IT1243465B - Elemento di supporto per una piastra di silicio da utilizzarsi come componente in circuiti elettrici ed elettronici, avente un buon isolamento termico ed elettrico - Google Patents

Elemento di supporto per una piastra di silicio da utilizzarsi come componente in circuiti elettrici ed elettronici, avente un buon isolamento termico ed elettrico

Info

Publication number
IT1243465B
IT1243465B IT02113790A IT2113790A IT1243465B IT 1243465 B IT1243465 B IT 1243465B IT 02113790 A IT02113790 A IT 02113790A IT 2113790 A IT2113790 A IT 2113790A IT 1243465 B IT1243465 B IT 1243465B
Authority
IT
Italy
Prior art keywords
support element
electric
component
electronic circuits
good thermal
Prior art date
Application number
IT02113790A
Other languages
English (en)
Other versions
IT9021137A1 (it
IT9021137A0 (it
Inventor
Mario Bassani
Renato Acquati
Original Assignee
Sgs Thomson Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Thomson Microelectronics filed Critical Sgs Thomson Microelectronics
Priority to IT02113790A priority Critical patent/IT1243465B/it
Publication of IT9021137A0 publication Critical patent/IT9021137A0/it
Priority to EP19910110624 priority patent/EP0469299A3/en
Priority to JP3207562A priority patent/JPH04233743A/ja
Publication of IT9021137A1 publication Critical patent/IT9021137A1/it
Application granted granted Critical
Publication of IT1243465B publication Critical patent/IT1243465B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IT02113790A 1990-07-31 1990-07-31 Elemento di supporto per una piastra di silicio da utilizzarsi come componente in circuiti elettrici ed elettronici, avente un buon isolamento termico ed elettrico IT1243465B (it)

Priority Applications (3)

Application Number Priority Date Filing Date Title
IT02113790A IT1243465B (it) 1990-07-31 1990-07-31 Elemento di supporto per una piastra di silicio da utilizzarsi come componente in circuiti elettrici ed elettronici, avente un buon isolamento termico ed elettrico
EP19910110624 EP0469299A3 (en) 1990-07-31 1991-06-27 Electrically well insulated support element for a silicon wafer used as a component in electrical and electronic circuits
JP3207562A JPH04233743A (ja) 1990-07-31 1991-07-24 電気及び電子回路部品として用いるシリコンウエハ用の十分に絶縁された支持体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT02113790A IT1243465B (it) 1990-07-31 1990-07-31 Elemento di supporto per una piastra di silicio da utilizzarsi come componente in circuiti elettrici ed elettronici, avente un buon isolamento termico ed elettrico

Publications (3)

Publication Number Publication Date
IT9021137A0 IT9021137A0 (it) 1990-07-31
IT9021137A1 IT9021137A1 (it) 1992-01-31
IT1243465B true IT1243465B (it) 1994-06-15

Family

ID=11177298

Family Applications (1)

Application Number Title Priority Date Filing Date
IT02113790A IT1243465B (it) 1990-07-31 1990-07-31 Elemento di supporto per una piastra di silicio da utilizzarsi come componente in circuiti elettrici ed elettronici, avente un buon isolamento termico ed elettrico

Country Status (3)

Country Link
EP (1) EP0469299A3 (it)
JP (1) JPH04233743A (it)
IT (1) IT1243465B (it)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5793613A (en) * 1995-12-29 1998-08-11 Sgs-Thomson Microelectronics S.R.1. Heat-dissipating and supporting structure for a plastic package with a fully insulated heat sink for an electronic device
EP0782184A1 (en) * 1995-12-29 1997-07-02 STMicroelectronics S.r.l. Heat dissipating and supporting structure for a package
EP1075022A1 (en) 1999-08-04 2001-02-07 STMicroelectronics S.r.l. Offset edges mold for plastic packaging of integrated semiconductor devices

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01268159A (ja) * 1988-04-20 1989-10-25 Nec Corp 樹脂封止半導体装置及び成型用金型

Also Published As

Publication number Publication date
IT9021137A1 (it) 1992-01-31
EP0469299A3 (en) 1993-03-17
IT9021137A0 (it) 1990-07-31
JPH04233743A (ja) 1992-08-21
EP0469299A2 (en) 1992-02-05

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Legal Events

Date Code Title Description
0001 Granted