおよびそのパターン形成方法
JP2705345B2 (ja) * 1991-03-22 1998-01-28 日本電気株式会社 配線形成方法
JP2692428B2 (ja) * 1991-06-21 1997-12-17 日本電気株式会社 半導体素子の製造方法
JP2712916B2 (ja) * 1991-08-29 1998-02-16 日本電気株式会社 配線形成方法
JP3021236B2 (ja) * 1993-06-17 2000-03-15 シャープ株式会社 磁気記録再生装置

Also Published As

Publication number Publication date
JPH09236919A (ja) 1997-09-09
JP2792508B2 (ja) 1998-09-03
ITMI960382A1 (it) 1997-08-28
ITMI960382A0 (it) 1996-02-28
US5702620A (en) 1997-12-30

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0001 Granted