IT1090776B - Additivo per un procedimento per fezionato di placcatura elettrolitica - Google Patents

Additivo per un procedimento per fezionato di placcatura elettrolitica

Info

Publication number
IT1090776B
IT1090776B IT09588/77A IT958877A IT1090776B IT 1090776 B IT1090776 B IT 1090776B IT 09588/77 A IT09588/77 A IT 09588/77A IT 958877 A IT958877 A IT 958877A IT 1090776 B IT1090776 B IT 1090776B
Authority
IT
Italy
Prior art keywords
additive
procedure
electrolytic plating
plating section
section
Prior art date
Application number
IT09588/77A
Other languages
English (en)
Italian (it)
Inventor
Edward O Paul Harbulak
Original Assignee
M & T Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/729,074 external-priority patent/US4069112A/en
Application filed by M & T Chemicals Inc filed Critical M & T Chemicals Inc
Application granted granted Critical
Publication of IT1090776B publication Critical patent/IT1090776B/it

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/18Heterocyclic compounds
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/562Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
IT09588/77A 1976-10-04 1977-10-03 Additivo per un procedimento per fezionato di placcatura elettrolitica IT1090776B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/729,074 US4069112A (en) 1976-06-18 1976-10-04 Electroplating of nickel, cobalt, mutual alloys thereof or ternary alloys thereof with iron

Publications (1)

Publication Number Publication Date
IT1090776B true IT1090776B (it) 1985-06-26

Family

ID=24929474

Family Applications (1)

Application Number Title Priority Date Filing Date
IT09588/77A IT1090776B (it) 1976-10-04 1977-10-03 Additivo per un procedimento per fezionato di placcatura elettrolitica

Country Status (19)

Country Link
JP (1) JPS6025513B2 (de)
AR (1) AR218268A1 (de)
AU (1) AU508254B2 (de)
BE (1) BE858817A (de)
BR (1) BR7706445A (de)
CA (1) CA1086679A (de)
DE (1) DE2743847A1 (de)
DK (1) DK152593C (de)
ES (1) ES462745A1 (de)
FR (1) FR2366381A1 (de)
GB (1) GB1583216A (de)
IT (1) IT1090776B (de)
MX (1) MX4671E (de)
NL (1) NL7710872A (de)
NO (1) NO150214C (de)
NZ (1) NZ185277A (de)
PL (1) PL201265A1 (de)
SE (1) SE7711034L (de)
ZA (1) ZA775315B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6372118B1 (en) * 1999-04-12 2002-04-16 Wen Hua Hui Ni-Fe-Co electroplating bath
US6736954B2 (en) * 2001-10-02 2004-05-18 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
WO2019013762A1 (en) 2017-07-11 2019-01-17 Atotech Deutschland Gmbh AQUEOUS COMPOSITION FOR DEPOSITION OF COBALT DEPOSITION AND METHOD FOR ELECTROLYTIC DEPOSITION OF SUCH DEPOSIT
WO2019013761A1 (en) 2017-07-11 2019-01-17 Atotech Deutschland Gmbh AQUEOUS COMPOSITION FOR DEPOSITION OF COBALT DEPOSITION AND METHOD FOR ELECTROLYTIC DEPOSITION OF SUCH A DEPOSITION
CN116356389A (zh) * 2023-06-01 2023-06-30 中石油深圳新能源研究院有限公司 合金镀层的制备方法、合金镀层、电池和电池组件

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE205781C1 (de) *
US3376207A (en) * 1965-05-17 1968-04-02 Patent Serm Ag Electrodeposition of nickel and electrolytes therefor
US3697392A (en) * 1970-07-02 1972-10-10 Allied Res Prod Inc Electrodeposition of nickel
US3709798A (en) * 1971-10-13 1973-01-09 Richardson Chemical Co Electrodeposition of nickel
US3804726A (en) * 1973-04-23 1974-04-16 M & T Chemicals Inc Electroplating processes and compositions

Also Published As

Publication number Publication date
NO773316L (no) 1978-04-05
GB1583216A (en) 1981-01-21
DE2743847A1 (de) 1978-04-06
ES462745A1 (es) 1978-05-16
CA1086679A (en) 1980-09-30
JPS6025513B2 (ja) 1985-06-18
ZA775315B (en) 1978-07-26
NO150214B (no) 1984-05-28
AR218268A1 (es) 1980-05-30
DK437077A (da) 1978-04-05
DK152593C (da) 1988-09-05
FR2366381A1 (fr) 1978-04-28
MX4671E (es) 1982-07-23
NZ185277A (en) 1980-02-21
NO150214C (no) 1984-09-05
PL201265A1 (de) 1978-06-05
BR7706445A (pt) 1978-07-18
DK152593B (da) 1988-03-21
JPS5345634A (en) 1978-04-24
BE858817A (fr) 1978-01-16
AU2825377A (en) 1979-03-01
SE7711034L (sv) 1978-04-05
DE2743847C2 (de) 1987-07-30
NL7710872A (nl) 1978-04-06
AU508254B2 (en) 1980-03-13

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