IT1064921B - Resine epossidiche procedimenti per la loro preparazione e supporti che le contengono - Google Patents

Resine epossidiche procedimenti per la loro preparazione e supporti che le contengono

Info

Publication number
IT1064921B
IT1064921B IT7626251A IT2625176A IT1064921B IT 1064921 B IT1064921 B IT 1064921B IT 7626251 A IT7626251 A IT 7626251A IT 2625176 A IT2625176 A IT 2625176A IT 1064921 B IT1064921 B IT 1064921B
Authority
IT
Italy
Prior art keywords
procedures
preparation
epoxy resins
supports containing
supports
Prior art date
Application number
IT7626251A
Other languages
English (en)
Original Assignee
Ciba Geigy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy filed Critical Ciba Geigy
Application granted granted Critical
Publication of IT1064921B publication Critical patent/IT1064921B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S522/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S522/904—Monomer or polymer contains initiating group
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
IT7626251A 1975-08-13 1976-08-12 Resine epossidiche procedimenti per la loro preparazione e supporti che le contengono IT1064921B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB33678/75A GB1512814A (en) 1975-08-13 1975-08-13 Epoxide resins

Publications (1)

Publication Number Publication Date
IT1064921B true IT1064921B (it) 1985-02-25

Family

ID=10356032

Family Applications (1)

Application Number Title Priority Date Filing Date
IT7626251A IT1064921B (it) 1975-08-13 1976-08-12 Resine epossidiche procedimenti per la loro preparazione e supporti che le contengono

Country Status (9)

Country Link
US (1) US4074008A (it)
JP (1) JPS5237996A (it)
CA (1) CA1105193A (it)
CH (1) CH626643A5 (it)
DE (1) DE2635929A1 (it)
FR (1) FR2320961A1 (it)
GB (1) GB1512814A (it)
IT (1) IT1064921B (it)
NL (1) NL7608979A (it)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54105774A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming pattern on thin film hybrid integrated circuit
US4171974A (en) * 1978-02-15 1979-10-23 Polychrome Corporation Aqueous alkali developable negative working lithographic printing plates
US4284574A (en) * 1979-06-15 1981-08-18 Ciba-Geigy Corporation Diglycidyl ethers of di-secondary alcohols, their preparation, and curable compositions containing them
US4286047A (en) * 1979-07-25 1981-08-25 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesive susceptible to ultraviolet light-induced detackification
US4390615A (en) 1979-11-05 1983-06-28 Courtney Robert W Coating compositions
US4292396A (en) * 1980-03-03 1981-09-29 Western Litho Plate & Supply Co. Method for improving the press life of a lithographic image having an outer layer comprising an epoxy resin and article produced by method
US4451122A (en) * 1980-12-29 1984-05-29 Beckman Instruments, Inc. Multicompartment electro-optic display device
DE3265242D1 (en) * 1981-09-17 1985-09-12 Ciba Geigy Ag Light-sensitive coating agent and its use in protection purposes
US4479983A (en) * 1983-01-07 1984-10-30 International Business Machines Corporation Method and composition for applying coatings on printed circuit boards
US4546067A (en) * 1983-01-26 1985-10-08 Ciba Geigy Corporation Image production utilizing multifunctional light sensitive compounds
GB8307220D0 (en) * 1983-03-16 1983-04-20 Ciba Geigy Ag Production of images
GB8418038D0 (en) * 1984-07-16 1984-08-22 Edgealpha Ltd Lining of pipelines/passageways
EP0204292B1 (de) * 1985-06-05 1991-05-29 Siemens Aktiengesellschaft Verfahren zum Herstellen von gedruckten Schaltungen unter Verwendung eines durch Strahlung vernetzenden Fotopolymersystems
GB2213487B (en) * 1987-12-08 1992-01-08 Kansai Paint Co Ltd Method of forming a cured coating film
US5070002A (en) * 1988-09-13 1991-12-03 Amp-Akzo Corporation Photoimageable permanent resist
US5178988A (en) * 1988-09-13 1993-01-12 Amp-Akzo Corporation Photoimageable permanent resist
US5218061A (en) * 1990-09-17 1993-06-08 Nippon Kayaku Kabushiki Kaisha Partially post-glycidylated epoxy resin, epoxy resin composition and cured product thereof
JPH06258823A (ja) * 1993-03-05 1994-09-16 Sanyo Chem Ind Ltd 感光性樹脂
TW268011B (it) * 1993-07-02 1996-01-11 Ciba Geigy
TW270123B (it) * 1993-07-02 1996-02-11 Ciba Geigy
TW290583B (it) * 1993-10-14 1996-11-11 Alpha Metals Ltd
WO1998005697A1 (en) * 1996-08-06 1998-02-12 Ciba Specialty Chemicals Holding Inc. Polyglycidyl ethers of secondary alcohols
KR100337594B1 (ko) * 1999-12-28 2002-05-23 조정원 광기능성 에폭시 화합물 함유 액정 디스플레이패널 봉지제
JP4637221B2 (ja) * 2007-09-28 2011-02-23 富士フイルム株式会社 ポジ型感光性樹脂組成物及びそれを用いた硬化膜形成方法
TWI518458B (zh) 2008-03-28 2016-01-21 富士軟片股份有限公司 正型感光性樹脂組成物及使用它的硬化膜形成方法
NL1039737C2 (en) 2012-07-17 2014-01-20 Hovis Internat B V Mehod for the manufacture of a sorbic acid-based polymer network.
US20200045425A1 (en) * 2018-03-07 2020-02-06 USound GmbH Method of manufacturing a mems printed circuit board module and/or sound transducer assembly

