IT1231307B - Disposizione per il raffreddamento bilaterale di semiconduttori con celle a disco. - Google Patents

Disposizione per il raffreddamento bilaterale di semiconduttori con celle a disco.

Info

Publication number
IT1231307B
IT1231307B IT8921321A IT2132189A IT1231307B IT 1231307 B IT1231307 B IT 1231307B IT 8921321 A IT8921321 A IT 8921321A IT 2132189 A IT2132189 A IT 2132189A IT 1231307 B IT1231307 B IT 1231307B
Authority
IT
Italy
Prior art keywords
arrangement
disc cell
cell semiconductors
bilateral cooling
bilateral
Prior art date
Application number
IT8921321A
Other languages
English (en)
Italian (it)
Other versions
IT8921321A0 (it
Inventor
Joachim Machen
Michael Mues
Karl Heinz Bezold
Original Assignee
Licentia Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Gmbh filed Critical Licentia Gmbh
Publication of IT8921321A0 publication Critical patent/IT8921321A0/it
Application granted granted Critical
Publication of IT1231307B publication Critical patent/IT1231307B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IT8921321A 1988-07-27 1989-07-26 Disposizione per il raffreddamento bilaterale di semiconduttori con celle a disco. IT1231307B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3825979A DE3825979A1 (de) 1988-07-27 1988-07-27 Anordnung zur kuehlung von verlustleistung abgebenden bauelementen

Publications (2)

Publication Number Publication Date
IT8921321A0 IT8921321A0 (it) 1989-07-26
IT1231307B true IT1231307B (it) 1991-11-28

Family

ID=6359934

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8921321A IT1231307B (it) 1988-07-27 1989-07-26 Disposizione per il raffreddamento bilaterale di semiconduttori con celle a disco.

Country Status (2)

Country Link
DE (1) DE3825979A1 (enExample)
IT (1) IT1231307B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19628545A1 (de) * 1996-07-16 1998-01-22 Abb Patent Gmbh Hochleistungs-Kühler für ein luftgekühltes Stromrichtergerät
EP0889524A3 (en) * 1997-06-30 1999-03-03 Sun Microsystems, Inc. Scalable and modular heat sink-heat pipe cooling system
JP4438133B2 (ja) * 1999-08-19 2010-03-24 シャープ株式会社 ヘテロ接合型バイポーラトランジスタおよびその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4887779A (enExample) * 1972-02-01 1973-11-17
JPS568238Y2 (enExample) * 1976-02-14 1981-02-23
US4449578A (en) * 1980-06-16 1984-05-22 Showa Aluminum Corporation Device for releasing heat
DE3617611A1 (de) * 1986-05-24 1987-11-26 Licentia Gmbh Thermisch leitende und elektrisch isolierende zwischenlage fuer aufbau und befestigung von halbleiterelementen und anordnung unter anwendung derartiger zwischenlagen

Also Published As

Publication number Publication date
IT8921321A0 (it) 1989-07-26
DE3825979C2 (enExample) 1991-11-28
DE3825979A1 (de) 1990-02-01

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19940726