IT1164527B - Processo di fabbricazione di circuiti integrati - Google Patents

Processo di fabbricazione di circuiti integrati

Info

Publication number
IT1164527B
IT1164527B IT27744/79A IT2774479A IT1164527B IT 1164527 B IT1164527 B IT 1164527B IT 27744/79 A IT27744/79 A IT 27744/79A IT 2774479 A IT2774479 A IT 2774479A IT 1164527 B IT1164527 B IT 1164527B
Authority
IT
Italy
Prior art keywords
manufacturing process
integrated circuits
circuits manufacturing
integrated
manufacturing
Prior art date
Application number
IT27744/79A
Other languages
English (en)
Other versions
IT7927744A0 (it
Inventor
Billy Lee Crowder
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of IT7927744A0 publication Critical patent/IT7927744A0/it
Application granted granted Critical
Publication of IT1164527B publication Critical patent/IT1164527B/it

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/26506Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
    • H01L21/26513Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electrodes Of Semiconductors (AREA)
IT27744/79A 1978-12-06 1979-11-30 Processo di fabbricazione di circuiti integrati IT1164527B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US96692478A 1978-12-06 1978-12-06

Publications (2)

Publication Number Publication Date
IT7927744A0 IT7927744A0 (it) 1979-11-30
IT1164527B true IT1164527B (it) 1987-04-15

Family

ID=25512059

Family Applications (1)

Application Number Title Priority Date Filing Date
IT27744/79A IT1164527B (it) 1978-12-06 1979-11-30 Processo di fabbricazione di circuiti integrati

Country Status (5)

Country Link
EP (1) EP0012324B1 (it)
JP (1) JPS5580219A (it)
CA (1) CA1120607A (it)
DE (1) DE2962159D1 (it)
IT (1) IT1164527B (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0443297B1 (en) * 1990-02-20 1999-09-01 STMicroelectronics S.r.l. Metal-semiconductor ohmic contact forming process
US5342793A (en) * 1990-02-20 1994-08-30 Sgs-Thomson Microelectronics, S.R.L. Process for obtaining multi-layer metallization of the back of a semiconductor substrate
DE69033234T2 (de) * 1990-02-20 2000-02-03 Stmicroelectronics S.R.L., Agrate Brianza Verfahren zur mehrschichtigen Metallisierung der Rückseite einer Halbleiterscheibe
JP2004335899A (ja) * 2003-05-09 2004-11-25 Denso Corp 炭化珪素半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1486265A (en) * 1973-10-17 1977-09-21 Hitachi Ltd Method for producing an amorphous state of a solid material
JPS51111061A (en) * 1975-03-26 1976-10-01 Hitachi Ltd Electrode forming method
US4135292A (en) * 1976-07-06 1979-01-23 Intersil, Inc. Integrated circuit contact and method for fabricating the same
JPS5394177A (en) * 1977-01-28 1978-08-17 Nippon Precision Circuits Semiconductor and method of producing same

Also Published As

Publication number Publication date
JPS5580219A (en) 1980-06-17
EP0012324B1 (fr) 1982-02-17
DE2962159D1 (en) 1982-03-25
CA1120607A (en) 1982-03-23
IT7927744A0 (it) 1979-11-30
EP0012324A1 (fr) 1980-06-25

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