IT1171456B - Soluzione di placcatura con lega palladio/nichel - Google Patents

Soluzione di placcatura con lega palladio/nichel

Info

Publication number
IT1171456B
IT1171456B IT49096/81A IT4909681A IT1171456B IT 1171456 B IT1171456 B IT 1171456B IT 49096/81 A IT49096/81 A IT 49096/81A IT 4909681 A IT4909681 A IT 4909681A IT 1171456 B IT1171456 B IT 1171456B
Authority
IT
Italy
Prior art keywords
palladium
plating solution
nickel alloy
nickel
alloy
Prior art date
Application number
IT49096/81A
Other languages
English (en)
Other versions
IT8149096A0 (it
Inventor
Masao Kanai
Hirotomo Koshiro
Original Assignee
Suwa Seikosha Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suwa Seikosha Kk filed Critical Suwa Seikosha Kk
Publication of IT8149096A0 publication Critical patent/IT8149096A0/it
Application granted granted Critical
Publication of IT1171456B publication Critical patent/IT1171456B/it

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/16Regeneration of process solutions
    • C25D21/18Regeneration of process solutions of electrolytes
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/562Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/567Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
IT49096/81A 1980-09-19 1981-08-12 Soluzione di placcatura con lega palladio/nichel IT1171456B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55130362A JPS5929118B2 (ja) 1980-09-19 1980-09-19 パラジウム・ニツケル合金メツキ液

Publications (2)

Publication Number Publication Date
IT8149096A0 IT8149096A0 (it) 1981-08-12
IT1171456B true IT1171456B (it) 1987-06-10

Family

ID=15032554

Family Applications (1)

Application Number Title Priority Date Filing Date
IT49096/81A IT1171456B (it) 1980-09-19 1981-08-12 Soluzione di placcatura con lega palladio/nichel

Country Status (6)

Country Link
US (1) US4428802A (it)
JP (1) JPS5929118B2 (it)
CH (1) CH647269A5 (it)
DE (1) DE3135595A1 (it)
FR (1) FR2490684B1 (it)
IT (1) IT1171456B (it)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60248892A (ja) * 1984-05-24 1985-12-09 Electroplating Eng Of Japan Co 高純度パラジウム・ニッケル合金メッキ液及び方法
US4628165A (en) * 1985-09-11 1986-12-09 Learonal, Inc. Electrical contacts and methods of making contacts by electrodeposition
JPS62134317U (it) * 1986-02-19 1987-08-24
US4778574A (en) * 1987-09-14 1988-10-18 American Chemical & Refining Company, Inc. Amine-containing bath for electroplating palladium
US6540154B1 (en) * 1991-04-24 2003-04-01 Aerogen, Inc. Systems and methods for controlling fluid feed to an aerosol generator
US7628339B2 (en) 1991-04-24 2009-12-08 Novartis Pharma Ag Systems and methods for controlling fluid feed to an aerosol generator
US5758637A (en) 1995-08-31 1998-06-02 Aerogen, Inc. Liquid dispensing apparatus and methods
US6085740A (en) 1996-02-21 2000-07-11 Aerogen, Inc. Liquid dispensing apparatus and methods
US20020121274A1 (en) * 1995-04-05 2002-09-05 Aerogen, Inc. Laminated electroformed aperture plate
US5976344A (en) * 1996-05-10 1999-11-02 Lucent Technologies Inc. Composition for electroplating palladium alloys and electroplating process using that composition
US6235177B1 (en) * 1999-09-09 2001-05-22 Aerogen, Inc. Method for the construction of an aperture plate for dispensing liquid droplets
MXPA02010884A (es) * 2000-05-05 2003-03-27 Aerogen Ireland Ltd Aparato y metodo para el suministro de medicamentos al sistema respiratorio.
US7971588B2 (en) * 2000-05-05 2011-07-05 Novartis Ag Methods and systems for operating an aerosol generator
US7100600B2 (en) 2001-03-20 2006-09-05 Aerogen, Inc. Fluid filled ampoules and methods for their use in aerosolizers
US8336545B2 (en) * 2000-05-05 2012-12-25 Novartis Pharma Ag Methods and systems for operating an aerosol generator
US6948491B2 (en) * 2001-03-20 2005-09-27 Aerogen, Inc. Convertible fluid feed system with comformable reservoir and methods
US7600511B2 (en) * 2001-11-01 2009-10-13 Novartis Pharma Ag Apparatus and methods for delivery of medicament to a respiratory system
US6732944B2 (en) * 2001-05-02 2004-05-11 Aerogen, Inc. Base isolated nebulizing device and methods
US7677467B2 (en) * 2002-01-07 2010-03-16 Novartis Pharma Ag Methods and devices for aerosolizing medicament
US20050205089A1 (en) * 2002-01-07 2005-09-22 Aerogen, Inc. Methods and devices for aerosolizing medicament
US7360536B2 (en) 2002-01-07 2008-04-22 Aerogen, Inc. Devices and methods for nebulizing fluids for inhalation
JP4761709B2 (ja) * 2002-01-15 2011-08-31 エアロジェン,インコーポレイテッド エアロゾル発生器を作動するための方法およびシステム
US20070044792A1 (en) * 2005-08-30 2007-03-01 Aerogen, Inc. Aerosol generators with enhanced corrosion resistance
ES2572770T3 (es) * 2002-05-20 2016-06-02 Novartis Ag Aparato para proporcionar pulverización para tratamiento médico y métodos
US8616195B2 (en) * 2003-07-18 2013-12-31 Novartis Ag Nebuliser for the production of aerosolized medication
US7946291B2 (en) 2004-04-20 2011-05-24 Novartis Ag Ventilation systems and methods employing aerosol generators
JP5175090B2 (ja) * 2004-04-20 2013-04-03 ノバルティス アーゲー 従圧式呼吸システム
US7290541B2 (en) * 2004-04-20 2007-11-06 Aerogen, Inc. Aerosol delivery apparatus and method for pressure-assisted breathing systems
US7267121B2 (en) * 2004-04-20 2007-09-11 Aerogen, Inc. Aerosol delivery apparatus and method for pressure-assisted breathing systems
US9108211B2 (en) * 2005-05-25 2015-08-18 Nektar Therapeutics Vibration systems and methods
US20110147225A1 (en) 2007-07-20 2011-06-23 Rohm And Haas Electronic Materials Llc High speed method for plating palladium and palladium alloys
CN101348928B (zh) * 2007-07-20 2012-07-04 罗门哈斯电子材料有限公司 镀钯及镀钯合金之高速方法
DE102009023124A1 (de) * 2008-05-28 2009-12-03 Ipt International Plating Technologies Gmbh Verfahren zur galvanischen Kupferbeschichtung und Vorrichtung zur Durchführung eines solchen Verfahrens
EP4067539A1 (en) 2021-03-31 2022-10-05 Coventya GmbH Electroplating device and process for depositing nickel alloys with a solid replenisher

