FR2320961A1 - Resines epoxydiques photopolymerisables - Google Patents

Resines epoxydiques photopolymerisables

Info

Publication number
FR2320961A1
FR2320961A1 FR7624610A FR7624610A FR2320961A1 FR 2320961 A1 FR2320961 A1 FR 2320961A1 FR 7624610 A FR7624610 A FR 7624610A FR 7624610 A FR7624610 A FR 7624610A FR 2320961 A1 FR2320961 A1 FR 2320961A1
Authority
FR
France
Prior art keywords
photopolymerisable
epoxidic resins
epoxidic
resins
photopolymerisable epoxidic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7624610A
Other languages
English (en)
Other versions
FR2320961B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novartis AG
Original Assignee
Ciba Geigy AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy AG filed Critical Ciba Geigy AG
Publication of FR2320961A1 publication Critical patent/FR2320961A1/fr
Application granted granted Critical
Publication of FR2320961B1 publication Critical patent/FR2320961B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S522/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S522/904—Monomer or polymer contains initiating group
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
FR7624610A 1975-08-13 1976-08-12 Resines epoxydiques photopolymerisables Granted FR2320961A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB33678/75A GB1512814A (en) 1975-08-13 1975-08-13 Epoxide resins

Publications (2)

Publication Number Publication Date
FR2320961A1 true FR2320961A1 (fr) 1977-03-11
FR2320961B1 FR2320961B1 (fr) 1978-05-05

Family

ID=10356032

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7624610A Granted FR2320961A1 (fr) 1975-08-13 1976-08-12 Resines epoxydiques photopolymerisables

Country Status (9)

Country Link
US (1) US4074008A (fr)
JP (1) JPS5237996A (fr)
CA (1) CA1105193A (fr)
CH (1) CH626643A5 (fr)
DE (1) DE2635929A1 (fr)
FR (1) FR2320961A1 (fr)
GB (1) GB1512814A (fr)
IT (1) IT1064921B (fr)
NL (1) NL7608979A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0477724A2 (fr) * 1990-09-17 1992-04-01 Nippon Kayaku Kabushiki Kaisha Résine epoxyde, composition de résine époxyde et objets durcis qui en sont préparés
EP0632078A1 (fr) * 1993-07-02 1995-01-04 Ciba-Geigy Ag Résines époxyacrylates

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54105774A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming pattern on thin film hybrid integrated circuit
US4171974A (en) * 1978-02-15 1979-10-23 Polychrome Corporation Aqueous alkali developable negative working lithographic printing plates
US4284574A (en) * 1979-06-15 1981-08-18 Ciba-Geigy Corporation Diglycidyl ethers of di-secondary alcohols, their preparation, and curable compositions containing them
US4286047A (en) * 1979-07-25 1981-08-25 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesive susceptible to ultraviolet light-induced detackification
US4390615A (en) 1979-11-05 1983-06-28 Courtney Robert W Coating compositions
US4292396A (en) * 1980-03-03 1981-09-29 Western Litho Plate & Supply Co. Method for improving the press life of a lithographic image having an outer layer comprising an epoxy resin and article produced by method
US4451122A (en) * 1980-12-29 1984-05-29 Beckman Instruments, Inc. Multicompartment electro-optic display device
DE3265242D1 (en) * 1981-09-17 1985-09-12 Ciba Geigy Ag Light-sensitive coating agent and its use in protection purposes
US4479983A (en) * 1983-01-07 1984-10-30 International Business Machines Corporation Method and composition for applying coatings on printed circuit boards
US4546067A (en) * 1983-01-26 1985-10-08 Ciba Geigy Corporation Image production utilizing multifunctional light sensitive compounds
GB8307220D0 (en) * 1983-03-16 1983-04-20 Ciba Geigy Ag Production of images
GB8418038D0 (en) * 1984-07-16 1984-08-22 Edgealpha Ltd Lining of pipelines/passageways
DE3679453D1 (de) * 1985-06-05 1991-07-04 Siemens Ag Verfahren zum herstellen von gedruckten schaltungen unter verwendung eines durch strahlung vernetzenden fotopolymersystems.
GB2213487B (en) * 1987-12-08 1992-01-08 Kansai Paint Co Ltd Method of forming a cured coating film
US5178988A (en) * 1988-09-13 1993-01-12 Amp-Akzo Corporation Photoimageable permanent resist
US5070002A (en) * 1988-09-13 1991-12-03 Amp-Akzo Corporation Photoimageable permanent resist
JPH06258823A (ja) * 1993-03-05 1994-09-16 Sanyo Chem Ind Ltd 感光性樹脂
TW270123B (fr) 1993-07-02 1996-02-11 Ciba Geigy
TW290583B (fr) * 1993-10-14 1996-11-11 Alpha Metals Ltd
JP2000515531A (ja) * 1996-08-06 2000-11-21 チバ スペシャルティ ケミカルズ ホールディング インコーポレーテッド 第二アルコールのポリグリシジルエーテル
KR100337594B1 (ko) * 1999-12-28 2002-05-23 조정원 광기능성 에폭시 화합물 함유 액정 디스플레이패널 봉지제
JP4637221B2 (ja) * 2007-09-28 2011-02-23 富士フイルム株式会社 ポジ型感光性樹脂組成物及びそれを用いた硬化膜形成方法
TWI518458B (zh) 2008-03-28 2016-01-21 富士軟片股份有限公司 正型感光性樹脂組成物及使用它的硬化膜形成方法
NL1039737C2 (en) 2012-07-17 2014-01-20 Hovis Internat B V Mehod for the manufacture of a sorbic acid-based polymer network.
US20200045425A1 (en) * 2018-03-07 2020-02-06 USound GmbH Method of manufacturing a mems printed circuit board module and/or sound transducer assembly

