IT1231307B - ARRANGEMENT FOR BILATERAL COOLING OF DISC CELL SEMICONDUCTORS. - Google Patents
ARRANGEMENT FOR BILATERAL COOLING OF DISC CELL SEMICONDUCTORS.Info
- Publication number
- IT1231307B IT1231307B IT8921321A IT2132189A IT1231307B IT 1231307 B IT1231307 B IT 1231307B IT 8921321 A IT8921321 A IT 8921321A IT 2132189 A IT2132189 A IT 2132189A IT 1231307 B IT1231307 B IT 1231307B
- Authority
- IT
- Italy
- Prior art keywords
- arrangement
- disc cell
- cell semiconductors
- bilateral cooling
- bilateral
- Prior art date
Links
- 230000002146 bilateral effect Effects 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3825979A DE3825979A1 (en) | 1988-07-27 | 1988-07-27 | Arrangement for cooling components which dissipate lost heat |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8921321A0 IT8921321A0 (en) | 1989-07-26 |
IT1231307B true IT1231307B (en) | 1991-11-28 |
Family
ID=6359934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT8921321A IT1231307B (en) | 1988-07-27 | 1989-07-26 | ARRANGEMENT FOR BILATERAL COOLING OF DISC CELL SEMICONDUCTORS. |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE3825979A1 (en) |
IT (1) | IT1231307B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19628545A1 (en) * | 1996-07-16 | 1998-01-22 | Abb Patent Gmbh | Intensive cooling device for air-cooled current regulator |
EP0889524A3 (en) * | 1997-06-30 | 1999-03-03 | Sun Microsystems, Inc. | Scalable and modular heat sink-heat pipe cooling system |
JP4438133B2 (en) | 1999-08-19 | 2010-03-24 | シャープ株式会社 | Heterojunction bipolar transistor and manufacturing method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2204589A1 (en) * | 1972-02-01 | 1973-08-16 | Siemens Ag | COOLING ARRANGEMENT FOR FLAT SEMICONDUCTOR COMPONENTS |
JPS568238Y2 (en) * | 1976-02-14 | 1981-02-23 | ||
US4449578A (en) * | 1980-06-16 | 1984-05-22 | Showa Aluminum Corporation | Device for releasing heat |
DE3617611A1 (en) * | 1986-05-24 | 1987-11-26 | Licentia Gmbh | Thermally conductive and electrically insulating interlayer for the build-up and fixing of semiconductor elements, and arrangement using such interlayers |
-
1988
- 1988-07-27 DE DE3825979A patent/DE3825979A1/en active Granted
-
1989
- 1989-07-26 IT IT8921321A patent/IT1231307B/en active
Also Published As
Publication number | Publication date |
---|---|
DE3825979A1 (en) | 1990-02-01 |
IT8921321A0 (en) | 1989-07-26 |
DE3825979C2 (en) | 1991-11-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19940726 |