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH572989A5 (it) * 1973-04-27 1976-02-27 Oxy Metal Industries Corp

Also Published As

Publication number Publication date
DE3135595A1 (de) 1982-05-13
JPS5929118B2 (ja) 1984-07-18
IT8149096A0 (it) 1981-08-12
JPS5754296A (en) 1982-03-31
FR2490684B1 (fr) 1987-07-17
CH647269A5 (de) 1985-01-15
FR2490684A1 (fr) 1982-03-26
US4428802A (en) 1984-01-31

Similar Documents

Publication Publication Date Title
IT1171456B (it) Soluzione di placcatura con lega palladio/nichel
IT8123952A0 (it) Placcatura di leghe non elettrolitica.
IT1156109B (it) Preparazione di complessi del nichel zerovalente
NO781476L (no) Nikkel-legering.
IT1110984B (it) Lega di nichel resistente alla corrosione
JPS52141428A (en) Electroless nickel plating
DE3871018D1 (de) Legierung auf nickelbasis.
IT1160481B (it) Lega di nichel resistente all'ossidazione
NL191124C (nl) Corrosievaste nikkellegering.
IT1101246B (it) Lega di nichel resistente alla corrosione
NO872215D0 (no) Nikkellegering.
IT1055872B (it) Bagno per la deposizione galvanica di leghe di palladio nichel
NO823950L (no) Nikkelsuperlegering.
SE7806618L (sv) Legeringspletering
SE7805708L (sv) Nickellegering
GB1541118A (en) Nickel plating
IT1171616B (it) Procedimento di elettrodeposizione di oro su sostrati ricoperti con elettrodeposizione di nickel
IT1087521B (it) Procedimento per la preparazione di oggetti in lega di nichel per la placcatura elettrolitica
GB1547028A (en) Electroless gold plating baths
IT8219992A0 (it) Bagno per la deposizione galvanica di una lega palladio/nichel.
IT1150625B (it) Bagno per la deposizione galvanica di una lega palladio/nichel
JPS5426247A (en) Golddpalladium alloy plating solution
IT8319086A0 (it) Lega di rame e nichel adatta alla saldatura e resistente alla corrosione.
JPS52124428A (en) Nonnelectrolytic gold plating bath
IT8219991A0 (it) Bagno per la deposizione galvanica di una lega palladio/nichel.