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3885060A (en) * 1968-08-23 1975-05-20 Hitachi Ltd Production of insolubilized organic polymers
CH576739A5 (it) * 1972-08-25 1976-06-15 Ciba Geigy Ag
GB1464287A (en) * 1974-02-22 1977-02-09 Ciba Geigy Ag Polymerisable esters

Also Published As

Publication number Publication date
FR2320961B1 (it) 1978-05-05
CH626643A5 (it) 1981-11-30
US4074008A (en) 1978-02-14
FR2320961A1 (fr) 1977-03-11
GB1512814A (en) 1978-06-01
JPS5237996A (en) 1977-03-24
NL7608979A (nl) 1977-02-15
DE2635929A1 (de) 1977-03-03
CA1105193A (en) 1981-07-14

Similar Documents

Publication Publication Date Title
IT1064921B (it) Resine epossidiche procedimenti per la loro preparazione e supporti che le contengono
IT1082105B (it) Miscele di resine epossidiche e procedimento per la loro preparazione
IT1080400B (it) Miscele di resine epossidiche e procedimento per la loro preparazione
DK498376A (da) Adhesivpreparat
IT1048827B (it) Resine idrocarburiche e procedimento per la loro preparazione
FR2320755A1 (fr) Composes polycycliques
JPS51148768A (en) Manufacture of resinnrich epoxy preepreg
IT1070219B (it) Induritore per resine epossidische e procedimento per la sua preparazione
IT1063836B (it) Resine epossidiche modificate con colofonia
IT1041193B (it) Perfezionamenti nei procedimenti per la fabbricazione di dispositivi a semiconduttor
IT1051400B (it) Procedimento perfezionato per la preparazione di resine epossidiche liquide
BE842352A (fr) Composes polycycliques
IT1043117B (it) Resine antiurto e metodo per la loro areparazione
GB1550937A (en) Epoxy resin compositions
IT1034704B (it) Procedimento di preparazione di resine epossidiche flessibili
JPS5229900A (en) Phosphorrcontaining epoxide resin and process for preparing same
BE837852A (fr) Amines cycloaliphatiques
IT1061527B (it) Processo per la preparazione di laminati di resine epossidiche
IT1064623B (it) Agente di indurimento per resine epossidiche e procedimento per la sua preparazione
IT1057690B (it) Procedimento per la preparazione di resine terpene fenolo
IT1051397B (it) Procedimento per la preparazione di resine novolacche epossidate
IT1056833B (it) Procedimento per la preparazione di resine modificate di tipo epossiacriliche
BE846353A (fr) Resines uree-formaldehyde
IT1086595B (it) Preparazione di epossidi
FR2303036A1 (fr) Polyetherurees et polyetherthiourees convenant pour le durcissement des resines epoxydes