IT1243465B - Elemento di supporto per una piastra di silicio da utilizzarsi come componente in circuiti elettrici ed elettronici, avente un buon isolamento termico ed elettrico - Google Patents
Elemento di supporto per una piastra di silicio da utilizzarsi come componente in circuiti elettrici ed elettronici, avente un buon isolamento termico ed elettricoInfo
- Publication number
- IT1243465B IT1243465B IT02113790A IT2113790A IT1243465B IT 1243465 B IT1243465 B IT 1243465B IT 02113790 A IT02113790 A IT 02113790A IT 2113790 A IT2113790 A IT 2113790A IT 1243465 B IT1243465 B IT 1243465B
- Authority
- IT
- Italy
- Prior art keywords
- support element
- electric
- component
- electronic circuits
- good thermal
- Prior art date
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract 3
- 229910052710 silicon Inorganic materials 0.000 title abstract 3
- 239000010703 silicon Substances 0.000 title abstract 3
- 238000009413 insulation Methods 0.000 title 1
- 239000011810 insulating material Substances 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000012777 electrically insulating material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Thermistors And Varistors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT02113790A IT1243465B (it) | 1990-07-31 | 1990-07-31 | Elemento di supporto per una piastra di silicio da utilizzarsi come componente in circuiti elettrici ed elettronici, avente un buon isolamento termico ed elettrico |
EP19910110624 EP0469299A3 (en) | 1990-07-31 | 1991-06-27 | Electrically well insulated support element for a silicon wafer used as a component in electrical and electronic circuits |
JP3207562A JPH04233743A (ja) | 1990-07-31 | 1991-07-24 | 電気及び電子回路部品として用いるシリコンウエハ用の十分に絶縁された支持体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT02113790A IT1243465B (it) | 1990-07-31 | 1990-07-31 | Elemento di supporto per una piastra di silicio da utilizzarsi come componente in circuiti elettrici ed elettronici, avente un buon isolamento termico ed elettrico |
Publications (3)
Publication Number | Publication Date |
---|---|
IT9021137A0 IT9021137A0 (it) | 1990-07-31 |
IT9021137A1 IT9021137A1 (it) | 1992-01-31 |
IT1243465B true IT1243465B (it) | 1994-06-15 |
Family
ID=11177298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT02113790A IT1243465B (it) | 1990-07-31 | 1990-07-31 | Elemento di supporto per una piastra di silicio da utilizzarsi come componente in circuiti elettrici ed elettronici, avente un buon isolamento termico ed elettrico |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0469299A3 (it) |
JP (1) | JPH04233743A (it) |
IT (1) | IT1243465B (it) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5793613A (en) * | 1995-12-29 | 1998-08-11 | Sgs-Thomson Microelectronics S.R.1. | Heat-dissipating and supporting structure for a plastic package with a fully insulated heat sink for an electronic device |
EP0782184A1 (en) * | 1995-12-29 | 1997-07-02 | STMicroelectronics S.r.l. | Heat dissipating and supporting structure for a package |
EP1075022A1 (en) | 1999-08-04 | 2001-02-07 | STMicroelectronics S.r.l. | Offset edges mold for plastic packaging of integrated semiconductor devices |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01268159A (ja) * | 1988-04-20 | 1989-10-25 | Nec Corp | 樹脂封止半導体装置及び成型用金型 |
-
1990
- 1990-07-31 IT IT02113790A patent/IT1243465B/it active IP Right Grant
-
1991
- 1991-06-27 EP EP19910110624 patent/EP0469299A3/en not_active Withdrawn
- 1991-07-24 JP JP3207562A patent/JPH04233743A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
IT9021137A1 (it) | 1992-01-31 |
EP0469299A3 (en) | 1993-03-17 |
IT9021137A0 (it) | 1990-07-31 |
JPH04233743A (ja) | 1992-08-21 |
EP0469299A2 (en) | 1992-02-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted |