IT1235641B - Perfezionamenti in, o relativi a strutture ibride - Google Patents

Perfezionamenti in, o relativi a strutture ibride

Info

Publication number
IT1235641B
IT1235641B IT8720854A IT2085487A IT1235641B IT 1235641 B IT1235641 B IT 1235641B IT 8720854 A IT8720854 A IT 8720854A IT 2085487 A IT2085487 A IT 2085487A IT 1235641 B IT1235641 B IT 1235641B
Authority
IT
Italy
Prior art keywords
hybrid structures
hybrid
structures
Prior art date
Application number
IT8720854A
Other languages
English (en)
Inventor
Roger William Whatmore
David John Pedder
Original Assignee
Plessey Overseas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Overseas filed Critical Plessey Overseas
Application granted granted Critical
Publication of IT1235641B publication Critical patent/IT1235641B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/06—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
IT8720854A 1985-09-05 1987-06-10 Perfezionamenti in, o relativi a strutture ibride IT1235641B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8522066A GB2252452B (en) 1985-09-05 1985-09-05 Improvements in or relating to hybrid structures

Publications (1)

Publication Number Publication Date
IT1235641B true IT1235641B (it) 1992-09-14

Family

ID=10584774

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8720854A IT1235641B (it) 1985-09-05 1987-06-10 Perfezionamenti in, o relativi a strutture ibride

Country Status (5)

Country Link
US (1) US5185613A (it)
DE (1) DE3644874A1 (it)
GB (1) GB2252452B (it)
IT (1) IT1235641B (it)
NL (1) NL8615004A (it)

Families Citing this family (31)

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GB8822011D0 (en) * 1988-09-20 2009-04-29 Qinetiq Ltd Radiation Filed Sensor
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
US5383512A (en) * 1993-01-27 1995-01-24 Midwest Research Institute Method for fabricating a substrate having spaced apart microcapillaries thereon
US5436453A (en) * 1993-10-15 1995-07-25 Lockheed Sanders, Inc. Dual mode energy detector having monolithic integrated circuit construction
DE4335232A1 (de) * 1993-10-15 1995-04-20 Daimler Benz Ag Anordnung zur Abstrahlung von Millimeterwellen
US5455589A (en) * 1994-01-07 1995-10-03 Millitech Corporation Compact microwave and millimeter wave radar
DE4409747A1 (de) * 1994-03-22 1995-09-28 Daimler Benz Ag Antennenarray
JP3141692B2 (ja) * 1994-08-11 2001-03-05 松下電器産業株式会社 ミリ波用検波器
US6008771A (en) * 1995-01-09 1999-12-28 Murata Manufacturing Co., Ltd. Antenna with nonradiative dielectric waveguide
EP0755092B1 (en) * 1995-07-17 2002-05-08 Dynex Semiconductor Limited Antenna arrangements
US5781163A (en) * 1995-08-28 1998-07-14 Datron/Transco, Inc. Low profile hemispherical lens antenna array on a ground plane
JP3257383B2 (ja) * 1996-01-18 2002-02-18 株式会社村田製作所 誘電体レンズ装置
JP3055456B2 (ja) * 1996-02-21 2000-06-26 株式会社村田製作所 アンテナ装置
WO1998035403A1 (de) * 1997-02-06 1998-08-13 Robert Bosch Gmbh Mikrowellen-antennenanordnung für ein kraftfahrzeug-radarsystem
JP3310617B2 (ja) * 1998-05-29 2002-08-05 シャープ株式会社 樹脂封止型半導体装置及びその製造方法
US6232931B1 (en) 1999-02-19 2001-05-15 The United States Of America As Represented By The Secretary Of The Navy Opto-electronically controlled frequency selective surface
SE514076C2 (sv) * 1999-04-23 2000-12-18 Ericsson Telefon Ab L M Förfarande och anordning relaterade till mikrovågslins
US6563464B2 (en) * 2001-03-19 2003-05-13 International Business Machines Corporation Integrated on-chip half-wave dipole antenna structure
JP4121860B2 (ja) * 2001-05-17 2008-07-23 サイプレス セミコンダクター コーポレーション ボールグリッドアレイアンテナ
US7369090B1 (en) * 2001-05-17 2008-05-06 Cypress Semiconductor Corp. Ball Grid Array package having integrated antenna pad
US7117588B2 (en) * 2002-04-23 2006-10-10 Ge Medical Systems Global Technology Company, Llc Method for assembling tiled detectors for ionizing radiation based image detection
US6624792B1 (en) 2002-05-16 2003-09-23 Titan Systems, Corporation Quad-ridged feed horn with two coplanar probes
US7180456B2 (en) * 2004-01-16 2007-02-20 Texas Instruments Incorporated Antennas supporting high density of wireless users in specific directions
US20100101639A1 (en) * 2008-10-24 2010-04-29 Epistar Corporation Optoelectronic device having a multi-layer solder and manufacturing method thereof
US8502735B1 (en) 2009-11-18 2013-08-06 Ball Aerospace & Technologies Corp. Antenna system with integrated circuit package integrated radiators
WO2012161612A1 (en) * 2011-05-23 2012-11-29 Autonomous Non-Commercial Organization "Research Institute "Sitronics Labs"" Electronically beam steerable antenna device
WO2013058673A1 (en) 2011-10-20 2013-04-25 Limited Liability Company "Radio Gigabit" System and method of relay communication with electronic beam adjustment
RU2530330C1 (ru) 2013-03-22 2014-10-10 Общество с ограниченной ответственностью "Радио Гигабит" Станция радиорелейной связи со сканирующей антенной
JP6298715B2 (ja) * 2014-05-30 2018-03-20 日立オートモティブシステムズ株式会社 アンテナ装置およびそれを用いた速度センサ
WO2018115372A1 (en) * 2016-12-23 2018-06-28 Iee International Electronics & Engineering S.A. High-resolution 3d radar wave imaging device
US11121302B2 (en) 2018-10-11 2021-09-14 SeeQC, Inc. System and method for superconducting multi-chip module

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5041839A (en) * 1981-03-11 1991-08-20 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Electromagnetic radiation sensors
DE3402659A1 (de) * 1984-01-26 1985-08-01 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Reflektorantenne fuer den betrieb in mehreren frequenzbereichen

Also Published As

Publication number Publication date
DE3644874A1 (de) 1992-11-12
US5185613A (en) 1993-02-09
NL8615004A (nl) 1992-10-01
GB2252452A (en) 1992-08-05
GB2252452B (en) 1992-12-16

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