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3885060A (en) * 1968-08-23 1975-05-20 Hitachi Ltd Production of insolubilized organic polymers
CH576739A5 (fr) * 1972-08-25 1976-06-15 Ciba Geigy Ag
GB1464287A (en) * 1974-02-22 1977-02-09 Ciba Geigy Ag Polymerisable esters

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0477724A2 (fr) * 1990-09-17 1992-04-01 Nippon Kayaku Kabushiki Kaisha Résine epoxyde, composition de résine époxyde et objets durcis qui en sont préparés
EP0477724A3 (en) * 1990-09-17 1993-07-14 Nippon Kayaku Kabushiki Kaisha Epoxy resin, epoxy resin composition and cured product thereof
EP0632078A1 (fr) * 1993-07-02 1995-01-04 Ciba-Geigy Ag Résines époxyacrylates
EP1295900A2 (fr) * 1993-07-02 2003-03-26 Vantico AG Utilisations d'époxy acrylates
EP1295900A3 (fr) * 1993-07-02 2004-01-28 Vantico AG Utilisations d'époxy acrylates

Also Published As

Publication number Publication date
CA1105193A (fr) 1981-07-14
GB1512814A (en) 1978-06-01
CH626643A5 (fr) 1981-11-30
IT1064921B (it) 1985-02-25
US4074008A (en) 1978-02-14
JPS5237996A (en) 1977-03-24
FR2320961B1 (fr) 1978-05-05
DE2635929A1 (de) 1977-03-03
NL7608979A (nl) 1977-02-15

Similar Documents

Publication Publication Date Title
FR2320961A1 (fr) Resines epoxydiques photopolymerisables
DK32176A (da) Fotopolymeriserbare materialer
FR2322897A1 (fr) Compositions photopolymerisables
AT356892B (de) Haertbare organopolysiloxanmasse
DK382476A (da) Reflektor
DK325176A (da) Aminopolyamid-akrylamid-glyoxal harpiks
DK149919C (da) Borenhed
BE837465A (nl) Ontwikkelversnellers
DK388676A (da) Hurtigt herdende materialer
BE837464A (nl) Ontwikkelversnellers
SE7613255L (sv) Byggnadsverk
FR2328581A1 (fr) Perfectionnement a la decalcomanie
BE846353A (fr) Resines uree-formaldehyde
IT1065156B (it) Riflettore cilindrico-ellittico
SE7613935L (sv) Substituerad triazoleter
DK318476A (da) Fotosensitive harpiksmaterialer
FR2318781A1 (fr) Bollard
BE837466A (nl) Ontwikkelversnellers
IT1057711B (it) Pagnetron a cavita riscnante
FR2299028A1 (fr) Nouvea
BE846148A (fr) Resines thermoplastiques ameliorees
FR2301243A1 (fr) Nouve
BE842563A (fr) Resines uree-formaldehyde ameliorees
FR2302321A1 (fr) Melanges durcissables a base de resines epoxydiques
JPS5186228A (ja) Hisashi

Legal Events

Date Code Title Description
ST Notification of lapse